利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

48 条记录 (耗时 0.014 秒)

    Thermoplastic Compositions Containing Nanoscale-Sized Particle Additives For Laser Direct Structuring And Methods For The Manufacture And Use Thereof
    2.
    发明申请
    Thermoplastic Compositions Containing Nanoscale-Sized Particle Additives For Laser Direct Structuring And Methods For The Manufacture And Use Thereof 审中-公开
    包含激光直接结构的纳米尺寸粒子添加剂的热塑性组合物及其制造和使用方法

    公开(公告)号：US20140206800A1

    公开(公告)日：2014-07-24

    申请号：US14160168

    申请日：2014-01-21

    申请人： SABIC INNOVATIVE PLASTICS IP B.V.

    发明人： Tong Wu ,  Yunan Cheng ,  Yangang Yan

    IPC分类号： H01B3/42 ,  H01B3/30

    CPC分类号： H01B3/426 ,  C08K3/013 ,  C08K3/34 ,  C08K5/523 ,  C08K5/5399 ,  C08K9/02 ,  C08L55/02 ,  C08L69/00 ,  C08L77/02 ,  C08L77/06 ,  C08L83/10 ,  H01B3/303

    摘要： This invention relates generally to a thermoplastic compositions and, more particularly, to compositions comprising a polymer matrix and comprising a filler composition. To that end, according to the aspects of the invention, a thermoplastic composition is disclosed that generally comprises a polymer matrix and at least one filler composition. The polymer matrix generally comprises at least one polycarbonate or polyamide. The filler composition generally comprises at least one laser direct structuring additive with a mean particle size of less than 1 μm and may additionally optionally comprise flame retardants, stabilizers and process aids.

    摘要翻译： 本发明一般涉及热塑性组合物，更具体地说，涉及包含聚合物基质并包含填料组合物的组合物。 为此，根据本发明的方面，公开了通常包含聚合物基质和至少一种填料组合物的热塑性组合物。 聚合物基质通常包含至少一种聚碳酸酯或聚酰胺。 填料组合物通常包含至少一种平均粒度小于1μm的激光直接结构化添加剂，并且还可任选地包含阻燃剂，稳定剂和加工助剂。

    Apparatus for manufacture of an insulated microwire
    3.
    发明授权
    Apparatus for manufacture of an insulated microwire 有权
    用于制造绝缘微丝的装置

    公开(公告)号：US07926171B2

    公开(公告)日：2011-04-19

    申请号：US12384466

    申请日：2009-04-06

    申请人： Willorage Rathna Perera ,  Gerald J. Mauretti

    发明人： Willorage Rathna Perera ,  Gerald J. Mauretti

    IPC分类号： B23P19/00

    CPC分类号： D01D5/34 ,  D01F8/00 ,  H01B1/02 ,  H01B3/423 ,  H01B3/426 ,  Y10T29/532 ,  Y10T428/2929

    摘要： Insulated electrically conductive continuous fibers or microwires of sizes on the order of 1 mil (25 microns) diameter, so as to be suitable for processing into yarns or multi-microwire bundles, for example, for incorporation into conformable fabric products or for use as wearable electronic circuitry are made by coprocessing a core of a lower-melting-point metal within a sheath of a higher-melting-point polymer.

    摘要翻译： 尺寸为1密耳（25微米）直径的绝缘导电连续纤维或微线，以便适合于加工成纱线或多微丝束，例如用于并入适合的织物产品或用作可穿戴的 电子电路通过在较高熔点聚合物的鞘内共处理低熔点金属的芯制成。

    Insulated wire
    4.
    发明授权
    Insulated wire 失效
    绝缘电线

    公开(公告)号：US6066806A

    公开(公告)日：2000-05-23

    申请号：US914651

    申请日：1997-08-19

    申请人： Atsushi Higashiura ,  Isamu Kobayashi ,  Naoyuki Chida

    发明人： Atsushi Higashiura ,  Isamu Kobayashi ,  Naoyuki Chida

    IPC分类号： H01B3/30 ,  H01B3/42 ,  H01B7/00

    CPC分类号： H01B3/305 ,  H01B3/301 ,  H01B3/306 ,  H01B3/426 ,  H01B3/427 ,  B29C47/027

    摘要： There is disclosed an insulated wire having an extrusion-coating insulating layer provided on the outer surface of a conductor directly or via some other layer, or provided on the peripheral surface of a multicore wire composed of conductor cores or insulated cores that are collected together, wherein the extrusion-coating insulating layer is made of a resin mixture to be extrusion-coated, which comprises 100 parts by weight of a resin (A) comprising a polyethersulfone resin, as an essential component, and, optionally, a polyetherimide resin, and 10 to 100 parts by weight of a resin (B) comprising at least one resin selected from polycarbonate resins, polyarylate resins, polyester resins, and polyamide resins. According to the insulated wire whose insulating layer is formed by the extrusion coating method, its direct solderability is excellent, and at least its heat resistance is better than that of conventional polyester-series resins, and by some blending proportions of the resin mixture, the insulated wire results in heat resistance that easily satisfies at least Heat Resistance Class B stipulated by IEC standard Pub. 172.

