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    Alteration for wafer inspection
    101.
    发明授权
    Alteration for wafer inspection 有权
    晶圆检查更改

    公开(公告)号：US08826200B2

    公开(公告)日：2014-09-02

    申请号：US13893267

    申请日：2013-05-13

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park ,  Ellis Chang

    IPC: G06F17/50

    CPC classification number: G06F17/5045 ,  G01N21/956 ,  G06F17/5081 ,  G06F2217/14

    Abstract: Methods and systems for binning defects on a wafer are provided. One method includes identifying areas in a design for a layer of a device being fabricated on a wafer that are not critical to yield of fabrication of the device and generating an altered design for the layer by eliminating features in the identified areas from the design for the layer. The method also includes binning defects detected on the layer into groups using the altered design such that features in the altered design proximate positions of the defects in each of the groups are at least similar.

    Abstract translation: 提供了一种用于对晶片上的缺陷进行合并的方法和系统。 一种方法包括识别在晶片上制造的器件层的设计领域，其对于制造器件的制造不是至关重要的，并且通过从该设计中消除所识别的区域中的特征，从而为该层产生改变的设计 层。 该方法还包括使用改变的设计将层上检测到的缺陷分组成组，使得每个组中的缺陷的改变设计中的特征至少相似。

    Detecting defects on a wafer
    103.
    发明授权
    Detecting defects on a wafer 有权
    检测晶圆上的缺陷

    公开(公告)号：US08605275B2

    公开(公告)日：2013-12-10

    申请号：US13193492

    申请日：2011-07-28

    Applicant: Lu Chen ,  Qiang Zhang

    Inventor： Lu Chen ,  Qiang Zhang

    IPC: G01N21/00

    CPC classification number: G01N21/9501 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes combining first image data and second image data, generated using different output generated using different values for focus of an inspection system, corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer and detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括组合第一图像数据和第二图像数据，所述第二图像数据使用针对检查系统的焦点生成的不同输出而生成的不同输出，对应于晶片上的基本上相同的位置，从而产生用于晶片的附加图像数据并检测晶片上的缺陷 使用附加的图像数据。

    Systems and methods for detecting defects on a wafer
    105.
    发明授权
    Systems and methods for detecting defects on a wafer 有权
    用于检测晶片缺陷的系统和方法

    公开(公告)号：US08467047B2

    公开(公告)日：2013-06-18

    申请号：US13541579

    申请日：2012-07-03

    Applicant: Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/00

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

    Methods and systems for classifying defects detected on a reticle
    107.
    发明授权
    Methods and systems for classifying defects detected on a reticle 有权
    用于对在掩模版上检测到的缺陷进行分类的方法和系统

    公开(公告)号：US08204297B1

    公开(公告)日：2012-06-19

    申请号：US12394752

    申请日：2009-02-27

    Applicant: Yalin Xiong ,  Carl Hess

    Inventor： Yalin Xiong ,  Carl Hess

    IPC: G06K9/00 ,  G01N21/00

    CPC classification number: G01N21/956 ,  G01N2021/95676 ,  G03F1/84

    Abstract: Methods and systems for classifying defects detected on a reticle are provided. One method includes determining an impact that a defect detected on a reticle will have on the performance of a device being fabricated on a wafer based on how at least a portion of the reticle prints or will print on the wafer. The defect is located in the portion of the reticle. The method also includes assigning a classification to the defect based on the impact.

    Abstract translation: 提供了用于分类在掩模版上检测到的缺陷的方法和系统。 一种方法包括基于如何至少一部分标线印刷或将在晶片上印刷，确定在掩模版上检测到的缺陷对于在晶片上制造的器件的性能的影响。 缺陷位于光罩的部分。 该方法还包括基于影响为缺陷分配分类。

    Methods and systems for determining a defect criticality index for defects on wafers
    108.
    发明授权
    Methods and systems for determining a defect criticality index for defects on wafers 有权
    用于确定晶片缺陷的缺陷临界指数的方法和系统

    公开(公告)号：US08139844B2

    公开(公告)日：2012-03-20

    申请号：US12102343

    申请日：2008-04-14

    Applicant: Chien-Huei (Adam) Chen ,  Yan Xiong ,  Jianxin Zhang ,  Ellis Chang ,  Tsung-Pao Fang

