公开(公告)号：US20100019338A1

公开(公告)日：2010-01-28

申请号：US12574906

申请日：2009-10-07

Applicant: Woon-Seong KWON ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Hyung-Sun JANG

Inventor： Woon-Seong KWON ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Hyung-Sun JANG

IPC: H01L25/04

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first chip having first pads and a first mold layer encapsulating the first chip. The protection substrate is placed on the first wafer mold, is mechanically bonded with the first wafer mold using a first adhesive layer, and includes wiring layers facing the first pads. The second wafer mold is placed under the first wafer mold, is mechanically bonded with the first wafer mold using a second adhesive layer, and includes a second chip having second pads, and a second mold layer encapsulating the second chip. First vias electrically connect the wiring layers of the protection substrate with the second pads. Second vias electrically connect the wiring layers of the protection substrate with external connection terminals.

Abstract translation: 堆叠型半导体芯片封装包括在晶片级工艺中堆叠的第一晶片模具，保护基板和第二晶片模具。 第一晶片模具包括具有第一焊盘的第一芯片和封装第一芯片的第一模具层。 保护基板被放置在第一晶片模具上，使用第一粘合剂层与第一晶片模具机械结合，并且包括面向第一焊盘的布线层。 第二晶片模具放置在第一晶片模具下面，使用第二粘合剂层与第一晶片模具机械结合，并且包括具有第二焊盘的第二芯片和封装第二芯片的第二模具层。 第一通孔将保护衬底的布线层与第二衬垫电连接。 第二通孔将保护基板的布线层与外部连接端子电连接。

公开(公告)号：US20100011399A1

公开(公告)日：2010-01-14

申请号：US12396502

申请日：2009-03-03

Applicant: Yeo-ri Yoon ,  Yong-hwan Kwon ,  Sang-hee Lee ,  Jeong-Yeon Lee ,  Mi-ju Park ,  Won-il Kim ,  Woo-seok Hwang

Inventor： Yeo-ri Yoon ,  Yong-hwan Kwon ,  Sang-hee Lee ,  Jeong-Yeon Lee ,  Mi-ju Park ,  Won-il Kim ,  Woo-seok Hwang

IPC: H04N7/173 ,  H04N5/445

CPC classification number: H04N21/4826 ,  H04N5/44 ,  H04N7/17318 ,  H04N21/25891 ,  H04N21/44222 ,  H04N21/4532 ,  H04N21/6582

Abstract: There are provided a video processing apparatus, a video processing system, and an information providing method in the video processing apparatus. The video processing apparatus includes: a communication part performing communication with a service providing server providing broadcasting services; a video processing part performing video processing with respect to the broadcasting services; an output part outputting information on the broadcasting services; and a controller controlling the communication part, the output part and the video processing part to transmit user information and viewing information with respect to the video processing apparatus to the service providing server, to receive recommendation information based on the user information and the viewing information from the service providing server, and to output the received recommendation information, respectively.

Abstract translation: 在视频处理装置中提供了视频处理装置，视频处理系统和信息提供方法。 视频处理装置包括：与提供广播服务的服务提供服务器进行通信的通信部分; 执行与广播业务相关的视频处理的视频处理部分; 输出部，输出关于广播服务的信息; 以及控制通信部分的控制器，输出部分和视频处理部分，向服务提供服务器发送关于视频处理设备的用户信息和观看信息，以基于用户信息和来自 服务提供服务器，并分别输出接收到的推荐信息。

公开(公告)号：US20090271822A1

公开(公告)日：2009-10-29

申请号：US12366677

申请日：2009-02-06

Applicant: Sang-hee Lee ,  Yong-hwan Kwon ,  Won-il Kim

Inventor： Sang-hee Lee ,  Yong-hwan Kwon ,  Won-il Kim

IPC: G06F13/00 ,  H04N7/173

CPC classification number: H04N5/44543 ,  G06F16/735 ,  G06F16/7867 ,  H04N21/252 ,  H04N21/44204 ,  H04N21/44222 ,  H04N21/4532 ,  H04N21/4668 ,  H04N21/4828

Abstract: Provided are an image processing apparatus and an image processing method thereof. The image processing apparatus includes: an information reader which collects information related to a search word; and a controller which selects a favorite broadcast depending on a viewing pattern and provides the information reader with the search word corresponding to the favorite broadcast.

