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    Image sensor chip package
    111.
    发明申请
    Image sensor chip package 审中-公开
    图像传感器芯片封装

    公开(公告)号：US20070108561A1

    公开(公告)日：2007-05-17

    申请号：US11525446

    申请日：2006-09-22

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L23/495

    CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.

    Abstract translation: 图像传感器芯片封装（200）包括载体（20），图像传感器芯片（30），多个导线（50）和保持器（60）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有第一端子部分（236）和连接第一和第二端子部分的互连部分（237）。 芯片安装在载体上，并具有有效区域（301）和多个触点（302）。 导线将芯片的触点与引线框架的第一端子部分电连接。 保持器安装到载体上以封闭空腔，并允许光通过，以到达芯片的有效区域。

    Digital camera module
    112.
    发明申请
    Digital camera module 有权
    数码相机模组

    公开(公告)号：US20070057150A1

    公开(公告)日：2007-03-15

    申请号：US11478503

    申请日：2006-06-28

    Applicant: Steven Webster

    Inventor： Steven Webster

    IPC: H01L27/00

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H05K1/118 ,  H05K3/326 ,  H01L2924/00014

    Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

    Abstract translation: 数字照相机模块（100）包括保持器，图像传感器芯片封装（30），多个导电元件（24）和电路板（40）。 保持器限定接收部分。 保持器安装在图像传感器芯片封装上。 图像传感器芯片封装具有多个外部焊盘。 外垫位于保持器的接收部分中。 导电元件被接收在接收部分中。 每个导电元件的一端连接到内部焊盘，每个导电元件的另一端连接到电路板。

    Digital camera module package fabrication method
    113.
    发明申请
    Digital camera module package fabrication method 有权
    数码相机模块封装制造方法

    公开(公告)号：US20070057148A1

    公开(公告)日：2007-03-15

    申请号：US11453454

    申请日：2006-06-14

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H01J5/02 ,  H01L27/00

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

    Abstract translation: 数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。 第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。 最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

    Digital camera module with small sized image sensor chip package
    115.
    发明申请
    Digital camera module with small sized image sensor chip package 有权
    数码相机模块具有小尺寸图像传感器芯片封装

    公开(公告)号：US20060290802A1

    公开(公告)日：2006-12-28

    申请号：US11402467

    申请日：2006-04-12

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

    Abstract translation: 数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。 图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

    Spreadsheet-based user interface creation
    117.
    发明授权
    Spreadsheet-based user interface creation 有权
    基于电子表格的用户界面创建

    公开(公告)号：US07107519B1

    公开(公告)日：2006-09-12

    申请号：US09932119

    申请日：2001-08-16

    Applicant: Steven Webster ,  Robb Robles ,  E. John McGarry ,  Russ Weinzimmer

    Inventor： Steven Webster ,  Robb Robles ,  E. John McGarry ,  Russ Weinzimmer

    IPC: G06F17/00

    CPC classification number: G06F17/246

    Abstract: A method is disclosed for creating a user interface for a spreadsheet-based software application. The method includes providing a spreadsheet having a plurality of standard cells displayable as standard spreadsheet cells, and a plurality of user interface cells displayable only as a window superimposed upon the standard spreadsheet cells; and providing at least one control function adapted to create the window superimposed upon the standard spreadsheet cells. Also disclosed is a user interface for a spreadsheet-based software application that includes a spreadsheet having a plurality of standard cells displayable as standard spreadsheet cells; and at least one custom view control function adapted to create a window superimposed upon the standard spreadsheet cells, the window displaying a subset of the standard cells. This invention substantially simplifies the task of programming a user interface using a spreadsheet environment. All standard spreadsheet functionality is available for use in the user interface creation process.

    Abstract translation: 公开了一种用于创建用于基于电子表格的软件应用程序的用户界面的方法。 该方法包括提供具有可标准电子表格单元可显示的多个标准单元的电子表格，以及仅可叠加在标准电子表格单元上的窗口可显示的多个用户界面单元; 以及提供适于创建叠加在标准电子表格单元上的窗口的至少一个控制功能。 还公开了一种用于基于电子表格的软件应用程序的用户界面，其包括具有可作为标准电子表格单元格显示的多个标准单元的电子表格; 以及适于创建叠加在标准电子表格单元上的窗口的至少一个定制视图控制功能，该窗口显示标准单元的子集。 本发明基本上简化了使用电子表格环境编程用户界面的任务。 所有标准电子表格功能都可用于用户界面创建过程。

    Digital still camera module
    118.
    发明申请
    Digital still camera module 有权
    数码相机模组

    公开(公告)号：US20060093352A1

    公开(公告)日：2006-05-04

    申请号：US11262592

    申请日：2005-10-31

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

    IPC: G03B17/00

    CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H04N5/2253 ,  H01L2924/00014

    Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

    Abstract translation: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。 图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。 衬底在其中限定接收室（203）。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分（29）。 镜筒包括容纳在其中的至少一个透镜（31）。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

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