Abstract:
The present invention may provide a surge protection device, which may include a reference node, first, second, and third nodes, a first arcing section (GAP) coupled between the first and second nodes, and configured to receive a surge voltage from the first node, a first metal oxide varistor (MOV) coupled between the second and reference nodes, and configured to reduce the surge voltage to a first sub-surge voltage at the second node, a second arcing section (GAP) coupled between the second and third nodes, and configured to receive the first sub-surge voltage from the second node, and a second metal oxide varistor (MOV) coupled between the third and reference nodes, and configured to reduce the first sub-surge voltage to a second sub-surge voltage at the third node.
Abstract:
A solid-core surge arrester includes a module assembly. The module assembly includes at least one metal oxide varistor (MOV) disk with an outer circumferential surface, and a material applied to the outer circumferential surface. The material includes multiple layers to allow the module assembly to withstand a bending moment under an approximately continuously applied load, and the material is configured to allow venting of gas that forms in the module assembly in a preferential direction.
Abstract:
The instant pulse filter according to the present invention, which may cause a malfunction or a short life span of a semiconductor device, is made using an aluminum anodic oxidation, comprising—a first step for forming an aluminum thin film layer on an upper side of an insulator substrate; a second step for forming an aluminum oxide thin film layer having a pore by oxidizing the aluminum thin film layer by means of an anodic oxidation; a third step for depositing a metallic material on an upper side of the aluminum thin film layer for filling the pore; a fourth step for forming a nano rod in the interior of the aluminum oxide thin film layer by eliminating the metallic material deposited except in the pore; a fifth step for forming an internal electrode on an upper side of the aluminum oxide thin film layer having the nano rod; a sixth step for forming a protective film layer on an upper side of the same in order to protect the aluminum oxide thin film layer and the internal electrode from the external environment; and a seventh step for forming an external electrode on both sides of the substrate in which the protective film layer is formed.
Abstract:
An electronic device is provided that includes an electronic component or passive components; an electrically conductive circuit coupled to the electronic component; and a protection device coupled to the circuit. The protection device is operable to route a voltage or current away from the electronic component if the voltage or the current applied to the circuit is above a determined threshold voltage or determined threshold current.
Abstract:
A varistor having a favorable heat-dissipating property is provided.In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.
Abstract:
An overvoltage device that is formed from a MOV device that is coupled in parallel with a spark gap. This device is coupled upstream from electronic components to protect these components from damage. For example, in one embodiment, the overvoltage device is coupled to a fault circuit interrupter such as a GFCI, across the phase and neutral lines to protect components of the GFCI from an overvoltage condition. In one embodiment the overvoltage device is formed as an MOV physically coupled to a spark gap wherein the MOV and the spark gap are electrically coupled across the phase line and the neutral line in parallel.
Abstract:
A thermally protected metal oxide varistor having a pin-type disengaging mechanism includes a varistor body having two metal electrodes coated thereon, an insulating layer enclosing the varistor, a first lead, a second lead, a third lead, a solder, and an elastic member. The first lead and the third lead are coupled to the varistor body. The solder is disposed at an electrical connection point of the varistor body. The elastic member is fixed at an outside of the insulating layer. The second lead includes a connection pin. The connection pin extends through the elastic member and is fixed by the solder to the electrical connection point. When an over-voltage occurs, temperature of the varistor body is raised to melt the solder. A restoring force provided by the elastic member disconnects the second lead from the electrical connection point of the varistor body.
Abstract:
Metal oxide varistors (MOVs) are employed in surge protection devices, such as overvoltage protection devices, between signal lines and ground to reduce the capacitance and the capacitive imbalance introduced by the overvoltage protector, thereby improving higher frequency transmissions, such as xDSL communications, over a twisted-pair telecommunications network. The MOVs can be stacked electrically in series to reduce the capacitance of each MOV and to reduce the variability, tolerance or spread of the capacitance between MOVs. Asymmetrical MOVs with electrodes having different surface areas can also be used to reduce capacitance and to reduce capacitive imbalance between MOVs. Furthermore, Asymmetrical MOVs, as well as MOVs with electrodes having the same surface area, can be stacked electrically in series. Such series stacked, asymmetrical, and series stacked asymmetrical MOVs can be used in parallel with a gas discharge tube to form, for example, a station protector for use at a customer premises.
Abstract:
The manufacturing method for an electroceramic component (1), for example a varistor (1), comprises a laser irradiation of a part (5; 6) of the surface of an electroceramic body (2) before a metallization (3; 4) is applied to the part (5; 6) of the surface. By means of the laser irradiation it is possible to produce a micro-roughness and/or a chemical modification of the surface which permits good adhesion of the metallization, and it is possible to reduce or eliminate areas of unevenness or waviness of that part (5; 6) of the surface of the electroceramic body (2) which is to be metallized. In addition, improved transverse conductivity can be produced, by virtue of which a low contact resistance and a very homogeneous current distribution is achieved, in particular near to the metallization (3; 4). In addition it is possible to remove residues which originate in particular from a sinter support or from the application of a passivation layer. After the laser irradiation, the electroceramic body advantageously has a border (9) which adjoins the part (5; 6) of the surface and which is not laser-irradiated. The laser beam can advantageously be pulsed and focused.
Abstract:
A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.