Abstract translation: 提供了一种图像处理装置及其图像处理方法。 图像处理装置包括：信息读取器，其收集与搜索词相关的信息; 以及控制器，其根据观看模式选择喜爱的广播，并向信息阅读器提供与喜爱广播相对应的搜索词。

公开(公告)号：US20090200632A1

公开(公告)日：2009-08-13

申请号：US12362210

申请日：2009-01-29

Applicant: Hyuek-Jae LEE ,  Tae-Je CHO ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Woon-Seong KWON ,  Hyung-Sun JANG

Inventor： Hyuek-Jae LEE ,  Tae-Je CHO ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Woon-Seong KWON ,  Hyung-Sun JANG

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2224/05099

Abstract: One embodiment exemplarily described herein can be characterized as an image sensor including a substrate having a front surface and a rear surface; a photoelectric converting portion on the front surface of the substrate; a through via extending through the substrate, wherein the through via is electrically connected to the photoelectric converting portion; an external connection terminal on the rear surface of the substrate, wherein the external connection terminal is connected to the through via; and a light shading layer formed on a portion of the rear surface of the substrate, wherein the light shading layer is substantially opaque with respect to an external light. In some embodiments, the portion of the rear surface of the substrate on which the light shading layer is formed is not overlapped by the through via or the external connection terminal.

Abstract translation: 本文示例性描述的一个实施例可以被表征为包括具有前表面和后表面的基板的图像传感器; 在所述基板的前表面上的光电转换部; 贯穿所述基板延伸的通孔，其中所述通孔电连接到所述光电转换部分; 在所述基板的后表面上的外部连接端子，其中所述外部连接端子连接到所述通孔; 以及形成在所述基板的后表面的一部分上的遮光层，其中所述遮光层相对于外部光基本上是不透明的。 在一些实施例中，其上形成有遮光层的基板的后表面的部分不与通孔或外部连接端子重叠。

公开(公告)号：US07554201B2

公开(公告)日：2009-06-30

申请号：US11513173

申请日：2006-08-31

Applicant: Uu-Byung Kang ,  Yong-Hwan Kwon ,  Jong-Ho Lee ,  Chung-Sun Lee

Inventor： Uu-Byung Kang ,  Yong-Hwan Kwon ,  Jong-Ho Lee ,  Chung-Sun Lee

IPC: H01L23/48

CPC classification number: C22C30/06 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3463 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still In still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold bumps, a substrate having metal wirings connected to the gold bumps, and a junction including a tin-bismuth family alloy solder interposed between and connecting the gold bump and the metal wiring.

Abstract translation: 本发明的示例性实施例涉及合金焊料和使用该合金焊料的半导体器件。 其他示例实施例涉及能够增加半导体芯片和基板之间的结的可靠性的合金焊料。 根据本发明的另一个示例性实施例，可以在半导体芯片和基板之间存在锡 - 铋（Sn-Bi）族合金焊料，以及使用该合金焊料的半导体器件。 半导体器件可以包括形成有多个金凸块的半导体芯片，具有连接到金凸块的金属布线的基板以及插入在金凸块和金属布线之间并连接金凸块和金属布线的锡 - 铋系合金焊料的接合部。

公开(公告)号：US20080242000A1

公开(公告)日：2008-10-02

申请号：US12139771

申请日：2008-06-16

Applicant: Yong-hwan KWON ,  Chung-sun LEE ,  Woon-byung KANG

Inventor： Yong-hwan KWON ,  Chung-sun LEE ,  Woon-byung KANG

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate.

Abstract translation: 公开了一种晶片级芯片级封装及相关的制造方法。 晶片级芯片级封装包括半导体衬底，其包括集成电路，设置在半导体衬底上并与集成电路电连接的导电球，以及由绝缘材料形成并设置在底表面和侧表面上的保护部分 的半导体衬底。

公开(公告)号：US20080235727A1

公开(公告)日：2008-09-25

申请号：US11927820

申请日：2007-10-30

Applicant: Ki-ae Seong ,  Yong-hwan Kwon

Inventor： Ki-ae Seong ,  Yong-hwan Kwon

IPC: G06F3/00

CPC classification number: H04N5/44543 ,  H04N21/4312 ,  H04N21/482

Abstract: A broadcast receiving apparatus which displays broadcast program listing information is disclosed. The broadcast receiving apparatus includes an EPG processor which configures an EPG screen displaying broadcast programs listing information as a plurality of icons, and a display unit which displays the EPG screen configured by the EPG processor. Accordingly, a user can select desired broadcast program quickly and easily.

