公开(公告)号：US5615822A

公开(公告)日：1997-04-01

申请号：US532281

申请日：1995-09-22

Applicant: Chiaki Takubo ,  Hiroshi Tazawa ,  Eiichi Hosomi ,  Koji Shibasaki

Inventor： Chiaki Takubo ,  Hiroshi Tazawa ,  Eiichi Hosomi ,  Koji Shibasaki

IPC: B23K1/00 ,  H01L21/60 ,  H01L21/603

CPC classification number: H01L24/86 ,  B23K1/0016 ,  B23K2201/36 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01082 ,  H01L2924/12042

Abstract: In this invention, a designed value of a lead width is previously input and a bonding load suitable for the designed lead width is previously input before the step of continuously bonding a TAB tape on a semiconductor chip is effected. Next, the TAB tape and chip are carried to preset positions, and after recognition of the positions of the tape and chip and the alignment of the tape and chip by use of a CCD camera are completed, the inner lead width is actually measured by use of the CCD camera. The measured lead width is compared with the designed lead width, and when a difference therebetween exceeds a preset reference value, the bonding load is changed to a bonding load suitable for the measured lead width of the lead to be actually bonded based on the ratio of the measured lead width to the designed lead width and then the bonding operation is effected by the suitable bonding load.

Abstract translation: 在本发明中，预先输入引线宽度的设计值，并且在进行连续接合半导体芯片上的TAB带的步骤之前，预先输入适合于设计的引线宽度的接合负载。 接下来，TAB带和芯片被携带到预设位置，并且在识别到带和芯片的位置以及通过使用CCD照相机的带和芯片的对准完成之后，实际上通过使用测量内引线宽度 的CCD相机。 将测量的引线宽度与设计的引线宽度进行比较，并且当它们之间的差异超过预设的参考值时，将接合负载改变为适合实际接合的引线的测量引线宽度的接合负载， 测量的引线宽度与设计的引线宽度，然后结合操作由适当的焊接负载来实现。

公开(公告)号：US5476208A

公开(公告)日：1995-12-19

申请号：US148303

申请日：1993-11-08

Applicant: Neil G. Fiddes ,  Christopher G. King ,  Anthony Mantone ,  Frank D. Shaffer

Inventor： Neil G. Fiddes ,  Christopher G. King ,  Anthony Mantone ,  Frank D. Shaffer

IPC: B23K20/10 ,  B23K37/04

CPC classification number: B23K20/10 ,  B23K2201/36 ,  Y10T29/49014

Abstract: Method for forming welded joints on superconducting foils to form long lengths of foil for use in superconducting magnet tapes including fixturing for controlling the accurate positioning of sheared foils and control of the overlap to be welded.

Abstract translation: 在超导箔上形成焊接接头的方法，以形成用于超导磁体带的长条箔，包括用于控制剪切箔的精确定位的夹具和控制待焊接的重叠。

公开(公告)号：US5439160A

公开(公告)日：1995-08-08

申请号：US40809

申请日：1993-03-31

Applicant: Angelo R. Marcantonio

Inventor： Angelo R. Marcantonio

IPC: B23K1/008 ,  G05D23/19 ,  H05K3/34 ,  B23K1/00

CPC classification number: G05D23/1917 ,  B23K1/008 ,  H05K3/3494 ,  B23K2201/30 ,  B23K2201/36 ,  B23K2201/42 ,  H05K2203/163

Abstract: An artificial neural network is trained to recognize inputted thermal and physical features of a printed circuit board, for providing settings for a reflow oven for obtaining acceptable soldering of the printed circuit board.

Abstract translation: 训练人造神经网络以识别印刷电路板的输入热和物理特征，以提供回流炉的设置，以获得印刷电路板的可接受的焊接。

公开(公告)号：US5356066A

公开(公告)日：1994-10-18

申请号：US93683

申请日：1993-07-20

Applicant: Osamu Yamada

Inventor： Osamu Yamada

IPC: B23K1/008 ,  B23K101/42 ,  H05K3/34 ,  B23K37/00

CPC classification number: B23K1/008 ,  B23K2201/36

Abstract: An automatic soldering apparatus for soldering a printed circuit board having a plurality of electronic parts mounted thereon to be soldered while it is transported through a heating chamber having an inert gas fill therein is provided. The apparatus has a first station provided with a first opening for receiving the printed circuit board into the heating chamber and a second station provided with a second opening for removing the soldered printed circuit board from the heating chamber. Further, the apparatus has a supply of an inert gas and nozzles provided in the first and second stations. The inert gas is jetted through the nozzles toward the first and second openings, when required, so as to prevent outside air from flowing into the heating chamber.

Abstract translation: 提供了一种用于焊接其上安装有待焊接的多个电子部件的印刷电路板的自动焊接装置，同时通过其中具有惰性气体填充的加热室传送。 该设备具有第一站，该第一站设置有用于将印刷电路板接收到加热室中的第一开口，以及设置有用于从加热室移除焊接的印刷电路板的第二开口的第二站。 此外，该装置具有设置在第一和第二站中的惰性气体和喷嘴的供应。 当需要时，惰性气体通过喷嘴朝向第一和第二开口喷射，以防止外部空气流入加热室。

公开(公告)号：US5343015A

公开(公告)日：1994-08-30

申请号：US972336

申请日：1992-11-06

Applicant: Jerry E. Ryan

Inventor： Jerry E. Ryan

IPC: B23K26/30 ,  B73K26/00

CPC classification number: B23K26/302 ,  B23K2201/06 ,  B23K2201/36 ,  B23K2203/14 ,  Y10T29/53113

Abstract: A laser beam is directed toward a rotating metallic tube having a fin helically wound about and welded to its surface by a high frequency welding process. The laser beam generates heat in the tube to supplement the heat induced by resistance to electrical current flow to create a proper temperature in the tube for forge welding of the fin and tube.

