METHOD AND SYSTEM FOR REPLICATING RING BACK TONES
    144.
    发明申请
    METHOD AND SYSTEM FOR REPLICATING RING BACK TONES 有权
    方法和系统用于替换回音

    公开(公告)号:US20090116632A1

    公开(公告)日:2009-05-07

    申请号:US12271143

    申请日:2008-11-14

    Abstract: The present invention, in one aspect, relates to a method for replicating ring back tone (RBT). In one embodiment, the method includes the steps of sending a Play and Collect request to a media resource server (MRS) by an application server (AS), playing an RBT subscribed by the called party to the calling party and obtaining a Replicate RBT request initiated by the calling party according to the Play and Collect request by the MRS, receiving the Replicate RBT request obtained and sent by the MRS, by the AS, and sending a Replicate RBT command to an RBT platform according to the received Replicate RBT request by the AS, the Replicate RBT command carrying RBT replication information and instructing the RBT platform to replicate the requested RBT to an information library of the calling party. The invention also relates to a system and apparatus for implementing same.

    Abstract translation: 本发明在一个方面涉及一种用于复制回铃音(RBT)的方法。 在一个实施例中,该方法包括以下步骤:由应用服务器(AS)向媒体资源服务器(MRS)发送播放和收集请求,播放由被叫方向主叫方订阅的RBT并获得复制RBT请求 由主叫方根据MRS的“收发请求”发起,接收由AS获取并由MRS发送的复制RBT请求,并根据收到的复制RBT请求向RBT平台发送复制RBT命令, AS,复制RBT命令携带RBT复制信息,并指示RBT平台将请求的RBT复制到主叫方的信息库。 本发明还涉及一种用于实现其的系统和装置。

    HEAT DISSIPATING SYSTEM
    145.
    发明申请
    HEAT DISSIPATING SYSTEM 失效
    热灭火系统

    公开(公告)号:US20090016017A1

    公开(公告)日:2009-01-15

    申请号:US11842172

    申请日:2007-08-21

    CPC classification number: G06F1/20

    Abstract: A heat dissipating system comprises a computer enclosure (1), a motherboard (2), at least one dividing panel (271), at least one heat generating element, and at least one heat dissipating device. The computer enclosure has a bottom panel (11). The motherboard is mounted on and substantially parallel to the bottom panel. The at least one dividing panel is perpendicularly attached to the motherboard. The computer enclosure and the at least one dividing panel cooperatively form at least two heat dissipating chambers. The at least one heat generating element is disposed in each of the at least two chambers. The at least one heat dissipating device is disposed in each of the at least two heat dissipating chambers.

    Abstract translation: 散热系统包括计算机外壳(1),主板(2),至少一个分隔板(271),至少一个发热元件和至少一个散热装置。 计算机外壳具有底板(11)。 主板安装在底板上并基本上平行于底板。 至少一个分隔板垂直地附接到主板。 计算机外壳和至少一个分隔板协同地形成至少两个散热室。 至少一个发热元件设置在至少两个室中的每一个中。 至少一个散热装置设置在至少两个散热室中的每一个中。

    Light-emitting diode and manufacturing method thereof
    150.
    发明授权
    Light-emitting diode and manufacturing method thereof 有权
    发光二极管及其制造方法

    公开(公告)号:US07432117B2

    公开(公告)日:2008-10-07

    申请号:US11232633

    申请日:2005-09-22

    CPC classification number: H01L33/642 H01L33/0079 H01L33/20 H01L33/641

    Abstract: A light-emitting diode and the manufacturing method thereof are provided, wherein the light-emitting diode comprises an epitaxial structure, a bonding layer and a composite substrate. The bonding layer located over one side of the epitaxial structure is used for adhering the composite substrate to the epitaxial structure. The composite substrate comprises a patterned silicon layer penetrated through by a plurality of openssilicon, and a metal layer covering the patterned silicon layer, wherein a portion of the metal layer is filled into the opens and contacts the bonding layer.

    Abstract translation: 提供了一种发光二极管及其制造方法,其中发光二极管包括外延结构,接合层和复合衬底。 位于外延结构一侧的结合层用于将复合衬底粘附到外延结构上。 复合衬底包括穿过多个开硅硅的图案化硅层和覆盖图案化硅层的金属层,其中金属层的一部分被填充到开口中并与接合层接触。

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