Abstract translation: 公开了一种显示广播节目列表信息的广播接收装置。 广播接收装置包括EPG处理器，其配置显示广播节目列表信息作为多个图标的EPG画面;以及显示单元，显示由EPG处理器配置的EPG画面。 因此，用户可以快速且容易地选择所需的广播节目。

公开(公告)号：US20080083983A1

公开(公告)日：2008-04-10

申请号：US11850184

申请日：2007-09-05

Applicant: Hyang-sun JANG ,  Yong-hwan KWON ,  Un-byoung KANG ,  Chung-sun Lee ,  Woon-seong KWON

Inventor： Hyang-sun JANG ,  Yong-hwan KWON ,  Un-byoung KANG ,  Chung-sun Lee ,  Woon-seong KWON

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/1147 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/013

Abstract: In one aspect, a bump electrode of a semiconductor device is formed by providing a substrate including a pad electrode, forming a seed layer over the pad electrode, and forming a mask layer over the seed layer which includes an opening aligned over the pad electrode. A barrier plating layer is electroplated within the opening over the seed layer, and a bump plating layer is electroplated over the barrier plating layer. The mask layer is removed, and the seed layer is etched using the bump plating layer as a mask.

Abstract translation: 一方面，通过提供包括焊盘电极的基板，在焊盘电极上形成种子层，以及在种子层上形成掩模层，形成半导体器件的突起电极，该掩模层包括在焊盘电极上对准的开口。 在种子层的开口内电镀阻挡层，在阻挡镀层上电镀凸点镀层。 去除掩模层，并使用凸块镀层作为掩模蚀刻种子层。

公开(公告)号：US20080054456A1

公开(公告)日：2008-03-06

申请号：US11828409

申请日：2007-07-26

Applicant: Un-byoung KANG ,  Yong-hwan KWON ,  Chung-sun LEE ,  Woon-seong KWON ,  Hyung-sun JANG

Inventor： Un-byoung KANG ,  Yong-hwan KWON ,  Chung-sun LEE ,  Woon-seong KWON ,  Hyung-sun JANG

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/73203 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A semiconductor package includes a semiconductor chip operatively attached to a conductive lead of a film circuit substrate by an indium-containing solder material and a silver-containing bump electrode, where the solder material is interposed between the conductive lead and the bump electrode.

Abstract translation: 半导体封装包括通过含铟焊料材料和含银凸点电极可操作地附接到膜电路基板的导电引线的半导体芯片，其中焊料材料插入在导电引线和凸块电极之间。

公开(公告)号：US07331723B2

公开(公告)日：2008-02-19

申请号：US11486493

申请日：2006-07-14

Applicant: Ho Gyeong Yoon ,  Kwang Seong Choi ,  Yong Hwan Kwon ,  Joong Seon Choe

Inventor： Ho Gyeong Yoon ,  Kwang Seong Choi ,  Yong Hwan Kwon ,  Joong Seon Choe

IPC: G02B6/36 ,  H01P1/02

CPC classification number: G02B6/4201 ,  G02B6/4279

Abstract: Provided are an enhanced structure of a coplanar waveguide that is a kind of transmission line used for optical communication for radio frequency (RF), and an optical communication module employing the same. While having a basic structure including a conductive strip and ground strips at both sides of the conductive strip on a dielectric substrate, the coplanar waveguide has the structure in which metal patterns of a portion of the conductive strip located around points where an RF propagation direction is changed and of a portion of an inside ground strip are removed to make electrical lengths of an outside ground strip and the inside ground strip similar each other. Using the coplanar waveguide, it is possible to fabricate an optical module that has an optimized RF characteristic and also can freely change an RF propagation direction of several tens GHz, without an additional process.

Abstract translation: 提供作为用于射频（RF）的光通信的一种传输线的共面波导的增强结构以及采用该共面波导的光通信模块。 虽然在电介质基板上具有在导电条的两侧的导电条和接地条的基本结构，但共面波导具有如下结构：导电条的一部分的金属图案位于射频传播方向为 去除内部接地条的一部分以使外部接地条和内部接地条的电长度彼此相似。 使用共面波导，可以制造具有优化的RF特性的光学模块，并且还可以自由地改变几十GHz的RF传播方向，而无需额外的处理。