Abstract translation: 激光束被引向旋转的金属管，该金属管具有通过高频焊接工艺螺旋缠绕并焊接到其表​​面的翅片。 激光束在管中产生热量以补充由电流流动阻力引起的热量，以在管中形成适当的温度，用于对翅片和管进行锻造焊接。

公开(公告)号：US5335843A

公开(公告)日：1994-08-09

申请号：US135592

申请日：1993-10-13

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/08 ,  H05K3/34 ,  B23K1/00 ,  B23K3/00

CPC classification number: B23K1/085 ,  B23K2201/36 ,  H05K3/3447 ,  H05K3/3468

Abstract: A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junction dipped into the container. The meniscus on the liquid solder in the container establishes a consistent level enabling a mechanized process to dip the junctions the same depth each time. Between dips the container is refilled. The size of the container limits the exposure of other adjacent devices to the heat of the solder and also provides a limited quantity of solder to the junction thus providing a consistent soldered connection.

Abstract translation: 用于焊接难以到达结的焊接工艺和设备。 刚刚足够大以容纳接头的小容器被填充以从一盆液体焊料溢出。 一旦填充，焊料的流动被终止，并且连接处浸入容器中。 容器中液体焊料上的弯月面建立了一致的水平，使得机械化过程能够每次将接合点浸入相同的深度。 在蘸水之间，容器被再填充。 容器的尺寸限制了其他相邻装置暴露于焊料的热量，并且还将一定量的焊料提供给结，从而提供一致的焊接连接。

公开(公告)号：US5328521A

公开(公告)日：1994-07-12

申请号：US28482

申请日：1993-03-08

Applicant: Roupen L. Keusseyan

Inventor： Roupen L. Keusseyan

IPC: B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/26 ,  B23K35/268 ,  B23K2201/36 ,  B23K35/262 ,  H05K2201/0272 ,  H05K3/3463

Abstract: A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.

Abstract translation: 一种焊膏组合物，其包含（a）4-96重量％的细分散的共晶或假共晶金属合金或混合物的颗粒; （b）96​​-4％（重量）由（a）中的金属合金构成的金属添加剂的纯金属，其混合物或合金的熔点至少为30℃的细碎颗粒; 和（c）有机介质。 该浆料特别适用于将金属化部件表面安装在微电子封装中的金属化基板上。

公开(公告)号：US5169057A

公开(公告)日：1992-12-08

申请号：US767744

申请日：1991-09-30

Applicant: Robert J. Blacka ,  Francis J. Verderame

Inventor： Robert J. Blacka ,  Francis J. Verderame

IPC: B23K1/20 ,  B24C1/04 ,  H05K3/22 ,  H05K3/34

CPC classification number: B24C1/086 ,  B23K1/206 ,  B24C1/04 ,  B23K2201/36 ,  H05K3/22 ,  H05K3/341

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

Abstract translation: 提供了一种用于使用含锡焊料焊接到镀金的衬底表面上的方法，其中镀金表面的选定部分通过用高速精细的含镍磨料颗粒流冲击来处理，以从处理过的 然后通过常规的焊接技术实现与处理过的表面的接合。

公开(公告)号：US5052155A

公开(公告)日：1991-10-01

申请号：US391817

申请日：1989-08-10

Applicant: Robert J. Blacka ,  Francis J. Verderame

Inventor： Robert J. Blacka ,  Francis J. Verderame

IPC: B23K1/20 ,  B24C1/04 ,  H05K3/22 ,  H05K3/34

CPC classification number: B24C3/322 ,  B23K1/206 ,  B24C1/04 ,  B24C1/086 ,  B23K2201/36 ,  H05K3/22 ,  H05K3/341

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

Abstract translation: 提供了一种用于使用含锡焊料焊接到镀金的衬底表面上的方法，其中镀金表面的选定部分通过用高速精细的含镍磨料颗粒流冲击来处理，以从处理过的 然后通过常规的焊接技术实现与处理过的表面的接合。

公开(公告)号：US4015097A

公开(公告)日：1977-03-29

申请号：US579545

申请日：1975-05-21

Applicant: Manfred Schmeisser

Inventor： Manfred Schmeisser

IPC: H01H1/06 ,  B23K1/20 ,  H01H11/04

CPC classification number: H01H11/043 ,  B23K1/20 ,  B23K2201/36

Abstract: An electrical contact for an electric switching apparatus which includes a contact carrier and contact overlay soldered to one of the surfaces of the carrier. The improvement of the invention comprises at least one longitudinal slot disposed in the contact along the arc travel direction thereof which forms a blind hole in the contact open at the end thereof along the arc travel direction.

Abstract translation: 一种用于电气开关设备的电接触件，其包括焊接到所述载体的一个表面的接触载体和接触覆盖层。 本发明的改进包括沿着其电弧行进方向设置在接触件中的至少一个纵向狭槽，其沿着电弧移动方向在其端部处在接触开口处形成盲孔。