公开(公告)号：US20230018637A1

公开(公告)日：2023-01-19

申请号：US17955206

申请日：2022-09-28

Applicant: SEMES CO., LTD.

Inventor： YONG HEE LEE ,  YOUNG HUN LEE ,  JINWOO JUNG ,  EUI SANG LIM

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US20230008351A1

公开(公告)日：2023-01-12

申请号：US17859900

申请日：2022-07-07

Applicant: SEMES CO., LTD.

Inventor： Sang Eun NOH ,  Dae Sung KIM ,  Ho Jin JANG

IPC: G03F7/16

Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes: a first process chamber having a first treating space therein; a second process chamber having a second treating space therein; and an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space, in which the exhaust unit includes an integrated exhaust line in which a pressure reduction unit is installed, a first exhaust line configured to connect the first process chamber and a first point of the integrated exhaust line, a second exhaust line configured to connect the first process chamber and a second point of the integrated exhaust line, and an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber.

公开(公告)号：US20220415643A1

公开(公告)日：2022-12-29

申请号：US17660449

申请日：2022-04-25

Applicant: Semes Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Hae-Won CHOI ,  Anton KORIAKIN ,  Sangjine Park PARK ,  Keonyoung KIM ,  Sukhoon KIM ,  Seohyun KIM ,  Young-Hoo KIM ,  Kuntack LEE ,  Jihoon JEONG

IPC: H01L21/02 ,  H01L21/67 ,  C11D11/00 ,  C11D3/43 ,  C11D1/72

Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.

公开(公告)号：US20220415626A1

公开(公告)日：2022-12-29

申请号：US17846104

申请日：2022-06-22

Applicant: SEMES CO., LTD.

Inventor： JIN HEE HONG ,  SUNG MIN CHOI ,  YUN SANG KIM ,  MIN SUNG JEON ,  YOUNG EUN JEON ,  DONG YOUNG JANG

IPC: H01J37/32 ,  H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; a support unit supporting a substrate at the treating space; a gas supply unit configured to introduce a gas to the treating space; a plasma source configured to provide an energy for exciting a gas introduced to the treating space to a plasma; an exhaust unit configured to exhaust an atmosphere within the treating space to an outside of the treating space; and a heating source positioned above the support unit, and wherein the heating source applies a heating energy in a pulse form to the substrate.

公开(公告)号：US20220410572A1

公开(公告)日：2022-12-29

申请号：US17849838

申请日：2022-06-27

Applicant: SEMES CO., LTD.

Inventor： Cheon Su Cho ,  Woo Young Ko

IPC: B41J2/165 ,  C23C16/02 ,  C23C16/46 ,  C23C16/52 ,  C23C16/458 ,  B41J11/00

Abstract: Disclosed are a method for preheating a substrate treating apparatus capable of shortening a preheating time and simultaneously performing a maintenance operation, and a computer program for the same. The method includes setting a parameter related to preheating of a preheating target component among components constituting the substrate treating apparatus; and preheating the preheating target component based on the set parameter, wherein a movement range of the preheating target component is limited to a value within a movable range.

公开(公告)号：US20220406571A1

公开(公告)日：2022-12-22

申请号：US17842222

申请日：2022-06-16

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Soon-Cheon CHO ,  Yun Sang KIM

IPC: H01J37/32

Abstract: Disclosed is a substrate treating apparatus, including: a process chamber in which an inner space for treating a substrate is formed; an ion blocker for dividing the inner space into a plasma generating space and a treatment space; a substrate support unit for supporting a substrate in the treatment space; an exhaust unit for exhausting the treatment space; an anneal source positioned above the ion blocker and transmitting energy for annealing to the substrate through the ion blocker; and a gas supply unit for supplying process gas to the plasma generating space, in which the ion blocker includes: a body which is shaped like a disk, is made of a material through which microwaves are transmittable, and is formed with a plurality of through-holes; and a transparent conductive oxide film provided on at least one of an upper surface and a lower surface of the body in a first thickness or less.

公开(公告)号：US20220403517A1

公开(公告)日：2022-12-22

申请号：US17837241

申请日：2022-06-10

Applicant: SEMES CO., LTD.

Inventor： Ki Sang EUM ,  Woo Ram LEE ,  Jong Wha KANG ,  Dong Woon PARK

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/44 ,  C23C16/46

Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a chamber having an inner space, a support unit configured to support the substrate in the inner space, a gas supply tube configured to supply a gas onto the substrate supported on the support unit, a gas exhaust tube configured to exhaust the gas from the inner space, and a gas block connected to the gas supply tube and the gas exhaust tube and provided above the chamber.

公开(公告)号：US11527986B2

公开(公告)日：2022-12-13

申请号：US16952821

申请日：2020-11-19

Applicant: SEMES CO., LTD.

Inventor： Jun Beom Lee ,  Yeong Jae Choi

IPC: H02P29/028 ,  H02P23/20 ,  B65G1/04

Abstract: An apparatus includes a servo motor being configured to drive a traveling part for transferring an object along a traveling rail, a servo driver being configured to control an operation of the servo motor with adjusting a torque of the servo motor according to a load level, an overload determination unit being configured to check a degree of overload of the servo driver and a motion controller being configured to generate a speed signal and a speed profile according to a transfer command which a control unit of controlling an operation of the traveling part transmits thereto, the motion controller generating either a normal speed profile when the servo driver is not at an overload state or a corrected speed profile when the servo driver is at the overload state, and transmitting the speed signal and the speed profile to the servo driver.

公开(公告)号：US20220384216A1

公开(公告)日：2022-12-01

申请号：US17714999

申请日：2022-04-06

Applicant: SEMES CO., LTD.

Inventor： Jin Se PARK ,  Ki Bong KIM ,  Myung Seok CHA ,  Do Hyeon YOON

IPC: H01L21/67

Abstract: The present invention discloses an exhausting device and an exhausting method in substrate processing equipment, and more particularly, a technique for controlling a processing process environment by providing a buffer space for storing chemical fumes outside a ventilation unit of the substrate processing equipment, and discharging the chemical fumes into the buffer space in accordance with a processing process in a chamber interior space.

公开(公告)号：US20220374772A1

公开(公告)日：2022-11-24

申请号：US17746241

申请日：2022-05-17

Applicant: SEMES CO., LTD.

Inventor： Ki-Sung KOO

IPC: G06N20/00 ,  G06K9/62 ,  H01L21/66

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes at least one sensor configured to measure a condition of the substrate or the apparatus in a process of the treating of the substrate; a data collecting unit configured to collect in time series data measured by the sensor; and a data processing unit configured to learn the data by the data collecting unit to detect a change in a current data measured by the sensor. The data processing unit comprises a data learning unit configured to learn a data of the past collected by the data collecting unit using a Siamese network; and a data inspecting unit configured to detect whether an issue has occurred in the current data based on the learned data.