摘要:
A etch stop layer for use in a silicon oxide dry fluorine etch process is made of silicon nitride with hydrogen incorporated in it either in the form of N--H bonds, O--H bonds, or entrapped free hydrogen. The etch stop layer is made by either increasing the NH.sub.3 flow, decreasing the SiH.sub.4 flow, decreasing the nitrogen flow, or all three, in a standard PECVD silicon nitride fabrication process. The etch stop can alternatively be made by pulsing the RF field in either a PECVD process or an LPCVD process.
摘要:
A wire serves as a gettering material which is wire-bonded to electrical connections which lead outside of a vacuum sealed package. The wire can be activated to create and maintain a high integrity vacuum environment. The "getter" can be either heat activated or evaporated by the passing of an AC or DC current through the wire.
摘要:
The present invention is directed to a novel etching process for a semiconductor material which inhibits corrosion of metal comprised of pretreating the material, preferably with a surfactant, and then exposing the material to a mixture comprising salt, a buffered oxide etch, and optionally a surfactant.
摘要:
A field emission display includes a display screen and a cathodoluminescent coating disposed on a conductive inner surface of the display screen. An extraction grid is disposed a predetermined distance away from the inner surface and has a plurality of openings. A plurality of emitters are each aligned with a corresponding one of the openings and are arranged in sets that include at least one emitter. A plurality of emitter driver circuits are each coupled to the emitters in a corresponding one of the sets. Each of the driver circuits receives a control signal having first and second values. The drive circuits drive the emitters such that the display screen displays an image having a first brightness level when the control signal has the first value, and drives the emitters such that the display screen displays an image having a second brightness level when the control signal has the second value. The ratio of the second brightness level to the first brightness level is significantly greater than the ratio of the second value of the control signal to the first value. In one aspect of the invention, each of the driver circuits includes an impedance element that has a nonlinear current-voltage characteristic to give the described ratios.
摘要:
A process is provided for forming spacers useful in large area displays. The process comprises steps of: forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.
摘要:
A method of electrically testing pixel functionality is provided comprising releasably disposing a wafer in a socket. The wafer has at least one baseplate comprised of cathode emitters arranged in pixels. The socket has pads. The socket pads are contacted with test pins, and each of the pixels is addressed individually, thereby causing the cathode emitters to emit electrons in a current. The current is collected from each of the pixels on an anode screen. Alternatively, the anode card may have pins, and these pins contact pads on the baseplate. The baseplate, or substrate with baseplates, does not require a socket with pins.
摘要:
Disclosed is a multi-plans sputtering target and a method of using the multi-planar sputtering target in PVD sputtering for filling high aspect ratio interconnect structure openings. The multi-planar sputtering target comprises at least two planar sheets of conductive filler material joined together at a common edge with a selected angle between them. The multi-planar sputtering target is situated in a manner whereby an interior portion is facing an semiconductor wafer that is to be filled. The angle of the planes of the multiplanar sputtering target relative to the semiconductor wafer is selected such that a primary concentration of sputtered material is directed in either a normal angle of trajectory, or in a selected angle of trajectory that is selected for filling bottom corners of the interconnect structure opening. An ion acceleration grid can be used to vary the focus of an ion beam on different planar sheets of the multi-planar sputtering target so that different angles of trajectory of sputtered material can be employed in filling the interconnect structure opening. A magnetic field can also be used to correct the occurrence of center to edge non-uniformity.
摘要:
A selective etching and chemical mechanical planarization process is employed for the formation of self-aligned gate and focus ring structures surrounding an electron emission tip for use in field emission displays. The process is employed to construct an emission grid whereby the gate structure is capable of producing a field strength at the cathode tip sufficient to generate electron emission. The gate is disposed at a location above the tip such that the gate physically intercepts the outermost lateral portions of the beam, yet does not induce a significant electrostatic outward divergence of the beam, thereby reducing the cross-section of the beam.
摘要:
A baseplate for a flat panel display comprising relatively thick semiconductor substrate, wherein the semiconductor substrate is a macro-grain polycrystalline substrate, which is amorphized by ion implantation or reformed by recrystallization, to obscure the grain boundaries, thereafter redundant circuitry may be fabricated thereon to further enhance product yield.
摘要:
A method for forming high aspect ratio features such as trenches in a semiconductor structure includes dry etching a substrate in a glow discharge system at elevated temperature. With the dry etching carried out at an elevated temperature of between about 300.degree. to 1100.degree. C., the diffusion of a reactant gas into the features is increased and the diffusion of byproduct molecules out of the features is increased. This increases the etch rate for forming the features, and allows features with very high aspect ratio to be formed at a high etch rate.