Abstract:
An image surveillance system and an image surveillance method are provided. The image surveillance method includes following steps. An image is captured, and at least one reference target is defined in the captured image. A monitored object in the image is identified. A distance between the monitored object and each of the at least one reference target is individually calculated. Whether to announce at least one warning is determined according to a relationship between at least one threshold and the distance.
Abstract:
An image surveillance system and an image surveillance method are provided. The image surveillance method includes following steps. An image is captured, and at least one reference target is defined in the captured image. A monitored object in the image is identified. A distance between the monitored object and each of the at least one reference target is individually calculated. Whether to announce at least one warning is determined according to a relationship between at least one threshold and the distance.
Abstract:
A thin heat pipe includes a thin hollow tube and a capillary structure. The capillary structure is formed in at least half of an inner wall of the thin hollow tube by a chemical etching process.
Abstract:
1,5-Dideoxy-1,5-imino-D-glucitol compounds as shown in the specification. Also disclosed is a method of treating a hexosaminidase-associated disease.
Abstract:
A method including providing a present wafer to be processed by a photolithography tool, selecting a processed wafer having a past chip design from a plurality of processed wafers, the processed wafer being previously processed by the photolithography tool, selecting a plurality of critical dimension (CD) data points extracted from a plurality of fields on the processed wafer, modeling the plurality of CD data points with a function relating CD to position on the processed wafer, creating a field layout on the present wafer for a new chip design, creating an initial exposure dose map for the new chip design using the function and the field layout, and controlling the exposure of the photolithography tool according to the initial exposure dose map to form the new chip design on the present wafer.
Abstract:
A solar cell includes a substrate, a lower conductor layer, an anti-reflection coating (ARC) layer and an upper conductor layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The lower conductor layer has a first portion embedded into the doped region and a second portion other than the first portion. The ARC layer is disposed on the front side of the substrate and covers the lower conductor layer such that the second portion of the lower conductor layer is disposed in the ARC layer. The upper conductor layer has a first portion embedded into the ARC layer and a second portion other than the first portion of the upper conductor layer. The second portion of the upper conductor layer is exposed out of the ARC layer, and the upper conductor layer is electrically connected to the lower conductor layer.
Abstract:
A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.
Abstract:
A hard water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hard coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the hard water-repellent structure includes the hard coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the hard water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the disclosure adopts the APPD technique to form the hard water-repellent structure, the cost of production is reduced dramatically. Thus, the disclosure can solve drawbacks of prior art.
Abstract:
A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.
Abstract:
Atmospheric plasma inkjet printing apparatus and methods for fabricating color filters using the same. The atmosphere plasma inkjet printing apparatus includes a nozzle plate having a first column of nozzles and a second column of nozzles. An inkjet printhead module corresponds to the first column of nozzles. An atmospheric plasma module is corresponds to the second column of nozzles.