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公开(公告)号：US20240198509A1
公开(公告)日：2024-06-20
申请号：US18083231
申请日：2022-12-16
发明人： Domenico Campolo , Sreekanth Kana , Juhi Gurnani , Vishal Padmanabhan Ramanathan , Mohammad Zaidi Bin Ariffin , Sri Harsha Turlapati , Tzu-Yi Hung
CPC分类号： B25J3/00 , B25J9/1605 , B25J9/163 , B25J9/1633 , B25J9/1664 , B25J9/1687
摘要： The present disclosure provides a master-slave robot arm control system and method. The control method includes steps of: (a) providing a master and a slave robot arms; (b) executing a robot arm demonstration task, wherein the step (b) includes steps of: (b1) utilizing the slave robot arm to output a force feedback; (b2) generating an action command by operating the master robot arm; (b3) calculating and generating a movement command; (b4) controlling the slave robot arm to move and to generate a movement trajectory and the force feedback correspondingly; (c) repeating the step (b) to collect a plurality of movement trajectories of the slave robot arm; (d) utilizing a statistic module to analyze the plurality of movement trajectories; (e) generating an optimized trajectory of the slave robot arm; and (f) controlling the slave robot arm to execute a robot arm task.
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公开(公告)号：US20230001576A1
公开(公告)日：2023-01-05
申请号：US17673559
申请日：2022-02-16
发明人： Yuh-Rong Chen , Guoqiang Hu , Chia Loon Cheng
摘要： An adaptive manipulation apparatus and method are provided. The adaptive manipulation method includes steps of providing a mobile manipulation apparatus comprising a manipulator, a sensor and a processor for a manipulation of an object placed on a carrier having a plurality of markers spaced apart from each other, the sensor detecting the plurality of markers to obtain a run time marker information, the processor, according to the base-case motion plan, generating a run time motion plan, wherein the run time motion plan comprises a plurality of second pose-aware actions, and the plurality of second pose-aware actions are modified from the plurality of first pose-aware actions according to the run time marker information, and the processor further executing the run time motion plan for controlling the manipulator to manipulate the object.
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公开(公告)号：US11307917B2
公开(公告)日：2022-04-19
申请号：US16992719
申请日：2020-08-13
发明人： Zhiheng Xu , Jun Xian Daniel Ng , Omar Bataineh , Arvind Easwaran , Sidharta Andalam , Bo Woon Jeffrey Soon
摘要： The disclosure relates to a decentralized cyber-physical system including a managing unit and a plurality of components. The managing unit includes a root resilient manager including a root contract and a sub-contract generator. The sub-contract generator is configured to decompose the root contract into a plurality of sub-contracts and assign the plurality of sub-contracts to the plurality of components, respectively. Each component includes at least one observer configured to monitor if the property of the individual component violates the sub-contracts corresponding thereto. When one of the plurality of sub-contracts violates during the runtime of the decentralized cyber-physical system, the root resilience manager issues an alarm.
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公开(公告)号：US20210200240A1
公开(公告)日：2021-07-01
申请号：US17020515
申请日：2020-09-14
发明人： Simon Ware , Yajuan Sun , Bo Woon Jeffrey Soon , Liyong Lin , Rong Su
摘要： An automated guided vehicle (AGV) management system including a battery recharge management module, a task management module, and an AGV path planning module is provided. The battery recharge management module manages the AGVs to be recharged by at least one wireless charging unit in a parking area. The AGV leaving the parking area has a battery charge higher than a charge threshold. The task management module receives tasks and assigns the tasks to the AGVs. The task includes information including at least one pick-up location, at least one drop-off location, and a due time. The AGV path planning module plans paths for the AGVs, respectively, according to the information of the assigned tasks. The task management module delays assigning the task to the AGV if the AGV is expected to complete the task earlier than the due time of the task.
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公开(公告)号：US10707750B1
公开(公告)日：2020-07-07
申请号：US16503745
申请日：2019-07-05
发明人： Devrishi Khanna , Chirn Chye Boon , Kaituo Yang , Jack Sheng Kee
摘要： A charge-based charge pump with wide output voltage range is provided. In the charge-based charge pump, the digital logic circuit is configured to receive an up pulse signal and a down pulse signal and output a plurality of switching signals for controlling the first NMOS, the positive hold subcircuit, the first dynamic body-bias generator, the positive charge transfer subcircuit, the first static body-bias generator, the first PMOS, the negative hold subcircuit, the second dynamic body-bias generator, the negative charge transfer subcircuit and the second static body-bias generator electrically connected therewith, so as to allow the output voltage to range from −0.84·VDD to 1.82·VDD. The charge-based charge pump is triggered by the up or down pulse signal or works in a default state, and the top plate and the bottom plate of the pump capacitor are electrically connected to different node and terminal according to the plurality of switching signals.
