Abstract:
A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.
Abstract:
A driving apparatus configured to drive a light emitting device includes a driving current source module operable to supply current to the light emitting device via a node during operation. A protection module coupled to the node and the driving current source module selectively injects current to the node during operation. The driving current source module is controlled based on a detection result of a voltage on the node.
Abstract:
A digital circuit can be used in a speaker system. An intermediate node provides a speaker protection control signal. A first latch for receives an offset control signal. A first logic gate receives a play control signal, the offset control signal, and the speaker protection control signal. A second logic gate is coupled to the first latch for receiving the play control signal and the speaker protection control signal. A second latch is coupled to the first logic gate for providing a forced mute signal. A third latch is coupled to the second logic gate and to the intermediate node.
Abstract:
A reference current path carries a reference current. A first transistor is coupled to the reference current path. A second transistor is also coupled to the reference current path. The first and second transistors are connected in parallel to carry the reference current. The first transistor is biased by a first voltage (which is a bandgap voltage plus a threshold voltage). The second transistor is biased by a second voltage (which is a PTAT voltage plus a threshold voltage). The first and second transistors are thus biased by voltages having different and opposite temperature coefficients with a result that the temperature coefficients of the currents flowing in the first and second transistors are opposite and the reference current accordingly has a low temperature coefficient.
Abstract:
An electronic device may include first and second laterally spaced apart interconnect substrates defining a slotted opening, and a first IC in the slotted opening and electrically coupled to one or more of the first and second interconnect substrates. The electronic device may include a first other IC over the first IC and electrically coupled to one or more of the first and second interconnect substrates, and encapsulation material over the first and second interconnect substrates, the first IC, and the first other IC.
Abstract:
A driver circuit includes a high-side power transistor having a source-drain path coupled between a first node and a second node and a low-side power transistor having a source-drain path coupled between the second node and a third node. A high-side drive circuit, having an input configured to receive a drive signal, includes an output configured to drive a control terminal of said high-side power transistor. The high-side drive circuit is configured to operate as a capacitive driver. A low-side drive circuit, having an input configured to receive a complement drive signal, includes an output configured to drive a control terminal of said low-side power transistor. The low-side drive circuit is configured to operate as a level-shifting driver.
Abstract:
A current source circuit is configured to receive a reference current at the input circuit path of a current mirror circuit. The current mirror circuit mirrors the reference current and generates mirror currents at a number of output circuit paths. A corresponding number of control transistors are connected in series with the output circuit paths. Each control transistor is selectively actuated in response to a control signal. A decoder circuit is configured to receive a variable control signal and generate actuation signals in response thereto to selective actuate the control transistors to pass the mirror current to an output node. At the output node, the passed mirror currents are summed to generate a variable output current. The variable current is monotonically modulated in response to the variable control signal.
Abstract:
A switching circuit includes a first input stage having an input for receiving a first input signal, an output, and a power terminal for receiving an increasing analog current, a second input stage having an input for receiving a second input signal, an output, and a power terminal for receiving a decreasing analog current, and an output node coupled to the outputs of the first input stage and the second input stage for providing a switched output signal. An output stage is coupled between the first and second input stages and the output node. The first and second input stages are operational amplifiers.
Abstract:
Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained.
Abstract:
Congruent power and timing signals in a single electronic device. In an embodiment, a circuit may include just one isolation transformer operable to generate a power signal and a timing signal. On the secondary side, two branches may extract both a power signal and a clock signal for use in the circuit on the isolated secondary side. The first branch may be coupled to the transformer and operable to manipulate the signal into a power signal, such as a 5V DC signal. Likewise, the second circuit branch is operable to manipulate the signal into a clock signal, such as a 5 V signal with a frequency of 1 MHz. By extracting both a power supply signal and a clock signal from the same isolation transformer on the secondary side, valuable space may be saved on an integrated circuit device with only having a single winding for a single isolation transformer.