SONOS memory device having side gate stacks and method of manufacturing the same
    1.
    发明申请
    SONOS memory device having side gate stacks and method of manufacturing the same 有权
    具有侧栅叠层的SONOS存储器件及其制造方法

    公开(公告)号:US20060180853A1

    公开(公告)日:2006-08-17

    申请号:US11200153

    申请日:2005-08-10

    IPC分类号: H01L21/336 H01L29/792

    摘要: In a silicon-oxide-nitride-oxide-silicon (SONOS) memory device and a method of manufacturing the same, a SONOS memory device includes a semiconductor substrate, an insulating layer deposited on the semiconductor substrate, an active layer formed on a predetermined region of the insulating layer and divided into a source region, a drain region, and a channel region, a first side gate stack formed at a first side of the channel region, and a second side gate stack formed at a second side of the channel region opposite the first side of the channel region. In the SONOS memory device, at least two bits of data may be stored in each SONOS memory device, thereby allowing the integration density of the semiconductor memory device to be increased without increasing an area thereof.

    摘要翻译: 在氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)存储器件及其制造方法中,SONOS存储器件包括半导体衬底,沉积在半导体衬底上的绝缘层,形成在预定区域上的有源层 并且被分成源区域,漏极区域和沟道区域,形成在沟道区域的第一侧的第一侧栅叠层和形成在沟道区域的第二侧的第二侧栅叠层 与通道区域的第一侧相对。 在SONOS存储器件中,可以在每个SONOS存储器件中存储至少两位数据,从而允许半导体存储器件的集成密度增加而不增加其面积。

    Split gate type flash memory
    5.
    发明授权
    Split gate type flash memory 有权
    分闸门型闪存

    公开(公告)号:US06429472B2

    公开(公告)日:2002-08-06

    申请号:US09801731

    申请日:2001-03-09

    IPC分类号: H01L2972

    摘要: A split gate type flash memory having an active region that improves an endurance characteristic along with program/erase efficiency, wherein the split gate type flash memory provides for improvement in the endurance characteristic and program/erase efficiency by making the width of an active region in a portion in which a source is overlapped by a floating gate as large as possible.

    摘要翻译: 一种具有有效区域的分裂门型闪速存储器,其具有改善耐久性特性以及编程/擦除效率的功能,其中分离栅型闪速存储器通过使有源区域的宽度成为可能性来提高耐久特性和编程/擦除效率 源极与浮动栅极重叠的部分尽可能大。

    Mask for electromagnetic radiation and method of fabricating the same
    6.
    发明申请
    Mask for electromagnetic radiation and method of fabricating the same 审中-公开
    电磁辐射掩模及其制造方法

    公开(公告)号:US20060134531A1

    公开(公告)日:2006-06-22

    申请号:US11274474

    申请日:2005-11-16

    IPC分类号: G03C5/00 G21K5/00 G03F1/00

    摘要: A mask for lithography and a method of manufacturing the same. The mask may include a substrate, a reflection layer formed of a material capable of reflecting electromagnetic rays on the substrate and an absorption pattern formed in a desired pattern such that absorbing regions with respect to electromagnetic rays and windows through which electromagnetic rays pass are formed, wherein the absorption pattern includes at least one side surface that is adjacent to the window and is inclined with respect to the reflection layer. The method may include forming a reflection layer which is formed of a material capable of reflecting electromagnetic rays on a substrate, forming an absorption layer which is formed of a material capable of absorbing electromagnetic rays on the refection layer, and patterning the absorption layer to form an absorption pattern with at least one side surface adjacent to a window that has an inclined side surface with respect to the reflection layer.

    摘要翻译: 光刻用掩模及其制造方法。 掩模可以包括基板,由能够在基板上反射电磁射线的材料形成的反射层和形成为期望图案的吸收图案,使得形成相对于电磁射线通过的电磁射线和窗口的吸收区域, 其中所述吸收图案包括与所述窗口相邻并且相对于所述反射层倾斜的至少一个侧表面。 该方法可以包括形成由能够在基板上反射电磁射线的材料形成的反射层,形成由能够在反射层上吸收电磁射线的材料形成的吸收层,以及图案化吸收层以形成 具有与窗口相邻的至少一个侧表面的吸收图案,该窗口具有相对于反射层的倾斜侧表面。

