公开(公告)号：US20170211971A1

公开(公告)日：2017-07-27

申请号：US15326702

申请日：2015-07-17

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki Tanaka ,  Yasuto Ishimaru ,  Yuichi Tsujita

IPC: G01J1/04 ,  G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0425 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0403 ,  G01J1/0407 ,  G01J1/0414 ,  G01J1/4204 ,  G02B6/42

Abstract: There is provided an optical sensor in which a reduction in size of a light-receiving part is achieved. This optical sensor is installed in a device, and includes a light-receiving element 4 for receiving light coming from outside toward the device. The optical sensor detects the state of the received light. A linear optical waveguide 2 is connected to the light-receiving element 4 so as to be capable of light propagation. The optical waveguide 2 has a front end portion serving as a light entrance portion on which light coming from the outside of the device is incident.

公开(公告)号：US09691800B2

公开(公告)日：2017-06-27

申请号：US14818740

申请日：2015-08-05

Applicant: SK hynix Inc.

Inventor： Yun-Hui Yang

IPC: H01L27/146 ,  G01J1/44 ,  G01J1/02 ,  G01J1/06 ,  G01J3/02 ,  G01J1/04

CPC classification number: H01L27/14607 ,  G01J1/0209 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/44 ,  G01J3/0208 ,  G01J3/0259 ,  G01J3/0262 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

Abstract: An image sensor includes a substrate including photoelectric conversion elements for a plurality of unit pixels, which are two-dimensionally arranged in a pixel array; a light transmission member on the substrate; a grid structure in the light transmission member and having multiple layers; and a light collection member on the light transmission member, wherein the grid structure is tilted for respective chief ray angles of the plurality of unit pixels according to locations of the plurality of unit pixels in the pixel array.

公开(公告)号：US09606294B2

公开(公告)日：2017-03-28

申请号：US15222956

申请日：2016-07-29

Applicant: Industrial Technology Research Institute

Inventor： Kai-Ning Ku ,  Chih-Lin Wang ,  Shang-Chun Chen

IPC: G02B6/30 ,  G02B6/12 ,  H01S5/042 ,  H01S5/12

CPC classification number: G02B6/34 ,  G01J1/0209 ,  G01J1/0407 ,  G01J1/0422 ,  G02B6/12004 ,  G02B6/305 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4298 ,  G02B2006/12121 ,  G02B2006/12147 ,  H01S5/0425 ,  H01S5/12 ,  H04B10/079 ,  H05K3/30 ,  H05K2203/0147 ,  H05K2203/163

Abstract: An optical component optically coupled to an optical fiber includes a substrate and an edge-emitting laser. The substrate includes an accommodating cavity, a plurality of openings, a waveguide, an optical coupler and a plurality of pads. The waveguide and the optical coupler are distributed outside the accommodating cavity. The openings are distributed at the bottom surface of the accommodating cavity and the pads are located at the bottom of the openings. The optical coupler is optically coupled to an end of the waveguide and includes a light-incident surface. The edge-emitting laser is embedded in the accommodating cavity and includes a light-emitting layer and a plurality of bumps located in the openings and electrically connected to the pads. The ratio of the level height difference between the light-emitting layer and the optical coupler to the thickness of the optical coupler ranges from 0 to 0.5.

公开(公告)号：US20170003165A1

公开(公告)日：2017-01-05

申请号：US14755745

申请日：2015-06-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Orit SKORKA ,  Salman KABIR

IPC: G01J1/44 ,  G01J1/04 ,  H01L27/146 ,  G01J1/02

CPC classification number: G01J1/44 ,  G01J1/0209 ,  G01J1/0411 ,  G01J1/0488 ,  G01J2001/446 ,  G01J2001/448 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685

Abstract: An image sensor with an array of pixels is provided. In order to achieve high image quality, it may be desirable to improve well capacity of individual pixels within the array by forming deep photodiodes in a thick substrate. When forming the array of pixels, conductive contacts may be formed in a back surface of the substrate opposing ground contacts located on a front side of the substrate. A conductive grid layer may be formed over the conductive contacts. A color filter layer may be formed over the conductive grid layer that may include a barrier grid in which color filter material is deposited. The conductive grid layer and conductive contacts may be biased to a voltage to improve the strength of electric fields in the substrate. Conductive contacts will thereby improve charge collection and electrical isolation and prevent electrical crosstalk and blooming.

