Abstract:
The process provides for the simultaneous N+ type implantation of areas of a semiconductor substrate of type P for the formation of a control gate and of highly doped regions of source and drain, defining a channel region. After oxide growth there is executed the deposition and the definition of a polysilicon layer, one region of which constitutes a floating gate above the control gate and the channel region and partially superimposed over the regions of source and drain.
Abstract:
The invention relates to a process for forming a buried drain or collector region in monolithic semiconductor devices comprising an integrated control circuit and one or more power transistors with vertical current flow integrated in the same chip. The process allows optimization of the current-carrying capacity and the series drain resistance of the power stage and operating voltage by the implantation of a buried gate region in a first epitaxial layer after the formation of said epitaxial layer. These buried gate regions high dopant concentrations where the dopants have low diffusion coefficients. These low diffusive dopants permit more accurate and form defined buried gate regions than current formation techniques utilizing formation of buried gate regions implemented in the substrate where these gate regions contain highly diffusive dopants.
Abstract:
Each common source region of the cells of a row of a FLASH-EPROM matrix may be segmented and each segment is individually connected to a secondary source line patterned in a second level metal layer by a plurality of contacts between each common source region and patterned portions of a first level metal and through as many interconnection vias between the latter patterned portions of the first level of metal and the relative secondary source line patterned in the second metal layer. The secondary source lines are brought out of the matrix orthogonally to the bit lines and may be connected to a dedicated selection circuitry, thus permitting the erasing by groups or banks of cells of the FLASH-EPROM memory.
Abstract:
A fast capacitive-load driving circuit for driving output nodes on an integrated circuit. This circuit reduces noise interference caused by parasitic inductance by lowering the inductance voltage on the power supply lines during the switching process. This invention includes a voltage ramp, a voltage-to-current converter, and an output buffer having at least one pull-down transistor. A further embodiment includes an output buffer possessing a pull-down and a pull-up transistor.
Abstract:
A cell array for EPROM or ROM type memories has drain and source interconnection metal lines connecting in common drain and source regions, respectively, of the cells arranged on a same row of the array formed directly on the semiconductor substrate, superimposed at crossings to uninterrupted isolation strips formed on the semiconductor substrate for separating cells belonging to two adjacent columns of the array, and gate interconnection lines (WORD LINES), connecting the control gate electrodes of cells arranged on a same column, which run parallel to and between said isolation strips and superimposed at crossings to said underlying source and drain lines (BIT LINES). The array is markedly more compact than an array made according to the prior art though utilizing fabrication apparatuses with similar optical resolution, while maximizing the source and drain contact areas of the cells. In ROM devices, the customizing may advantageously take place during the final steps of the fabrication process by means of a gate contact mask having a reduced criticality in respect to a comparable drain contact mask used in prior art processes. The fabrication process employs self-alignment techniques and masks with a relatively low alignment criticality.
Abstract:
The circuit includes an input register (RI); an output register (RU); an AND plane; and an OR plane. The AND plane has vertical lines (Y), which are controlled by the input register, and horizontal lines (L), which include transistors (TA) arranged in series and controlled by respective vertical lines. The horizontal lines are connected to ground by normally-off transistors (TV) and to the power supply by normally-on transistors (TP). These transistors (TV, TP) are controlled by a first clock signal (CK1.about.). The OR plane has horizontal lines (S) and vertical lines (U). The vertical lines (U) of the OR plane contain normally-off transistors (TO) which are controlled by respective horizontal lines of the OR plane. Horizontal lines of the AND plane and horizontal lines of the OR plane are connected by respective pairs of normally-on transistors (TB) and normally-off transistors (TC) arranged in series between the power supply and ground. In each pair, the normally-on transistor is controlled by a horizontal line of the AND plane, and the normally-off transistor is controlled by a second clock signal (CK2). A horizontal line of the OR plane is connected to the node between the pair. The vertical lines of the OR plane are connected to the power supply by respective transistors (TR), which are controlled by a third clock signal (CK2.about.), and to the output register by pass transistors (P), which are controlled by a fourth clock signal (CK3.about.).
Abstract:
The problems normally linked to the creation of a power stage using BJT transistors are overcome realizing the power stage with BMFET transistors.
Abstract:
A device accomplishes protection against breakdown of an N+ type diffused region (6) inserted in a vertical-type semiconductor integrated power structure. Such a structure comprises N+ type substrate (1) over which there is superimposed an N- type epitaxial layer (2) in which a grounded P type insulation pocket (3) is obtained. The insulation pocket (3) contains an N type region (4) including a P type region (5) for the containment of the N+ type diffused region (6). The diffused region (6) is insulated electrically with respect to the P type containment region (5).
Abstract:
Step coverage in contacts may be improved by forming a tapered hole through a dielectric layer by:a) plasma (RIE) etching through a "contact" mask the dielectric for a depth shorter than the thickness of the layer leaving a residual thickness of dielectric on the bottom of the etch;b) removing the residual masking material;c) conformally depositing a TEOS layer;d) etching the conformally deposited TEOS layer without a mask in (RIE) plasma until exposing the underlying silicon or polysilicon with which the contact must be established.The anisotropic etching of the TEOS layer, conformally deposited on the partially pre-etched dielectric layer, determines a "self-aligned" exposition of the underlying silicon or polysilicon and leaves a tapered TEOS residue on the vertical pre-etched hole's walls, thus providing a desired tapering of the contact hole. Photolithographic definition is no longer a critical factor.
Abstract:
The invention relates to a regulator device for charging a battery by an alternator that delivers a rectified voltage including a ripple component. The device is of the type comprising a regulator circuit acting on the mean value of the rectified alternator voltage and a regulator circuit acting on the voltages of the positive peaks of the ripple component. The regulator circuits are powered by a stabilized voltage derived from the rectified alternator voltage and the device further comprises a power stage for controlling the excitation current of the alternator. According to the invention, the device further includes a regulator circuit acting on the values of the negative peaks of the ripple component. This regulator circuit is also powered by the stabilized voltage, and capable of causing the excitation current to be reduced whenever the voltage of the negative peaks falls below a given threshold.