    SONOS memory device having side gate stacks and method of manufacturing the same
    7.
    发明授权
    SONOS memory device having side gate stacks and method of manufacturing the same 失效
    具有侧栅叠层的SONOS存储器件及其制造方法

    公开(公告)号:US06946703B2

    公开(公告)日:2005-09-20

    申请号:US10753772

    申请日:2004-01-09

    摘要: In a silicon-oxide-nitride-oxide-silicon (SONOS) memory device and a method of manufacturing the same, a SONOS memory device includes a semiconductor substrate, an insulating layer deposited on the semiconductor substrate, an active layer formed on a predetermined region of the insulating layer and divided into a source region, a drain region, and a channel region, a first side gate stack formed at a first side of the channel region, and a second side gate stack formed at a second side of the channel region opposite the first side of the channel region. In the SONOS memory device, at least two bits of data may be stored in each SONOS memory device, thereby allowing the integration density of the semiconductor memory device to be increased without increasing an area thereof.

    摘要翻译: 在氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)存储器件及其制造方法中,SONOS存储器件包括半导体衬底,沉积在半导体衬底上的绝缘层,形成在预定区域上的有源层 并且被分成源区域,漏极区域和沟道区域,形成在沟道区域的第一侧的第一侧栅叠层和形成在沟道区域的第二侧的第二侧栅叠层 与通道区域的第一侧相对。 在SONOS存储器件中,可以在每个SONOS存储器件中存储至少两位数据,从而允许半导体存储器件的集成密度增加而不增加其面积。

    SONOS memory device having side gate stacks and method of manufacturing the same
    8.
    发明授权
    SONOS memory device having side gate stacks and method of manufacturing the same 有权
    具有侧栅叠层的SONOS存储器件及其制造方法

    公开(公告)号:US07374991B2

    公开(公告)日:2008-05-20

    申请号:US11200153

    申请日:2005-08-10

    IPC分类号: H01L21/8238

    摘要: In a silicon-oxide-nitride-oxide-silicon (SONOS) memory device and a method of manufacturing the same, a SONOS memory device includes a semiconductor substrate, an insulating layer deposited on the semiconductor substrate, an active layer formed on a predetermined region of the insulating layer and divided into a source region, a drain region, and a channel region, a first side gate stack formed at a first side of the channel region, and a second side gate stack formed at a second side of the channel region opposite the first side of the channel region. In the SONOS memory device, at least two bits of data may be stored in each SONOS memory device, thereby allowing the integration density of the semiconductor memory device to be increased without increasing an area thereof.

    摘要翻译: 在氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)存储器件及其制造方法中,SONOS存储器件包括半导体衬底,沉积在半导体衬底上的绝缘层,形成在预定区域上的有源层 并且被分成源区域,漏极区域和沟道区域,形成在沟道区域的第一侧的第一侧栅叠层和形成在沟道区域的第二侧的第二侧栅叠层 与通道区域的第一侧相对。 在SONOS存储器件中,可以在每个SONOS存储器件中存储至少两位数据,从而允许半导体存储器件的集成密度增加而不增加其面积。

    Photomask and method thereof
    9.
    发明申请
    Photomask and method thereof 审中-公开
    光掩模及其方法

    公开(公告)号:US20060257753A1

    公开(公告)日:2006-11-16

    申请号:US11356258

    申请日:2006-02-17

    IPC分类号: G03C5/00 G21K5/00 G03F1/00

    摘要: A photomask and method thereof. In an example method, a photomask may be manufactured by forming an oxide layer on a surface, patterning the oxide layer to form an oxide pattern, the oxide pattern including a plurality of oxide pattern bodies and a plurality of oxide windows, filling the plurality of oxide windows with an absorbent to form an absorbent pattern and reducing the plurality of oxide pattern bodies. An example photomask may include an oxide pattern-based absorbent pattern including a plurality of absorbent pattern bodies and a plurality of absorbent pattern windows.

    摘要翻译: 光掩模及其方法。 在一个示例性方法中,可以通过在表面上形成氧化物层来形成光掩模,图案化氧化物层以形成氧化物图案,氧化物图案包括多个氧化物图案体和多个氧化物窗口, 具有吸收剂的氧化物窗口以形成吸收图案并且还原多个氧化物图案体。 示例性光掩模可以包括基于氧化物图案的吸收图案,其包括多个吸收图案体和多个吸收图案窗。