    Inventor： Chien-Huei (Adam) Chen ,  Yan Xiong ,  Jianxin Zhang ,  Ellis Chang ,  Tsung-Pao Fang

    IPC: G06K9/00

    CPC classification number: G01R31/318511 ,  G06T7/0004 ,  G06T2207/30148

    Abstract: Various methods and systems for determining a defect criticality index (DCI) for defects on wafers are provided. One computer-implemented method includes determining critical area information for a portion of a design for a wafer surrounding a defect detected on the wafer by an inspection system based on a location of the defect reported by the inspection system and a size of the defect reported by the inspection system. The method also includes determining a DCI for the defect based on the critical area information, a location of the defect with respect to the critical area information, and the reported size of the defect.

    Abstract translation: 提供了用于确定晶片缺陷的缺陷关键指数（DCI）的各种方法和系统。 一种计算机实现的方法包括：基于由检查系统报告的缺陷的位置以及由检测系统报告的缺陷的大小，通过检查系统确定围绕在晶片上检测到的缺陷的晶片的一部分设计的临界区域信息 检查系统。 该方法还包括基于关键区域信息，缺陷相对于关键区域信息的位置以及报告的缺陷大小来确定缺陷的DCI。

    Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects
    109.
    发明授权
    Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects 有权
    用于确定实际缺陷是潜在的系统缺陷还是潜在的随机缺陷的计算机实现的方法

    公开(公告)号：US07975245B2

    公开(公告)日：2011-07-05

    申请号：US12195024

    申请日：2008-08-20

    Applicant: Glenn Florence ,  Allen Park ,  Peter Rose

    Inventor： Glenn Florence ,  Allen Park ,  Peter Rose

    IPC: G06F17/50

    CPC classification number: G06F17/5081 ,  G01R31/318314 ,  G01R31/318371

    Abstract: Various computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects are provided. One computer-implemented method for determining if actual defects are potentially systematic defects or potentially random defects includes comparing a number of actual defects in a group to a number of randomly generated defects in a group. The actual defects are detected on a wafer. A portion of a design on the wafer proximate a location of each of the actual defects in the group and each of the randomly generated defects in the group is substantially the same. The method also includes determining if the actual defects in the group are potentially systematic defects or potentially random defects based on results of the comparing step.

    Abstract translation: 提供用于确定实际缺陷是潜在的系统缺陷或潜在的随机缺陷的各种计算机实现的方法。 用于确定实际缺陷是否是潜在的系统缺陷或潜在的随机缺陷的一种计算机实现的方法包括将组中的实际缺陷的数量与组中的随机生成的缺陷的数量进行比较。 在晶片上检测到实际的缺陷。 晶片上靠近组中每个实际缺陷的位置的每一个随机产生的缺陷中的部分设计基本相同。 该方法还包括基于比较步骤的结果确定组中的实际缺陷是潜在的系统缺陷还是潜在的随机缺陷。

    Computer-implemented methods, carrier media, and systems for stabilizing output acquired by an inspection system
    110.
    发明授权
    Computer-implemented methods, carrier media, and systems for stabilizing output acquired by an inspection system 有权
    计算机实现的方法，载体介质和用于稳定由检查系统获取的输出的系统

    公开(公告)号：US07774153B1

    公开(公告)日：2010-08-10

    申请号：US12049858

    申请日：2008-03-17

    Applicant: James A. Smith

    Inventor： James A. Smith

    IPC: G01D18/00

    CPC classification number: G06T5/002 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various computer-implemented methods, carrier media, and systems for stabilizing output acquired by an inspection system are provided. One computer-implemented method includes determining a characteristic of output acquired for a wafer by an inspection system using an inspection recipe. The method also includes comparing the characteristic to a reference characteristic. In addition, if the characteristic is above the reference characteristic, the method includes altering the output acquired for the wafer such that the characteristic of the altered output substantially matches the reference characteristic thereby stabilizing the output acquired for the wafer to the reference characteristic.

    Abstract translation: 提供各种计算机实现的方法，载体介质和用于稳定由检查系统获取的输出的系统。 一种计算机实现的方法包括通过使用检查配方的检查系统确定为晶片获取的输出的特性。 该方法还包括将特征与参考特征进行比较。 此外，如果特性高于参考特性，则该方法包括改变对于晶片获得的输出，使得改变的输出的特性基本上与参考特性相匹配，从而将获得的晶片的输出稳定为参考特性。

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