公开(公告)号：US20090229876A1

公开(公告)日：2009-09-17

申请号：US12401141

申请日：2009-03-10

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K9/00 ,  H05K1/00 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。

公开(公告)号：US20080185172A1

公开(公告)日：2008-08-07

申请号：US11844788

申请日：2007-08-24

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/167 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09736 ,  H05K2203/1453

Abstract: A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor.

Abstract translation: 印刷电路板包括具有表面的绝缘层，嵌入在绝缘层中的电极，形成在绝缘层的表面上并电连接到电极的电阻器，以及形成在绝缘层表面上的外部连接导电图案 并电连接到一个或多个电极。 绝缘层和电极在绝缘层的表面上形成部件安装表面，部件安装表面与绝缘层的表面基本平齐，并且包括形成电阻器的电阻器形成区域，并且 外部连接导体图案与电阻器隔开一个空间。

公开(公告)号：US20080099230A1

公开(公告)日：2008-05-01

申请号：US11927144

申请日：2007-10-29

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括柔性基板和形成在柔性基板上的导体图案，邻近柔性基板设置的非柔性基板，包括无机材料并覆盖柔性基板的绝缘层和 非柔性基板，绝缘层暴露柔性板的至少一部分，形成在绝缘层上的导体图案，以及将柔性基板的导体图案与导体图案连接在绝缘层上的镀层。

公开(公告)号：US20070096328A1

公开(公告)日：2007-05-03

申请号：US11480824

申请日：2006-07-06

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 μm or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.

Abstract translation: 多层印刷线路板包括多个厚度为100μm以下的绝缘层和在绝缘层上形成的多个导体电路。 将绝缘层上的导体电路彼此电连接的多个通孔中的每一个从绝缘层的表面向内形成为锥形，并且通孔彼此相对设置以形成多级堆叠通孔。