Abstract:
There is provided with a modification method. Ultraviolet rays are irradiated on part of a surface of a resin article, so as to selectively modify the part of the surface of the resin article such that an electroless plating layer will be deposited. The ultraviolet rays are irradiated such that an interference pattern by the ultraviolet rays is formed on the surface of the resin article.
Abstract:
In an image sensor unit including a plurality of sensor chips mounted in a line on a sensor substrate, image signals from the sensor chips are sequentially read according to a reading order among the sensor chips, a current consumption circuit that consumes set current is arranged, and the current consumption circuit starts consuming the set current in response to a signal indicating end of reading of the image signals by all of the sensor chips and ends consuming the set current in response to a signal indicating start of reading of the image signals first by the sensor chip after a start signal to thereby reduce variation in the current consumption of the image sensor unit.
Abstract:
There is provided with a method of manufacturing an electrostatic adsorptive belt. A portion for forming an electrode pattern on a first resin layer is irradiated with an ultraviolet laser beam. A region including the portion for forming the electrode pattern on the first resin layer is oxidated. The electrode pattern if formed on the first region layer by plating. A second resin layer is formed on a surface of the first resin layer on which the electrode pattern is formed.
Abstract:
An illumination apparatus includes: a rod-like light guide member that directs light emitted from a first light source and a second light source from an emission surface to an illuminated body while propagating the light by reflection surfaces; and a light blocking member including a second surrounding portion slidably covering another end of the light guide member, wherein the second surrounding portion includes: a light blocking portion protruding toward one end of the light guide member and covering the emission surface of the light guide member; and a cut-out portion adjacent to the light blocking portion and exposing the reflection surface of the light guide member.
Abstract:
There is provided with an article with a plated layer. The article has a heat-shrinking resin that has been heat shrunk. The article also has a modified part formed on a surface of the heat-shrinking resin. The modified part is formed so that the plated layer precipitates. The article also has a plated layer formed on the modified part.
Abstract:
A plurality of edges of sensor substrates are connected in a longitudinal direction in a sensor substrate unit. Farthest tips of sensor chips at the edges of the sensor substrates are positioned inside of farthest edges of the edges in the longitudinal direction. The edges of the connected sensor substrates overlap each other in a thickness direction of the sensor substrates in plan view.
Abstract:
Provided is an antenna unit performing at least one of transmission and reception of data, the antenna unit including: a resin substrate including projections and recesses formed parallel to and adjacent to each other on an upper surface; and an antenna conductor continuously formed to meander in one direction along top portions of the projections and bottom portions of the recesses.
Abstract:
An image sensor unit includes: a plurality of light sources each including an LED chip; a plurality of light guides that are arranged in parallel to face incident surfaces on one side in a longitudinal direction for each of the plurality of light sources and that guide light from the plurality of light sources to a bill; an image sensor that converts light from the bill to an electric signal; a sensor substrate for mounting the image sensor; and a circuit board that is provided with the plurality of light sources on a same mounting surface and that is arranged on the sensor substrate on one side in the longitudinal direction of the plurality of light guides, wherein the sensor substrate includes a connection hole on one side in the longitudinal direction of the sensor substrate, and the circuit board is connected to the sensor substrate by connecting a connecting portion including a plurality of external connection pads to the connection hole.
Abstract:
There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.
Abstract:
An image sensor unit includes a sensor substrate on which a plurality of photoelectric conversion elements are mounted, a light source that includes light-emitting elements, for illuminating a document, a light guide that guides light from the light source from one end face and linearly illuminates the document, a rod lens array imaging reflected light from the document on the sensor substrate, and a frame holding each of these elements. The frame includes a spacer provided in proximity to the light source. The spacer includes a light shielding that covers the light source and a portion of the light guide.