公开(公告)号：US20200234758A1

公开(公告)日：2020-07-23

申请号：US16382045

申请日：2019-04-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C11/54 ,  H01L27/11521 ,  H01L29/423 ,  H01L29/788 ,  G06N3/04 ,  G11C16/10 ,  G11C16/14 ,  G11C16/04

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

公开(公告)号：US20200119028A1

公开(公告)日：2020-04-16

申请号：US16231231

申请日：2018-12-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: H01L27/11531 ,  H01L29/788 ,  G11C16/04 ,  G06N3/08

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

公开(公告)号：US10608090B2

公开(公告)日：2020-03-31

申请号：US16137399

申请日：2018-09-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Chun-Ming Chen ,  Man-Tang Wu ,  Chen-Chih Fan ,  Nhan Do

IPC: H01L29/423 ,  H01L29/08 ,  H01L29/66 ,  H01L21/28 ,  H01L21/02 ,  H01L21/027 ,  H01L21/3105 ,  H01L21/762 ,  H01L21/265 ,  H01L27/11546 ,  H01L27/11521

Abstract: A method of forming a memory device with memory cells in a memory area, and logic devices in first and second peripheral areas. The memory cells each include a floating gate, a word line gate and an erase gate, and each logic device includes a gate. The oxide under the word line gate is formed separately from a tunnel oxide between the floating and erase gates, and is also the gate oxide in the first peripheral area. The word line gates, erase gates and gates in both peripheral areas are formed from the same polysilicon layer. The oxide between the erase gate and a source region is thicker than the tunnel oxide, which is thicker than the oxide under the word line gate.

公开(公告)号：US10600484B2

公开(公告)日：2020-03-24

申请号：US15849268

申请日：2017-12-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Vipin Tiwari ,  Nhan Do ,  Hieu Van Tran

IPC: G11C16/10 ,  G11C11/56 ,  G11C16/04 ,  H01L29/423 ,  H01L29/788

Abstract: An improved programming technique for non-volatile memory cell arrays, in which memory cells to be programmed with higher programming values are programmed first, and memory cells to be programmed with lower programming values are programmed second. The technique reduces or eliminates the number of previously programmed cells from being adversely incrementally programmed by an adjacent cell being programmed to higher program levels, and reduces the magnitude of adverse incremental programming for most of the memory cells, which is caused by floating gate to floating gate coupling. The memory device includes an array of non-volatile memory cells and a controller configured to identify programming values associated with incoming data, and perform a programming operation in which the incoming data is programmed into at least some of the non-volatile memory cells in a timing order of descending value of the programming values.

公开(公告)号：US10580491B2

公开(公告)日：2020-03-03

申请号：US16015020

申请日：2018-06-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Vipin Tiwari ,  Hieu Van Tran ,  Nhan Do ,  Mark Reiten

IPC: G11C5/08 ,  G11C16/04 ,  H01L27/11521 ,  H01L29/788 ,  H01L29/423

Abstract: A memory device includes rows and columns of memory cells, word lines each connected to a memory cell row, bit lines each connected to a memory cell column, a word line driver connected to the word lines, a bit line driver connected to the bit lines, word line switches each disposed on one of the word lines for selectively connecting one memory cell row to the word line driver, and bit line switches each disposed on one of the bit lines for selectively connecting one memory cell column to the bit line driver. A controller controls the word line switches to connect only some of the rows of memory cells to the word line driver at a first point in time, and controls the bit line switches to connect only some of the columns of memory cells to the bit line driver at a second point in time.

公开(公告)号：US20200065023A1

公开(公告)日：2020-02-27

申请号：US16217916

申请日：2018-12-12

Applicant: Silicon Storage Technology, Inc.

Inventor： Viktor Markov ,  Alexander Kotov

IPC: G06F3/06

Abstract: A memory device with memory cells each including source and drain regions with a channel region there between, a floating gate over a first channel region portion, a select gate over a second channel region portion, a control gate over the floating gate, and an erase gate over the source region. Control circuitry is configured to, for one of the memory cells, apply a first pulse of programming voltages that includes a first voltage applied to the control gate, perform a read operation that includes detecting currents through the channel region for different control gate voltages to determine a target control gate voltage using the detected currents that corresponds to a target current through the channel region, and apply a second pulse of programming voltages that includes a second voltage applied to the control gate that is determined from the first voltage, a nominal read voltage and the target voltage.

公开(公告)号：US20200051636A1

公开(公告)日：2020-02-13

申请号：US16550253

申请日：2019-08-25

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Thuan Vu ,  Stanley Hong ,  Anh Ly ,  Vipin Tiwari ,  Nhan Do

IPC: G11C16/04 ,  H01L27/11521 ,  H01L29/788 ,  G06N3/08

Abstract: Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Different calibration algorithms and systems are also disclosed. Optionally, compensation measures can be utilized that compensate for changes in voltage or current as the number of cells being programmed changes.

公开(公告)号：US20200013883A1

公开(公告)日：2020-01-09

申请号：US16576389

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L21/3213 ,  H01L27/11521 ,  H01L27/11536 ,  H01L27/11531 ,  H01L29/423 ,  H01L49/02

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US20200013789A1

公开(公告)日：2020-01-09

申请号：US16578104

申请日：2019-09-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Serguei Jourba ,  Catherine Decobert ,  Nhan Do

IPC: H01L27/11531 ,  H01L29/423 ,  H01L29/10 ,  H01L29/66 ,  H01L27/11521 ,  H01L29/78 ,  H01L29/788

Abstract: A semiconductor substrate having an upper surface with a plurality of upwardly extending fins. A memory cell formed on a first of the fins and including spaced apart source and drain regions in the first fin, with a channel region extending therebetween along top and side surfaces of the first fin, a floating gate that extends along a first portion of the channel region, a select gate that extends along a second portion of the channel region, a control gate that extends along and is insulated from the floating gate, and an erase gate that extends along and is insulated from the source region. A logic device formed on a second of the fins and including spaced apart logic source and logic drain regions in the second fin, with a logic channel region of the second fin extending therebetween, and a logic gate that extends along the logic channel region.

公开(公告)号：US20190385679A1

公开(公告)日：2019-12-19

申请号：US16118272

申请日：2018-08-30

Applicant: Silicon Storage Technology, Inc.

Inventor： Xiaozhou QIAN ,  Kai Man YUE ,  Guang Yan LUO

IPC: G11C16/04

Abstract: A method and apparatus are disclosed for reducing the coupling that otherwise can arise between word lines and control gate lines in a flash memory system due to parasitic capacitance and parasitic resistance. The flash memory system comprises an array of flash memory cells organized into rows and columns, where each row is coupled to a word line and a control gate line.