Abstract translation: 提供具有像素阵列的图像传感器。 为了实现高图像质量，可能需要通过在厚衬底中形成深度光电二极管来提高阵列内的各个像素的良好容量。 当形成像素阵列时，可以在衬底的背面中形成导电触点，该衬底的相对于位于衬底前侧的接地触点。 可以在导电触点上形成导电栅格层。 可以在导电栅格层上形成滤色器层，其可以包括其中沉积滤色器材料的阻挡栅格。 导电栅格层和导电触点可以被偏压到电压以改善衬底中的电场强度。 因此，导电接触将改善电荷收集和电隔离，并防止电串扰和起霜。

公开(公告)号：US09392231B2

公开(公告)日：2016-07-12

申请号：US14099165

申请日：2013-12-06

Applicant: Panasonic Corporation

Inventor： Katsuhiro Kanamori ,  Toshinobu Matsuno

IPC: H04N7/18 ,  A61B1/00 ,  A61B1/05 ,  A61B1/07 ,  G01J1/02 ,  G01J1/04 ,  G01J4/04 ,  H04N5/225 ,  H04N5/235 ,  H04N9/04

CPC classification number: H04N7/18 ,  A61B1/00186 ,  A61B1/05 ,  A61B1/051 ,  A61B1/07 ,  G01J1/0209 ,  G01J1/0411 ,  G01J4/04 ,  H04N5/2254 ,  H04N5/2256 ,  H04N5/2354 ,  H04N9/045 ,  H04N2005/2255

Abstract: In image capturing processor in one embodiment comprises: an image capturing section including an image sensor that captures a polarization image of an object being illuminated with an illuminating light beam; and an image processing section. The image processing section has: a light intensity image generator which generates a light intensity image based on the output of the image sensor; a polarization degree image generator which generates a polarization degree image by calculating the degree of polarization on a pixel-by-pixel basis; a retouching section which generates a retouched polarization image by enhancing the degree of polarization of the polarization degree image at depressions on a micro-geometric surface of the object and by correcting at least one of its hue, saturation and value; and an image synthesizing section which synthesizes the retouched polarization image and the light intensity image together.

Abstract translation: 在一个实施例中的图像捕获处理器中包括：图像捕获部分，包括捕获被照明光束照射的物体的偏振图像的图像传感器; 和图像处理部。 图像处理部具有：基于图像传感器的输出生成光强度图像的光强度图像生成部; 偏振度图像生成器，其通过以逐像素为基础计算偏振度来生成偏振度图像; 修饰部分，其通过增强物体的微几何表面上的凹陷处的偏振度图像的偏振度并且通过校正其色调，饱和度和值中的至少一个来产生经修饰的偏振图像; 以及将润饰的偏振图像和光强度图像合成在一起的图像合成部。

公开(公告)号：US09329423B2

公开(公告)日：2016-05-03

申请号：US14515042

申请日：2014-10-15

Applicant: SAMSUNG DISPLAY CO., LTD

Inventor： Dong-Kwon Kim ,  Hyung-Guel Kim ,  Jun-Ho Song ,  Nam-Heon Kim ,  Joo-Hyung Lee ,  Sung-Hoon Yang ,  Kyung-Hun Yoon ,  Myung-Hum Shin ,  Jae-Hyun Cho

