METHOD OF MANUFACTURING SELF-ORDERED NANOCHANNEL-ARRAY AND METHOD OF MANUFACTURING NANODOT USING THE NANOCHANNEL-ARRAY
    112.
    发明申请
    METHOD OF MANUFACTURING SELF-ORDERED NANOCHANNEL-ARRAY AND METHOD OF MANUFACTURING NANODOT USING THE NANOCHANNEL-ARRAY 有权
    自制纳米管阵列的制造方法及使用纳米通道阵列制造纳米光的方法

    公开(公告)号:US20070207619A1

    公开(公告)日:2007-09-06

    申请号:US10819143

    申请日:2004-04-07

    Abstract: A method of manufacturing a nanochannel-array and a method of fabricating a nanodot using the nanochannel-array are provided. The nanochannel-array manufacturing method includes: performing first anodizing to form a first alumina layer having a channel array formed by a plurality of cavities on an aluminum substrate; etching the first alumina layer to a predetermined depth and forming a plurality of concave portions on the aluminum substrate, wherein each concave portion corresponds to the bottom of each channel of the first alumina layer; and performing second anodizing to form a second alumina layer having an array of a plurality of channels corresponding to the plurality of concave portions on the aluminum substrate. The array manufacturing method makes it possible to obtain finely ordered cavities and form nanoscale dots using the cavities.

    Abstract translation: 提供一种制造纳米通道阵列的方法和使用纳米通道阵列制造纳米点的方法。 纳米通道阵列制造方法包括:执行第一阳极氧化以形成具有由铝基板上的多个空腔形成的沟道阵列的第一氧化铝层; 将第一氧化铝层蚀刻到预定深度并在铝基板上形成多个凹部,其中每个凹部对应于第一氧化铝层的每个通道的底部; 以及进行第二阳极氧化以形成具有与所述铝基板上的所述多个凹部对应的多个通道的阵列的第二氧化铝层。 阵列制造方法使得可以使用空腔获得精细排列的空腔并形成纳米级点。

    Semiconductor memory device having metal-insulator transition film resistor
    115.
    发明申请
    Semiconductor memory device having metal-insulator transition film resistor 有权
    具有金属 - 绝缘体转移膜电阻器的半导体存储器件

    公开(公告)号:US20070085122A1

    公开(公告)日:2007-04-19

    申请号:US11485340

    申请日:2006-07-13

    CPC classification number: H01L27/108 H01L27/101 H01L27/2436 H01L45/146

    Abstract: A semiconductor memory device may have a lower leakage current and/or higher reliability, e.g., a longer retention time and/or a shorter refresh time. The device may include a switching device and a capacitor. A source of the switching device may be connected to a first end of a metal-insulator transition film resistor, and at least one electrode of the capacitor may be connected to a second end of the metal-insulator transition film resistor. The metal-insulator transition film resistor may transition between an insulator and a conductor according to a voltage supplied to the first and second ends thereof.

    Abstract translation: 半导体存储器件可以具有较低的漏电流和/或更高的可靠性,例如较长的保留时间和/或更短的刷新时间。 该装置可以包括开关装置和电容器。 开关器件的源极可以连接到金属 - 绝缘体转变膜电阻器的第一端,并且电容器的至少一个电极可以连接到金属 - 绝缘体转变膜电阻器的第二端。 金属 - 绝缘体转变膜电阻器可以根据提供给其第一和第二端的电压在绝缘体和导体之间转变。

    Manufacturing method for emitter for electron-beam projection lithography
    116.
    发明授权
    Manufacturing method for emitter for electron-beam projection lithography 有权
    用于电子束投影光刻的发射器的制造方法

    公开(公告)号:US07091054B2

    公开(公告)日:2006-08-15

    申请号:US11057469

    申请日:2005-02-15

    Abstract: An emitter for an electron-beam projection lithography (EPL) system and a manufacturing method therefor are provided. The electron-beam emitter includes a substrate, an insulating layer overlying the substrate, and a gate electrode including a base layer formed on top of the insulating layer to a uniform thickness and an electron-beam blocking layer formed on the base layer in a predetermined pattern. The manufacturing method includes steps of: preparing a substrate; forming an insulating layer on the substrate; forming a base layer of a gate electrode by depositing a conductive metal on the insulating layer to a predetermined thickness; forming an electron-beam blocking layer of the gate electrode by depositing a metal capable of anodizing on the base layer to a predetermined thickness; and patterning the electron-beam blocking layer in a predetermined pattern by anodizing. The emitter provides a uniform electric field within the insulating layer and simplify the manufacturing method therefor.

    Abstract translation: 提供了一种用于电子束投影光刻(EPL)系统的发射器及其制造方法。 电子束发射器包括衬底,覆盖衬底的绝缘层,以及包括形成在绝缘层顶部上的基底层至均匀厚度的栅极电极和以预定的方式形成在基底层上的电子束阻挡层 模式。 该制造方法包括以下步骤:制备衬底; 在所述基板上形成绝缘层; 通过在所述绝缘层上沉积导电金属至预定厚度来形成栅电极的基层; 通过在基底层上沉积能够阳极氧化的金属至预定的厚度来形成栅电极的电子束阻挡层; 并通过阳极氧化将预定图案中的电子束阻挡层图案化。 发射极在绝缘层内提供均匀的电场,并简化其制造方法。

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