Polymer Composition for Use in an Electronic Device

    公开(公告)号:US20240336846A1

    公开(公告)日:2024-10-10

    申请号:US18617712

    申请日:2024-03-27

    申请人: Ticona LLC

    发明人: Young Shin Kim

    IPC分类号: C09K19/38 C09K19/52 H01B3/42

    摘要: A polymer composition is disclosed that comprises carbon particles, a dielectric filler, and a polymer matrix containing at least one thermotropic liquid crystalline polymer is provided. The polymer composition exhibits a dissipation factor of about 0.02 or less as determined at a frequency of 5 GHz, a dielectric constant of about 8.5 or more as determined at a frequency of 5 GHz.

    MOLDED ARTICLE, INSULATING MATERIAL COMPRISING SAME, AND METHOD FOR IMPROVING ELECTRICAL-INSULATING PROPERTY OF POLYESTER RESIN COMPOSITION
    110.
    发明申请
    MOLDED ARTICLE, INSULATING MATERIAL COMPRISING SAME, AND METHOD FOR IMPROVING ELECTRICAL-INSULATING PROPERTY OF POLYESTER RESIN COMPOSITION 审中-公开
    模制品,包含其的绝缘材料以及改进聚酯树脂组合物的电绝缘性能的方法

    公开(公告)号:US20160115298A1

    公开(公告)日:2016-04-28

    申请号:US14891593

    申请日:2014-05-15

    申请人: ADEKA CORPORATION

    IPC分类号: C08K5/47 H01B3/42

    摘要: Provided are: a molded article which can be suitably used in electrical/electronic components and has excellent fogging resistance and electrical insulating properties; an insulating material comprising the same; and a method of improving the electrical insulating properties of a polyester resin composition.The molded article is obtained by molding a polyester resin composition comprising 0.001 to 1.0 part by mass of a sulfonamide compound metal salt or a sulfonimide compound metal salt with respect to 100 parts by mass of a polyester resin comprising not less than 50% by mass of a polybutylene terephthalate.

    摘要翻译: 提供:可以适用于电气/电子元件的模制品,具有优异的防雾性和电绝缘性; 包含该绝缘材料的绝缘材料; 以及提高聚酯树脂组合物的电绝缘性的方法。 成型体的成型方法是将相对于100质量份的含有不小于50质量%的聚酯树脂的聚酯树脂,包含0.001〜1.0质量份的磺酰胺化合物金属盐或磺酰亚胺化合物金属盐, 聚对苯二甲酸丁二醇酯。