摘要:
A semiconductor chip includes a substrate with a barrier region and a conductive diffusion region formed in the substrate and is surrounded by the barrier region. The conductive diffusion region may provide a conductive oath from top of the substrate to bottom of the substrate.
摘要:
A medical anastomosis apparatus is provided. The medical anastomosis apparatus includes a cylindrical body which has a hollow portion and extends in a longitudinal direction, a pressing rod which is provided inside of the hollow portion of the body to translate along the hollow portion, a knob which is coupled to the pressing rod to provide a driving force to translate the pressing rod, a guide member which is inserted into one end of the body and simultaneously coupled to expose a portion of the body and has a pressing unit formed therein to move radially upon translation of the pressing rod, and a staple cartridge which is inserted around an outer circumferential surface of the guide member and then coupled to the body and has built-in staple clips that protrude outward upon movement of the pressing unit.
摘要:
The present invention relates to a laundry treating apparatus which can make easy drying, deodorizing, crumple removal and sterilization of clothes, characterized in that laundry treating apparatus is provided with a hanger bar for receiving clothes hangers of different shapes.
摘要:
A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads.
摘要:
An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.
摘要:
Provided are an apparatus and method for protecting the copyright of digital content, and an apparatus and method for determining the authenticity of digital content. The apparatus for protecting the copyright of digital content includes a creative commons license (CCL) watermark application unit configured to watermark digital content provided withCCL information on the basis of the CCL information, and a modification-detecting watermark application unit configured to insert a modification-detecting watermark in the digital content watermarked by the CCL watermark application unit. The apparatus for determining the authenticity of digital content includes a modification-detecting watermark extractor, a CCL watermark extractor, and a CCL authenticity determiner.
摘要:
The present invention relates to a method and apparatus for producing custom-made gloves. In the present invention, an order management server receives customer information and hand scan data from a measurement and order processing apparatus, generates pattern information to be used for glove production using a pattern generation apparatus, and requests a leather processing apparatus to produce a glove according to the pattern information. According to the present invention, it is possible to realize an online ordering and production process involving size measurement and manufacturing procedures in the production process for leather gloves. In addition, as body scan data is obtained by a low-cost 2D body scanner instead of a high-cost 3D body scanner, it is possible to produce precise custom-made leather gloves at reduced cost.
摘要:
An apparatus and method for video watermarking are provided. The apparatus and method include receiving a bit stream encoded by a video encoder by a spatial domain information analyzer and extracting information from a spatial domain of an image with respect to code words forming the bit stream, grouping the code words for each segmented domain by a domain classifier based on the information from the spatial domain, determining a sign of the each segmented domain by a domain sign determiner and inserting a watermark in the each segmented domain according to the sign determined by the domain sign determiner by a watermark bit inserter.
摘要:
An apparatus and method for video watermarking are provided. The apparatus and method include receiving a bit stream encoded by a video encoder by a spatial domain information analyzer and extracting information from a spatial domain of an image with respect to code words forming the bit stream, grouping the code words for each segmented domain by a domain classifier based on the information from the spatial domain, determining a sign of the each segmented domain by a domain sign determiner and inserting a watermark in the each segmented domain according to the sign determined by the domain sign determiner by a watermark bit inserter.
摘要:
A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and spaced apart from each other on the flexible substrate. Each semiconductor chip has bonding pads. The conductive wires are electrically connected to the bonding pads of the semiconductor chip. Each conductive wire has at least one elastic portion. One preferred configuration is that part of the conductive wire is wound to form a coil spring shape so that the coil spring shape of the conductive wire aid in preventing the conductive wire from being separated from the corresponding bonding pad of the semiconductor chip when the flexible substrate on which the semiconductor chips are mounted are bent, expanded or twisted.