公开(公告)号：US06215649B1

公开(公告)日：2001-04-10

申请号：US09186583

申请日：1998-11-05

申请人： Bernd K. Appelt ,  John M. Lauffer

发明人： Bernd K. Appelt ,  John M. Lauffer

IPC分类号： H01G420

CPC分类号： H05K1/162 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5102

摘要： A capacitive element for a circuit board or chip carrier having improved capacitance and method of manufacturing the same is provided. The structure is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets at least one of which can be partially cured or softened followed by being fully cured or hardened. The lamination takes place by laminating a partially cured or softened sheet to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils; thus the single dielectric sheets does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness. The use of two or more sheets of dielectric material makes it very unlikely that two or more defects in the sheets of dielectric material will align thus greatly reducing the probability of a defect causing a failure in test or field use.

摘要翻译： 提供了一种用于具有改进电容的电路板或芯片载体的电容元件及其制造方法。 该结构由一对导电片形成，其间具有介质成分。 电介质部件由两个或更多个电介质片形成，其中至少一个电介质片可被部分固化或软化，然后完全固化或硬化。 通过将部分固化或软化的片材层压到至少一种其它电介质材料片和导电材料片之一中来进行层压。 两片电介质组件的总厚度不超过约4密耳，优选不超过约3密耳; 因此单个电介质片材的厚度不超过约2密耳，优选不超过约1.5密耳。 使用两层或更多层电介质材料使得介电材料片中的两个或多个缺陷非常不可能对齐，从而大大降低了导致测试或现场使用失败的缺陷的可能性。

公开(公告)号：US5305186A

公开(公告)日：1994-04-19

申请号：US9958

申请日：1993-01-27

申请人： Bernd K. Appelt ,  Irv Memis ,  Richard A. Schumacher ,  John M. Lauffer

发明人： Bernd K. Appelt ,  Irv Memis ,  Richard A. Schumacher ,  John M. Lauffer

IPC分类号： H01L23/12 ,  H01L23/36 ,  H01L23/367 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20

CPC分类号： H01L23/36 ,  H01L23/367 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01087 ,  H01L2924/14

摘要： A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.

摘要翻译： 提供一种微电子封装，其包括具有功率芯片的电路载体，集成电路装置和用于承载来自微电子封装件的热的热传导装置。 热传导装置包括与功率芯片相关联的第一散热背板装置和与集成电路装置相关联的第二散热背板装置。 散热背板装置彼此电隔离并具有不同的散热能力。

公开(公告)号：US5214250A

公开(公告)日：1993-05-25

申请号：US762201

申请日：1991-09-19

申请人： Burtran J. Cayson ,  John A. Covert ,  Steven A. Duncan ,  John M. Lauffer ,  Issa S. Mahmoud ,  Richard A. Schumacher

发明人： Burtran J. Cayson ,  John A. Covert ,  Steven A. Duncan ,  John M. Lauffer ,  Issa S. Mahmoud ,  Richard A. Schumacher

IPC分类号： H05K3/22 ,  H01L21/48 ,  H05K3/46

CPC分类号： H01L21/485 ,  H05K3/4664 ,  H05K3/4685 ,  Y10T29/49155

摘要： Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another.

公开(公告)号：US5189261A

公开(公告)日：1993-02-23

申请号：US598466

申请日：1990-10-09

申请人： Lawrence C. Alexander ,  Bernd K. Appelt ,  David K. Balkin ,  James J. Hansen ,  Joseph Hromek ,  Ronald A. Kaschak ,  John M. Lauffer ,  Irving Memis ,  Magan S. Patel ,  Andrew M. Seman ,  Robin A. Susko

发明人： Lawrence C. Alexander ,  Bernd K. Appelt ,  David K. Balkin ,  James J. Hansen ,  Joseph Hromek ,  Ronald A. Kaschak ,  John M. Lauffer ,  Irving Memis ,  Magan S. Patel ,  Andrew M. Seman ,  Robin A. Susko

IPC分类号： H05K1/11 ,  H01L23/538 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H05K7/20

CPC分类号： H01L23/5384 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/44 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/09554 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10871 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/128 ,  H05K3/0035 ,  Y10S428/901 ,  Y10T29/49155

摘要： Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.

摘要翻译： 电介质基板的相对的主表面上包含金属层的电路板或卡片，从而在金属层之间提供电和/或热互连，其通孔延伸穿过金属层之一以及电介质基板并进入另一金属层。