ELECTRONIC DEVICE AND ASSOCIATED METHOD
    3.
    发明申请
    ELECTRONIC DEVICE AND ASSOCIATED METHOD 审中-公开
    电子设备及相关方法

    公开(公告)号:US20100157492A1

    公开(公告)日:2010-06-24

    申请号:US12342095

    申请日:2008-12-23

    申请人: Daniel Qi Tan

    发明人: Daniel Qi Tan

    IPC分类号: H01C7/10 H02H9/04 H05K1/18

    摘要: An electronic device is provided that includes an electronic component or passive components; an electrically conductive circuit coupled to the electronic component; and a protection device coupled to the circuit. The protection device is operable to route a voltage or current away from the electronic component if the voltage or the current applied to the circuit is above a determined threshold voltage or determined threshold current.

    摘要翻译: 提供一种电子装置,其包括电子部件或无源部件; 耦合到所述电子部件的导电电路; 以及耦合到该电路的保护装置。 如果施加到电路的电压或电流高于确定的阈值电压或确定的阈值电流,则保护装置可操作以将电压或电流远离电子部件。

    HIGH TEMPERATURE POLYMER COMPOSITES AND METHODS OF MAKING THE SAME
    5.
    发明申请
    HIGH TEMPERATURE POLYMER COMPOSITES AND METHODS OF MAKING THE SAME 失效
    高温聚合物复合材料及其制备方法

    公开(公告)号:US20090312474A1

    公开(公告)日:2009-12-17

    申请号:US12137564

    申请日:2008-06-12

    IPC分类号: C08G73/10 C08K3/34 C08K3/18

    摘要: A composition comprises a modified polymeric material and a ceramic antiferroelectric particle. The modified polymeric material comprises a high temperature polymer chemically combined with a polar group. A method of making a composition comprises chemically combining a high temperature polymer with a polar group to form a modified polymeric material; and combining the modified polymeric material with antiferroelectric particles to form a composite composition.

    摘要翻译: 组合物包含改性聚合物材料和陶瓷反铁电粒子。 改性聚合物材料包括与极性基团化学结合的高温聚合物。 制备组合物的方法包括将高温聚合物与极性基团化学组合以形成改性聚合物材料; 并将改性聚合材料与反铁电颗粒结合以形成复合组合物。

    ELECTROMAGNETIC INTERFERENCE SHIELDING POLYMER COMPOSITES AND METHODS OF MANUFACTURE
    9.
    发明申请
    ELECTROMAGNETIC INTERFERENCE SHIELDING POLYMER COMPOSITES AND METHODS OF MANUFACTURE 有权
    电磁干扰屏蔽聚合物复合材料及其制造方法

    公开(公告)号:US20090101873A1

    公开(公告)日:2009-04-23

    申请号:US11863831

    申请日:2007-10-18

    IPC分类号: H01B1/22

    CPC分类号: H05K9/0083

    摘要: An electromagnetic interference shielding composite is provided. The electromagnetic interference shielding composite comprises: a high permittivity polymer having a permittivity of at least about 5; a plurality of magnetic particles dispersed within the high permittivity polymer; and a plurality of dielectric particles dispersed within the high permittivity polymer. In another embodiment, an article comprising a device susceptible to electromagnetic radiation and a shielding material disposed to shield the device from electromagnetic radiation is provided. The shielding material comprises, a high permittivity polymer; a plurality of magnetic particles dispersed within the high permittivity polymer; and plurality of dielectric particles dispersed within the high permittivity polymer.

    摘要翻译: 提供电磁干扰屏蔽复合材料。 电磁干扰屏蔽复合材料包括:介电常数至少约为5的高介电常数聚合物; 分散在高介电常数聚合物内的多个磁性颗粒; 以及分散在高介电常数聚合物内的多个介电粒子。 在另一个实施例中,提供一种包含易受电磁辐射影响的装置的物品和设置成屏蔽该装置免受电磁辐射的屏蔽材料。 屏蔽材料包括高介电常数聚合物; 分散在高介电常数聚合物内的多个磁性颗粒; 以及分散在高介电常数聚合物内的多个介电颗粒。