Abstract:
In an apparatus for reshaping or molding tubular envelopes of fluorescent lamps or the like into an annular form, an improvement in or relating to a pulley-shaped mold assembly is disclosed which assembly comprises a pair of separable mold half sections which, when mated together, define an annular groove around the periphery of the mold assembly around which is wrapped an envelope sufficiently heated to a workable or reshapable condition so as to be shaped into the annular form. The molding head of the apparatus comprises two mold assemblies of the type described so that two envelopes may be simultaneously shaped into an annular form. Each mold assembly is divided into a pair of half sections by a vertical plane at right angles to the axis thereof in such a way that one of the half sections located closer to the other mold assembly has a thickness shorter than that of the other half section so that the distance between the paired heads holding tubular envelopes may be shortened with the resultant reduction in overall dimensions of the reshaping apparatus and annular fluorescent lamp manufacturing machine.
Abstract:
A high-pressure metal-vapor discharge lamp is formed by enclosing scandium-halide, preferably scandium-iodide (ScI3) in the amount of 1.80 X 10 7 to 9.27 X 10 6 gram mol/cc of confined gas, and at least 3.1 times said halide quantity in atomic ratio of free (metal) scandium, together with some mercury as a buffer gas, inside a translucent alumina tube. Such discharge lamp can maintain a luminous efficiency of over 70 lumen/Watt and a general color-rendering index of over 70 for a period in excess of 6,000 hours, and thus, it is very useful as a general lighting source.
Abstract:
In the manufacturing of a multiple layer semiconductor device, such as semiconductor laser device formed by liquid phase epitaxial growth, the following improvement is offered, that is, after forming a first epitaxial growth layer by making a semiconductor substrate contact a first semiconductor solution, and prior to forming a second epitaxial growth layer by letting said first layer contact with a second semiconductor solution, said first layer is made to contact a third semiconductor solution or liquid metal, whereby the slope of impurity concentration in the vicinity of a junction formed between the first and the second layer can be satisfactorily steepened thereby attaining a good performance.