-
公开(公告)号:US12242388B2
公开(公告)日:2025-03-04
申请号:US17945702
申请日:2022-09-15
Applicant: Micron Technology, Inc.
Inventor: Ameen D. Akel , Shivam Swami
IPC: G06F12/12 , G06F12/0864 , G06F12/0884 , G06F12/122
Abstract: Row hammer attacks takes advantage of unintended and undesirable side effects of memory devices in which memory cells interact electrically between themselves by leaking their charges and possibly changing the contents of nearby memory rows that were not addressed in an original memory access. Row hammer attacks are mitigated by using a victim cache. Data is written to cache lines of a cache. A least recently used cache line of the cache is written to the victim cache.
-
公开(公告)号:US20250036316A1
公开(公告)日:2025-01-30
申请号:US18771865
申请日:2024-07-12
Applicant: Micron Technology, Inc.
Inventor: Chun-Yi Liu , Ameen D. Akel
IPC: G06F3/06
Abstract: Methods, systems, and devices for management command techniques for stacked memory architectures are described. For example, a system may be configured to support management command signaling between a controller (e.g., of a host system) and interface circuitry (e.g., of a memory system) of a first semiconductor die that is configured for accessing one or more memory arrays (e.g., of the memory system) of one or more second semiconductor dies. The interface circuitry may be configured to schedule or otherwise determine that a management operation is to be performed, and may indicate a request to the controller to schedule aspects of the management operation. In response, the controller may indicate one or more commands to the interface circuitry to perform the management operation.
-
公开(公告)号:US20240427708A1
公开(公告)日:2024-12-26
申请号:US18828657
申请日:2024-09-09
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Shivam Swami , Sean Stephen Eilert , Justin M. Eno , Ameen D. Akel
IPC: G06F13/10 , G06F3/06 , G06F12/0802 , G06F13/12
Abstract: A memory chip having a first set of pins configured to allow the memory chip to be coupled to a first microchip or device via first wiring. The memory chip also having a second set of pins configured to allow the memory chip to be coupled to a second microchip or device via second wiring that is separate from the first wiring. The memory chip also having a data mover configured to facilitate access to the second microchip or device, via the second set of pins, to read data from the second microchip or device and write data to the second microchip or device. Also, a system having the memory chip, the first microchip or device, and the second microchip or device.
-
公开(公告)号:US12086078B2
公开(公告)日:2024-09-10
申请号:US17888392
申请日:2022-08-15
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Shivam Swami , Sean Stephen Eilert , Justin M. Eno , Ameen D. Akel
IPC: G06F12/0802 , G06F3/06 , G06F13/00 , G06F13/10 , G06F13/12
CPC classification number: G06F13/102 , G06F3/06 , G06F12/0802 , G06F13/124 , G06F2212/621
Abstract: A memory chip having a first set of pins configured to allow the memory chip to be coupled to a first microchip or device via first wiring. The memory chip also having a second set of pins configured to allow the memory chip to be coupled to a second microchip or device via second wiring that is separate from the first wiring. The memory chip also having a data mover configured to facilitate access to the second microchip or device, via the second set of pins, to read data from the second microchip or device and write data to the second microchip or device. Also, a system having the memory chip, the first microchip or device, and the second microchip or device.
-
公开(公告)号:US12067270B2
公开(公告)日:2024-08-20
申请号:US17946518
申请日:2022-09-16
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Sujeet Ayyapureddi , Edmund J. Gieske , Cagdas Dirik , Ameen D. Akel , Elliott C. Cooper-Balis , Amitava Majumdar , Robert M. Walker , Danilo Caraccio
IPC: G06F3/06
CPC classification number: G06F3/0632 , G06F3/0604 , G06F3/0679
Abstract: Systems, methods, and apparatus for memory device security and row hammer mitigation are described. A control mechanism may be implemented in a front-end and/or a back-end of a memory sub-system to refresh rows of the memory. A row activation command having a row address at control circuitry of a memory sub-system and incrementing a first count of a row counter corresponding to the row address stored in a content addressable memory (CAM) of the memory sub-system may be received. Control circuitry may determine whether the first count is greater than a row hammer threshold (RHT) minus a second count of a CAM decrease counter (CDC); the second count may be incremented each time the CAM is full. A refresh command to the row address may be issued when a determination is made that the first count is greater than the RHT minus the second count.