IPC: G02F1/1335 ,  G02F1/13 ,  G09G3/36 ,  G06F3/042 ,  G02F1/1333 ,  G06F3/041 ,  G01J1/02 ,  G01J1/04 ,  G01J1/42 ,  G02F1/1362

CPC classification number: G02F1/13338 ,  G01J1/02 ,  G01J1/0209 ,  G01J1/0219 ,  G01J1/0488 ,  G01J1/4228 ,  G02F1/133345 ,  G02F1/133603 ,  G02F1/136209 ,  G02F2001/136222 ,  G02F2203/11 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/0421

Abstract: In a sensing device and a method for sending a light by using the same, the sensing device includes: a lower panel; an upper panel facing the lower panel; a liquid crystal layer disposed between the lower panel and the upper panel; an infrared ray sensor formed in at least one of the lower panel and the upper panel; and a visible ray sensor formed in at least one of the lower panel and the upper panel. The sensing device simultaneously includes the infrared ray sensor and the visible ray sensor such that a touch sensing function or an image sensing function having high reliability may be realized.

Abstract translation: 在感测装置和通过使用其发送光的方法中，感测装置包括：下面板; 面向下面板的上面板; 设置在下板和上板之间的液晶层; 形成在所述下板和所述上板中的至少一个中的红外线传感器; 以及形成在所述下面板和所述上面板中的至少一个中的可见光线传感器。 感测装置同时包括红外线传感器和可见光线传感器，使得可以实现具有高可靠性的触摸感测功能或图像感测功能。

公开(公告)号：US09151663B2

公开(公告)日：2015-10-06

申请号：US13748854

申请日：2013-01-24

Applicant: HITACHI CABLE, LTD.

Inventor： Juhyun Yu ,  Hiroki Yasuda ,  Kouki Hirano ,  Yoshinori Sunaga

IPC: G01J1/02 ,  G02B6/42

CPC classification number: G01J1/0204 ,  G01J1/0209 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4265 ,  G02B6/428

Abstract: An optical module includes a circuit board including a mount surface and a non-mount surface opposite the mount surface, a photoelectric conversion element mounted on the mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board, and electrically connected to the photoelectric conversion element, a plate-shaped supporting member arranged so as to sandwich the optical coupling member between the supporting member and the circuit board, and an electrically conductive body supported by the supporting member, extended in a thickness direction of the supporting member, and connected at one end to an electrode provided on the non-mount surface of the circuit board.

Abstract translation: 光学模块包括电路板，其包括安装表面和与安装表面相对的非安装表面，安装在电路板的安装表面上的光电转换元件，用于保持光纤并光学耦合的光耦合元件 光纤和光电转换元件，安装在电路板的安装表面上并与光电转换元件电连接的半导体电路元件，布置成将光耦合元件夹在支撑元件和 电路板和由支撑构件支撑的导电体，其在支撑构件的厚度方向上延伸，并且一端连接到设置在电路板的非安装表面上的电极。

公开(公告)号：US09146154B2

公开(公告)日：2015-09-29

申请号：US14014334

申请日：2013-08-29

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： I-Thun Lin

IPC: G02B6/36 ,  G01J1/02 ,  G01J1/42 ,  G02B6/42 ,  G02B6/32

CPC classification number: G01J1/0271 ,  G01J1/0209 ,  G01J1/029 ,  G01J1/0411 ,  G01J1/4228 ,  G01J2001/0276 ,  G02B6/32 ,  G02B6/42

Abstract: A photoelectric conversion device includes a circuit board, light-emitting modules, light-receiving modules, an optical coupling module, and a protecting member. The light-emitting modules and the light-receiving modules are mounted on the circuit board. The optical coupling module is mounted on the circuit board, and includes first and second optical surfaces, a reflection surface, first converging lenses formed on the first optical surface and corresponding to the light-emitting modules and the light-receiving modules, and second converging lenses formed on the second optical surface and corresponding to the first converging lenses. The protecting member is mounted on the circuit board to shield the optical coupling module, the light-emitting modules, and the light-receiving modules, and only exposes the second converging lenses.

