公开(公告)号：US09524948B2

公开(公告)日：2016-12-20

申请号：US14040732

申请日：2013-09-30

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung Lin ,  Yu-Hua Huang ,  Wei-Che Huang ,  Ming-Tzong Yang

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/32014 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure, comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die to the second die such that the first die and the second die are electrically connected; and at least one bonding wire, for electrically connecting the first die to the conductive units or the substrate.

Abstract translation: 一种封装结构，包括：衬底，其具有设置在所述衬底的第一表面处的至少一个导电单元; 至少一个第一管芯，设置在所述衬底的第二表面上; 连接层; 设置在所述连接层上的第二管芯，其中所述连接层包括用于将所述第一管芯连接到所述第二管芯的至少一个突起，使得所述第一管芯和所述第二管芯电连接; 以及用于将第一管芯电连接到导电单元或基板的至少一个接合线。

公开(公告)号：US09520349B2

公开(公告)日：2016-12-13

申请号：US14611354

申请日：2015-02-02

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Tzu-Hung Lin ,  Ta-Jen Yu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3192 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/26 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05552 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. A conductive trace is disposed on the substrate. A conductive pillar bump is disposed on the conductive trace, wherein the conductive bump is coupled to a die. In another configuration, a first conductive trace is disposed on the substrate, and a second conductive trace is disposed on the substrate. In the second configuration, a conductive pillar bump disposed on the second conductive trace, connecting to a conductive bump or a metal pad of the semiconductor die. A first conductive structure is disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate, and a die is disposed over the first conductive trace.

Abstract translation: 提供半导体封装。 在一种配置中，半导体封装包括衬底。 导电迹线设置在基板上。 导电柱凸块设置在导电迹线上，其中导电凸块连接到管芯。 在另一种结构中，第一导电迹线设置在衬底上，并且第二导电迹线设置在衬底上。 在第二构造中，设置在第二导电迹线上的导电柱凸块连接到半导体管芯的导电凸块或金属焊盘。 第一导电结构设置在第二导电迹线和导电柱突起之间或第二导电迹线和衬底之间，并且管芯设置在第一导电迹线上。