-
公开(公告)号:US20240233870A9
公开(公告)日:2024-07-11
申请号:US18049506
申请日:2022-10-25
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Justin Eno , Sean S. Eilert , Ameen D. Akel , Kenneth M. Curewitz
Abstract: Associative processing memory (APM) may be used to align reads to a reference sequence. The APM may store shifted permutations and/or other permutations of the reference sequence. A read may be compared to some or all of the permutations of the reference sequence and the APM may provide an output for each comparison. In some examples, the APM may compare the read to many permutations of the reference sequence to the read in parallel. Inferences may be made based on the comparisons between the read and the portions and/or permutations of a reference sequence. Based on the inferences, a candidate alignment location in the reference sequence for a read to be determined.
-
公开(公告)号:US20240192892A1
公开(公告)日:2024-06-13
申请号:US18531267
申请日:2023-12-06
Applicant: Micron Technology, Inc.
Inventor: Patrick Estep , Sean S. Eilert , Ameen D. Akel
IPC: G06F3/06
CPC classification number: G06F3/0659 , G06F3/0604 , G06F3/0689
Abstract: Systems, apparatuses, and methods related to data reconstruction based on queue depth comparison are described. To avoid accessing the “congested” channel, a read command to access the “congested” channel can be executed by accessing the other relatively “idle” channels and utilize data read from the “idle” channels to reconstruct data corresponding to the read command.
-
公开(公告)号:US20240186274A1
公开(公告)日:2024-06-06
申请号:US18522457
申请日:2023-11-29
Applicant: Micron Technology, Inc.
Inventor: Amy Rae Griffin , Brent Keeth , Kunal R. Parekh , Eiichi Nakano , James Brian Johnson , Ameen D. Akel
IPC: H01L23/00 , H01L23/29 , H01L25/065 , H10B80/00
CPC classification number: H01L24/08 , H01L23/29 , H01L24/80 , H01L25/0657 , H10B80/00 , H01L2224/08145 , H01L2224/80895 , H01L2224/80896
Abstract: Methods, systems, and devices for thermal distribution techniques in coupled semiconductor systems are described. A semiconductor system may be formed by coupling various semiconductor components with one another, and may also implement a semiconductor material to support a thermal path having a thermal conductivity that is relatively close to a thermal conductivity through the coupled semiconductor components of the semiconductor system. Such a semiconductor material may be located in regions of the semiconductor system that are otherwise unoccupied by functional (e.g., electrically operable) semiconductor components and may, in some examples, be electrically inoperable (e.g., may lack functional circuitry). For implementations in which functional semiconductor components are directly coupled (e.g., by fusion bonding or hybrid bonding techniques), the semiconductor material may also be directly coupled with at least one of the semiconductor components.
-
公开(公告)号:US12001708B2
公开(公告)日:2024-06-04
申请号:US17647944
申请日:2022-01-13
Applicant: Micron Technology, Inc.
Inventor: Sean S. Eilert , Ameen D. Akel , Justin Eno , Brian Hirano
IPC: G06F3/06
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/0679
Abstract: Methods, systems, and devices for in-memory associative processing for vectors are described. A device may perform a computational operation on a first set of contiguous bits of a first vector and a first set of contiguous bits of a second vector. The first sets of contiguous bits may be stored in a first plane of a memory die and the computational operation may be based on a truth table for the computational operation. The device may perform a second computational operation on a second set of contiguous bits of the first vector and a second set of contiguous bits of the second vector. The second sets of contiguous bits may be stored in a second plane of the memory die and the computational operation based on the truth table for the computational operation.
-
公开(公告)号:US11947453B2
公开(公告)日:2024-04-02
申请号:US17100453
申请日:2020-11-20
Applicant: Micron Technology, Inc.
Inventor: Sean S. Eilert , Ameen D. Akel , Shivam Swami
IPC: G06F12/0802 , G06F3/06
CPC classification number: G06F12/0802 , G06F3/0604 , G06F3/0659 , G06F3/0679 , G06F2212/22 , G06F2212/221
Abstract: An example memory sub-system includes: a plurality of bank groups, wherein each bank group comprises a plurality of memory banks; a plurality of row buffers, wherein two or more row buffers of the plurality of row buffers are associated with each memory bank; a cache comprising a plurality of cache lines; a processing logic communicatively coupled to the plurality of bank groups and the plurality of row buffers, the processing logic to perform operations comprising: receiving an activate command specifying a row of a memory bank of the plurality of memory banks; fetching data from the specified row to a row buffer of the plurality of row buffers; and copying the data to a cache line of the plurality of cache lines.
-
-
-
-
-
-
-
-
-