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公开(公告)号：US10084389B2
公开(公告)日：2018-09-25
申请号：US15165779
申请日：2016-05-26
发明人： Yiu-Wai Lai , Da-Jung Chen
IPC分类号： H02M7/06 , H01L29/739 , H01L29/861 , H01L23/31 , H01L23/538 , H01L23/00 , H01L25/11 , H01L25/18 , H02M7/00 , H01L23/373 , H01L23/498 , H02M7/5387
CPC分类号： H02M7/06 , H01L23/3114 , H01L23/3735 , H01L23/49861 , H01L23/5384 , H01L23/5389 , H01L24/18 , H01L25/112 , H01L25/18 , H01L29/7395 , H01L29/861 , H01L2224/04105 , H01L2224/06181 , H01L2224/24137 , H01L2224/2518 , H02M7/003 , H02M7/5387
摘要： A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.
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公开(公告)号：US09913380B2
公开(公告)日：2018-03-06
申请号：US15490178
申请日：2017-04-18
发明人： Yiu-Wai Lai , Da-Jung Chen
CPC分类号： H05K1/185 , H01L23/5389 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2924/19105 , H05K1/115 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
摘要： An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.
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公开(公告)号：US09906157B2
公开(公告)日：2018-02-27
申请号：US15165719
申请日：2016-05-26
发明人： Chad-Yao Tan , Da-Jung Chen
IPC分类号： H02M7/00 , H01L23/053 , H01L21/48 , H01L23/00
CPC分类号： H02M7/003 , H01L21/4817 , H01L23/053 , H01L24/49
摘要： A package assembly includes a main body, a power module and replaceable top cover. The main body has a hollow part. The power module is disposed within a hollow part of the main body and located beside the bottom part of the main body. At least one first pin is disposed on a surface of the power module. The at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near a top part of the main body. The top cover is disposed in the hollow part of the main body, and includes at least one first opening corresponding to the at least one first pin. The at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part.
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公开(公告)号：US09735114B1
公开(公告)日：2017-08-15
申请号：US15391631
申请日：2016-12-27
发明人： Xiaofeng Xu , Beng Beng Lim , Yiu Wai Lai
IPC分类号： H01L21/56 , H01L23/498 , H01L23/48 , H01L21/48 , H01L23/538
CPC分类号： H01L23/5389 , H01L21/4857 , H01L21/486 , H01L21/4864 , H01L21/568 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/92244
摘要： A first insulation layer comprising stacked prepreg layers is provided, and a metallic protective layer is formed on the first insulation layer. A first alignment mark is formed on the first insulation layer, and an accommodation cavity is formed in the first insulation layer according to the first alignment mark. A second alignment mark is formed on the first insulation layer according to the first alignment mark. A carrier plate is attached on the first insulation layer through a thermal release tape layer, and the semiconductor device is temporarily fixed on the thermal release tape layer within the accommodation cavity according to the second alignment mark. A semi-cured second insulation layer is placed over the first insulation layer, and the second insulation layer is laminated and cured. A re-distribution layer is formed on the second insulation layer, and the re-distribution layer is electrically connected with the semiconductor device.
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公开(公告)号：US20150303164A1
公开(公告)日：2015-10-22
申请号：US14258778
申请日：2014-04-22
发明人： Da-Jung Chen
IPC分类号： H01L23/00 , H01L23/15 , H01L23/36 , H01L23/522
CPC分类号： H01L24/32 , H01L23/36 , H01L23/3735 , H01L23/49811 , H01L23/5383 , H01L23/5389 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/33 , H01L2224/04105 , H01L2224/0951 , H01L2224/12105 , H01L2224/16227 , H01L2224/24105 , H01L2224/24137 , H01L2224/24195 , H01L2224/24226 , H01L2224/29147 , H01L2224/33055 , H01L2224/73267 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012
摘要： A package structure includes a first insulation layer, a first conductive layer, a direct bond copper substrate, and a first electronic component. A first conductive via is formed in the first insulation layer. The first conductive layer is disposed on a top surface of the first insulation layer and in contact with the first conductive via. The direct bond copper substrate includes a second conductive layer, a third conductive layer and a ceramic base. The ceramic base is disposed on a bottom surface of the first insulation layer and exposed to the first insulation layer by press-fit operation. The first electronic component is embedded within the first insulation layer and disposed on the second conductive layer. The first electronic component includes a first conducting terminal. The first conducting terminal is electrically connected with the second conductive layer and/or electrically connected with the first conductive layer through the first conductive via.
摘要翻译： 封装结构包括第一绝缘层，第一导电层，直接键合铜基底和第一电子元件。 第一导电通孔形成在第一绝缘层中。 第一导电层设置在第一绝缘层的顶表面上并与第一导电通孔接触。 直接键合铜基板包括第二导电层，第三导电层和陶瓷基底。 陶瓷基底设置在第一绝缘层的底表面上并通过压入操作而暴露于第一绝缘层。 第一电子部件嵌入在第一绝缘层内并且设置在第二导电层上。 第一电子部件包括第一导电端子。 第一导电端子与第二导电层电连接和/或通过第一导电通孔与第一导电层电连接。
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