Abstract:
A simulation method for a P-I-N junction photodiode uses a model that may include a diode model configured to characterize electrical behavior of the P-I-N junction photodiode, and an input for applying a fictitious electrical signal representing optical power received by the P-I-N junction photodiode. A current source model may be coupled to the diode model and may have a transient response to a variation of the fictitious electrical signal, based upon a sum of a first first-order transient response with a time constant based upon to a transit time of carriers in a depletion region of the P-I-N junction, and a second first-order transient response with a time constant based upon a diffusion time of carriers outside of the depletion region. The first and second responses may be respectively weighted by a length of the depletion region and a length of the P-I-N junction outside the depletion region.
Abstract:
A memory circuitry includes memory components operable in response to first edges of an internal clock; and internal clock generating circuitry to generate the internal clock in response to a system clock, wherein the first edges of the internal clock are generated in response to both a rising and a falling edge of the system clock.
Abstract:
A multichannel splitter formed from 1 to 2 splitters, wherein: an input terminal of a first 1 to 2 splitter defines an input of the multichannel splitter; the 1 to 2 splitters are electrically series-connected; and first respective outputs of the 1 to 2 splitters define output terminals of the multichannel splitter.
Abstract:
A method for manufacturing a wafer on which are formed resonators, each resonator including, above a semiconductor substrate, a stack of layers including, in the following order from the substrate surface: a Bragg mirror; a compensation layer made of a material having a temperature coefficient of the acoustic velocity of a sign opposite to that of all the other stack layers; and a piezoelectric resonator, the method including the successive steps of: a) depositing the compensation layer; and b) decreasing thickness inequalities of the compensation layer due to the deposition method, so that this layer has a same thickness to within better than 2%, and preferably to within better than 1%, at the level of each resonator.
Abstract:
A MOS transistor protected against overvoltages formed in an SOI-type semiconductor layer arranged on an insulating layer itself arranged on a semiconductor substrate including a lateral field-effect control thyristor formed in the substrate at least partly under the MOS transistor, a field-effect turn-on region of the thyristor extending under at least a portion of a main electrode of the MOS transistor and being separated there-from by said insulating layer, the anode and the cathode of the thyristor being respectively connected to the drain and to the source of the MOS transistor, whereby the thyristor turns on in case of a positive overvoltage between the drain and the source of the MOS transistor.
Abstract:
An integrated circuit may include a digital output port including a buffer stage that includes subassemblies of MOSFET transistors. One subassembly may include two pull-up transistors having sources connected to a common high voltage, and having drains connected to a common node connected to the output terminal. Another subassembly may include pull-down transistors having sources connected to a common low voltage, and having drains connected to the common node. The pull-up and pull-down transistors are formed in a thin semiconductor layer of an FDSOI substrate. The substrate may include a thick semiconductor layer and an oxide layer separating the thin and thick semiconductor layers. Areas of the thick semiconductor layer facing the pull-up and pull-down transistors may be connected to a circuit configured to vary a threshold voltage of the pull-up and pull-down transistors.
Abstract:
A power switch includes first and second MOS transistors in series between first and second nodes. Both the first and second transistors have a gate coupled to its substrate. First and second resistive elements are coupled between the gate of the first transistor and the first node, and between the gate of the second transistor and the second node, respectively. A triac is coupled between the first and second nodes. The gate of the triac is coupled to a third node common to the first and second transistors. A third MOS transistor has a first conduction electrode coupled to the gate of the first transistor and a second conduction electrode coupled to the gate of the second transistor.
Abstract:
The digital delta-sigma modulator includes a signal input for receiving digital samples of N bits, and a digital filter connected to the signal input. The digital filter performs addition/subtraction and integration operations according to a redundant arithmetic coding for delivering digital filtered samples. A quantizer performs a nonexact quantization operation so as to deliver digital output samples of n bits, with n being less than N. The input of the quantizer is connected within the digital filter.
Abstract:
A method is for transmitting a binary information word (MI) coded on r bits to which is attached a redundancy (CRC) coded on s bits, s and r being integers. The redundancy (CRC) signals the appearance of erroneous bits after the transmission, and is obtained by carrying out a Euclidian division of the information word (MI) to be transmitted by a generator polynomial coded on at most s bits. The generator polynomial is chosen so that it satisfies at least one of the following conditions, namely that the Hamming weight of the multiples of the generator polynomial is greater than or equal to a chosen threshold, or the generator polynomial allows the detection of at least 2s-1-3 consecutive erroneous bits.
Abstract:
At least three electrically conducting blocks are disposed within an isolating region; and at least two of them are mutually separated and capacitively coupled by a part of the isolating region. At least two of them, being semiconductor, have opposite types of conductivity or identical types of conductivity, but with different concentrations of dopants, and these are in mutual contact by one of their sides. The mutual arrangement of these blocks within the isolating region, their type of conductivity and their concentration of dopants form at least one electronic module. Some of the blocks define input and output blocks.