    摘要翻译： 公开了一种绝缘电线，其具有直接或经由一些其它层设置在导体的外表面上的挤出涂覆绝缘层，或者设置在由聚集在一起的导体芯或绝缘芯组成的多芯线的外围表面上， 其中，所述挤出涂布绝缘层由待挤出涂布的树脂混合物制成，其包含100重量份的包含聚醚砜树脂的树脂（A）作为必要组分，和任选的聚醚酰亚胺树脂，以及 10至100重量份的包含至少一种选自聚碳酸酯树脂，聚芳酯树脂，聚酯树脂和聚酰胺树脂的树脂的树脂（B）。 根据通过挤出涂布法形成绝缘层的绝缘线，其直接可焊性优异，至少其耐热性优于常规聚酯系树脂，并且通过树脂混合物的一些混合比例， 绝缘线导致耐热性，其至少能够容易地满足IEC标准公布规定的耐热等级B。 172。

    FLAME RETARDANT POLYALKYLENE TEREPHTHALATE COMPOSITION
    8.
    发明申请
    FLAME RETARDANT POLYALKYLENE TEREPHTHALATE COMPOSITION 审中-公开
    阻燃聚对苯二甲酸乙二醇酯组合物

    公开(公告)号：US20170002195A1

    公开(公告)日：2017-01-05

    申请号：US15117558

    申请日：2015-01-26

    申请人： SABIC Global Technologies B.V.

    发明人： Zhenke Wei ,  Hongtao Shi ,  Dake Shen ,  Yegang Lin

    IPC分类号： C08L67/02 ,  H01B3/42

    CPC分类号： C08L67/02 ,  C08K3/26 ,  C08K3/346 ,  C08K5/0058 ,  C08K5/0066 ,  C08K5/523 ,  H01B3/426 ,  C08K3/016

    摘要： Disclosed herein are flame retardant polyalkylene terephthalate compositions that employ reduced amounts of organo-halide as flame retardants (FR), wherein the composition comprises: (a) a polyalkylene terephthalate; (b) an organo-bromo flame retardant (FR) agent; (c) an antimony synergist; (d) an organo phosphate ester phosphorous flame retardant compound; (e) talc; and (f) sodium or potassium carbonate. In addition to being characterized by the presence of a phosphorous containing flame retardant compound and sodium or potassium carbonate, the compositions of the present inventions contain reduced amounts of organo-bromo FR agent and/or antimony FR synergist and have excellent flame retardant properties.

    摘要翻译： 本文公开了使用减少量的有机卤化物作为阻燃剂（FR）的阻燃聚对苯二甲酸亚烷基酯组合物，其中所述组合物包含：（a）聚对苯二甲酸亚烷基酯; （b）有机溴阻燃剂（FR）; （c）锑增效剂; （d）有机磷酸酯磷阻燃化合物; （e）滑石; 和（f）碳酸钠或碳酸钾。 除了含有含磷阻燃化合物和碳酸钠或碳酸钾的存在之外，本发明的组合物还含有少量的有机溴FR和/或锑FR增效剂，并且具有优异的阻燃性能。

    TRANSPARENT CONDUCTIVE FILM
    9.
    发明申请
    TRANSPARENT CONDUCTIVE FILM 审中-公开
    透明导电膜

    公开(公告)号：US20160160345A1

    公开(公告)日：2016-06-09

    申请号：US14908855

    申请日：2015-05-15

    申请人： NITTO DENKO CORPORATION

    发明人： Kodai MIYAMOTO ,  Kazuaki SASA ,  Hironobu MACHINAGA ,  Eri UEDA ,  Manami KUROSE ,  Tomotake NASHIKI

    IPC分类号： C23C14/58 ,  H01B3/42 ,  H01B1/02 ,  C23C14/08 ,  C23C14/35

    CPC分类号： C23C14/58 ,  B32B7/02 ,  B32B9/00 ,  C23C14/08 ,  C23C14/086 ,  C23C14/35 ,  C23C14/5806 ,  H01B1/02 ,  H01B3/426 ,  H01B3/427 ,  H01L31/022466

    摘要： Provided is a transparent conductive film that can drastically improving an electrical characteristic of a transparent conductive layer after crystallizing process with resped to the transparent conductive layer before the crystallizing process and can achieve a lower resistivity.The transparent conductive film (1) is provided with a film substrate (2) and a crystalline transparent conductive layer (3) formed on one of the main surfaces (2a) of the said substrate. The amorphous transparent conductive layer before the crystallizing process has a carrier density na×1019 of (10 to 60)×1019/cm3 and Hall mobility μa of 10 to 25 cm2/V·s, the crystalline transparent conductive layer after the crystallizing process has a carrier density nc×1019 of (80 to 150)×1019/cm3 and Hall mobility t of 20 to 40 cm2/V·s, and the length of motion L defined by {(nc−na)2+(μc−μa)2}1/2 is 50 to 150.

    摘要翻译： 提供一种透明导电膜，其可以在结晶处理之前，在透明导电层之后，在结晶处理之后，可以显着地改善透明导电层的电特性，并可以实现较低的电阻率。 透明导电膜（1）设置有形成在所述基板的一个主表面（2a）上的薄膜基板（2）和结晶透明导电层（3）。 结晶处理前的非晶透明导电层的（10〜60）×1019 / cm 3的载流子密度na×1019，10〜25cm2 / V·s的霍尔迁移率μa，结晶化后的结晶透明导电层具有 （80〜150）×1019 / cm 3的载流子密度nc×1019，20〜40cm2 / V·s的霍尔迁移率t和由{（nc-na）2+（μc-μa） ）2} 1/2为50〜150。