Abstract translation: 光电转换装置包括电路板，发光模块，光接收模块，光耦合模块和保护构件。 发光模块和光接收模块安装在电路板上。 光耦合模块安装在电路板上，包括第一和第二光学表面，反射表面，形成在第一光学表面上并对应于发光模块和光接收模块的第一会聚透镜，以及第二会聚 形成在第二光学表面上并对应于第一会聚透镜的透镜。 保护构件安装在电路板上以屏蔽光耦合模块，发光模块和光接收模块，并且仅暴露第二会聚透镜。

公开(公告)号：US20150198479A1

公开(公告)日：2015-07-16

申请号：US14590091

申请日：2015-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong-Je CHO ,  Kwang-Bok KIM ,  Jae-Geol CHO ,  Jae-Hong KIM ,  Sun-Tae JUNG ,  Chul-Ho CHO

IPC: G01J1/04 ,  G01J1/50 ,  G01J1/42

CPC classification number: G01J1/0488 ,  G01J1/0209 ,  G01J1/0414 ,  G01J1/0418 ,  G01J1/0425 ,  G01J1/06 ,  G01J1/429 ,  G01J1/48 ,  G01J1/50

Abstract: An optical sensor and an electronic device having an optical sensor. The optical sensor includes: an optical waveguide containing a photochromic material; a light emitter that emits visible light to be incident on the optical waveguide; and a light receiver that detects the visible light emitted from the light emitter and progressing through the optical waveguide. A transmittance of the optical waveguide in relation to the visible light may be changed by the photochromic material as the optical waveguide is exposed to UV light. The optical sensor and the electronic device having the same may be variously implemented according to exemplary embodiments.

Abstract translation: 一种具有光学传感器的光学传感器和电子设备。 光学传感器包括：含有光致变色材料的光波导; 发射入射在光波导上的可见光的发光体; 以及光接收器，其检测从光发射器发射并在光波导中前进的可见光。 当光波导暴露于紫外光时，光波导相对于可见光的透射率可以由光致变色材料改变。 根据示例性实施例，可以对光学传感器和具有该光学传感器和电子设备的电子设备进行各种实现。

公开(公告)号：US08724100B1

公开(公告)日：2014-05-13

申请号：US13694047

申请日：2012-10-22

Applicant: Mehdi Asghari ,  Dazeng Feng

Inventor： Mehdi Asghari ,  Dazeng Feng

IPC: G01N21/00

CPC classification number: G01J1/0425 ,  G01J1/0209 ,  G01J1/08 ,  G01J2001/083 ,  G01J2001/4247 ,  G02B6/12004 ,  G02B6/125 ,  G02B2006/12097

Abstract: A wafer includes multiple optical devices that each includes one or more optical components. The optical components include light-generating components that each generates a light signal in response to application of electrical energy to the light-generating component from electronics that are external to the wafer. The optical components also include receiver components that each outputs an electrical signal in response to receipt of light. The wafer also includes testing waveguides that each extends from within a boundary of one of the optical devices across the boundary of the optical device and also provides optical communication between a first portion of the optical components and a second portion of the optical components. The first portion of the optical components includes one or more of the light-generating components and the second portion of the optical components include one or more of the receiver components.

Abstract translation: 晶片包括多个光学器件，每个光学器件包括一个或多个光学部件。 光学部件包括发光部件，每个发光部件响应于从晶片外部的电子器件向发光部件施加电能而产生光信号。 光学部件还包括响应于光的接收而输出电信号的接收器部件。 晶片还包括测试波导，每个波导从光学器件中的一个光学器件的边界内延伸穿过光学器件的边界，并且还提供光学部件的第一部分和光学部件的第二部分之间的光学连通。 光学部件的第一部分包括一个或多个发光部件，并且光学部件的第二部分包括一个或多个接收器部件。