Chemical vapor deposition precursors for deposition of copper
    134.
    发明授权
    Chemical vapor deposition precursors for deposition of copper 失效
    用于沉积铜的化学气相沉积前体

    公开(公告)号:US06822107B1

    公开(公告)日:2004-11-23

    申请号:US10643272

    申请日:2003-08-19

    IPC分类号: C07F108

    摘要: Copper precursors of the formula (I): wherein: Cu is Cu(I) or Cu(II); x is an integer having a value of from 0 to 4; each of R, R′ and R″ may be the same as or different from one another and each is independently selected from the group consisting of H, C1-C6 alky), C1-C6 perfluoroalkyl and C6-C10 aryl; when Cu is Cu(I), A is a Lewis base; when Cu is Cu(II), A is: wherein x, R, R′ and R″ are as specified above.

    摘要翻译: 式(I)的铜前体:其中:Cu是Cu(I)或Cu(II); x是0至4的整数; R,R'和R“可以相同 各自独立地选自H,C 1 -C 6烷基),C 1 -C 6全氟烷基和C 6 -C 10芳基;当Cu是Cu(I)时,A是路易斯碱;当Cu 是Cu(II),A是:其中x,R,R'和R“如上所述。

    Micro-machined thin film sensor arrays for the detection of H2 containing gases, and method of making and using the same
    137.
    发明授权
    Micro-machined thin film sensor arrays for the detection of H2 containing gases, and method of making and using the same 有权
    用于检测含H2气体的微加工薄膜传感器阵列及其制造和使用方法

    公开(公告)号:US06596236B2

    公开(公告)日:2003-07-22

    申请号:US09828115

    申请日:2001-04-06

    IPC分类号: G01N700

    摘要: The present invention provides a hydrogen sensor including a thin film sensor element formed by metal organic chemical vapor deposition (MOCVD) or physical vapor deposition (PVD), on a micro-hotplate structure. The thin film sensor element includes a film of a hydrogen-interactive metal film that reversibly interacts with hydrogen to provide a correspondingly altered response characteristic, such as optical transmissivity, electrical conductance, electrical resistance, electrical capacitance, magneto resistance, photoconductivity, etc., relative to the response characteristic of the film in the absence of hydrogen. The hydrogen-interactive metal film may be overcoated with a thin film hydrogen-permeable barrier layer to protect the hydrogen-interactive film from deleterious interaction with non-hydrogen species. The hydrogen permeable barrier may comprise species to scavenge oxygen and other like species. The hydrogen sensor of the invention may be usefully employed for the detection of hydrogen in an environment susceptible to the incursion or generation of hydrogen and may be conveniently configured as a hand-held apparatus.

    摘要翻译: 本发明提供一种氢传感器,其包括在微电镀板结构上由金属有机化学气相沉积(MOCVD)或物理气相沉积(PVD)形成的薄膜传感器元件。 薄膜传感器元件包括与氢可逆地相互作用以提供相应改变的响应特性(例如光透射率,电导率,电阻,电容,磁阻,光电导等)的氢相互作用金属膜的膜, 相对于不存在氢气时膜的响应特性。 氢相互作用金属膜可以用薄膜氢可渗透阻挡层进行外涂,以保护氢相互作用膜免受与非氢物质的有害相互作用。 氢可渗透屏障可以包括清除氧气和其它类似物质的物质。 本发明的氢传感器可有效地用于在易于入侵或产生氢的环境中检测氢气,并且可以方便地配置为手持设备。

    Composition and process for production of copper circuitry in microelectronic device structures
    138.
    发明授权
    Composition and process for production of copper circuitry in microelectronic device structures 失效
    在微电子器件结构中生产铜电路的组成和工艺

    公开(公告)号:US06589329B1

    公开(公告)日:2003-07-08

    申请号:US09522102

    申请日:2000-03-09

    IPC分类号: C23C1616

    CPC分类号: C23C16/18 C07F1/08 C07F7/0803

    摘要: Compositions useful for chemical vapor delivery (CVD) formation of copper layers in semiconductor integrated circuits, e.g., interconnect metallization in semiconductor device structures, as an adhesive seed layer for plating, for the deposition of a thin-film recording head or for circuitization of packaging components. The copper precursor formulation may include one or more copper precursors, e.g., a precursor of the formula hfac(Cu)L where L is a low-cost ligand such as an alkene and/or alkyne such as [(hfac)Cu]2 (DMDVS). The formulation may include in addition to the copper precursor(s) one or more low-cost ligand species such as alkenes, alkynes, dienes and combinations thereof, to increase thermal stability of the formulation and provide enhanced vaporization properties for CVD.

    摘要翻译: 可用于半导体集成电路中铜层的化学气相传输(CVD)形成的组合物,例如半导体器件结构中的互连金属化,用于电镀的粘合种子层,用于沉积薄膜记录头或用于封装的电路化 组件。 铜前体制剂可以包括一种或多种铜前体,例如式hfac(Cu)L的前体,其中L是低成本配体如烯烃和/或炔烃,例如[(hfac)Cu] 2( DMDVS)。 除了铜前体之外,配方可以包括一种或多种低成本配体物质,例如烯烃,炔,二烯及其组合,以增加制剂的热稳定性并提供CVD的增强的气化性质。

    Method of forming Group II metal-containing films utilizing Group II MOCVD source reagents
    140.
    发明授权
    Method of forming Group II metal-containing films utilizing Group II MOCVD source reagents 失效
    使用II族MOCVD源试剂形成含II族金属的膜的方法

    公开(公告)号:US06338873B1

    公开(公告)日:2002-01-15

    申请号:US09610822

    申请日:2000-07-06

    IPC分类号: C23C1600

    摘要: Novel Group II metal MOCVD precursor compositions are described having utility for MOCVD of the corresponding Group II metal-containing films. The complexes are Group II metal &bgr;-diketonate Lewis base adducts having ligands such as: (i) amines bearing terminal NH2 groups; (ii) imine ligands formed as amine (i)/carbonyl reaction products; (iii) combination of two or more of the foregoing ligands (i)-(ii), and (iv) combination of one or more of the foregoing ligands (i)-(ii) with one or more other ligands or solvents. The source reagent complexes of barium and strontium are usefully employed in the formation of barium strontium titanate and other Group II doped thin-films on substrates for microelectronic device applications, such as integrated circuits, ferroelectric memories, switches, radiation detectors, thin-film capacitors, microelectromechanical structures (MEMS) and holographic storage media.

    摘要翻译: 描述了新的第II族金属MOCVD前体组合物用于相应的含II族金属膜的MOCVD。 络合物是具有配体的II族金属β-二酮酸酯路易斯碱加成物,其具有:(i)带有末端NH 2基团的胺; (ii)以胺(i)/羰基反应产物形成的亚胺配体; (iii)上述配体(i) - (ii)中的两种或更多种的组合,和(iv)一种或多种前述配体(i) - (ii)与一种或多种其它配体或溶剂的组合。 钡和锶的源试剂络合物可用于形成钛酸锶钡和其他第II类掺杂薄膜在用于微电子器件应用的衬底上,例如集成电路,铁电存储器,开关,辐射探测器,薄膜电容器 ,微机电结构(MEMS)和全息存储介质。