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    OMNIDIRECTIONAL LED BASED SOLID STATE LAMP
    11.
    发明申请
    OMNIDIRECTIONAL LED BASED SOLID STATE LAMP 有权
    OMNIDIRECTIONAL LED基固体灯

    公开(公告)号：US20120182711A1

    公开(公告)日：2012-07-19

    申请号：US13005970

    申请日：2011-01-13

    Applicant: Boris Kolodin ,  Glenn H. Kuenzler ,  Gary R. Allen ,  Mark J. Mayer ,  Yiyu Cao

    Inventor： Boris Kolodin ,  Glenn H. Kuenzler ,  Gary R. Allen ,  Mark J. Mayer ,  Yiyu Cao

    IPC: F21V9/16

    CPC classification number: F21S4/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/061 ,  F21V3/062 ,  F21V3/10 ,  F21V3/12 ,  F21V5/04 ,  F21V29/51 ,  F21V29/74 ,  F21Y2107/90 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0071

    Abstract: A lighting apparatus includes a bilaterally symmetrical light engine comprising first and second light emitting diode (LED) devices or planar LED device arrays facing opposite directions, and an envelope including phosphor spaced apart from and surrounding the bilaterally symmetrical light engine. The phosphor is effective to convert light emitted by the light engine to emission light. The bilaterally symmetrical light engine may be configured to emit light having a bilaterally symmetrical intensity distribution that is uniform except at emission angles within 10° of the symmetry plane of the bilaterally symmetrical light engine. Each of the first and second LED devices or planar LED device arrays may comprise at least one hemispherically emitting LED device including an LED chip and an encapsulant encapsulating the LED chip and shaped to refract light emitted by the LED chip into a uniform distribution over a hemispherical solid angle.

    Abstract translation: 一种照明装置，包括双面对称的光引擎，其包括面向相反方向的第一和第二发光二极管（LED）器件或平面LED器件阵列，以及包括与双侧对称光引擎隔开并围绕其的荧光体的外壳。 荧光体有效地将由光引擎发射的光转换成发射光。 双侧对称光引擎可以被配置为发射具有双向对称强度分布的光，除了在双边对称光引擎的对称平面的10°内的发射角度下，其均匀。 第一和第二LED器件或平面LED器件阵列中的每一个可以包括至少一个半射发射LED器件，其包括LED芯片和封装LED芯片的密封剂，并且被成形为将由LED芯片发射的光折射成半球形的均匀分布 立体角。

    Circuit board for direct flip chip attachment
    13.
    发明授权
    Circuit board for direct flip chip attachment 失效
    用于直接倒装芯片连接的电路板

    公开(公告)号：US07749813B2

    公开(公告)日：2010-07-06

    申请号：US12038200

    申请日：2008-02-27

    Applicant: Boris Kolodin ,  James Reginelli

    Inventor： Boris Kolodin ,  James Reginelli

    IPC: H01L21/00 ,  H01L23/12 ,  H01L23/053 ,  H05K1/00 ,  H05K3/02 ,  H05K3/10

    CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/027 ,  H05K3/064 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

    Abstract translation: 封装方法包括：通过在绝缘板上形成基本上连续的导电层形成电路板，并移除所述连续导电层的选定部分以限定导电迹线; 激光切割导电迹线以通过激光切割形成的激光切割间隙来彼此电隔离的子迹线; 以及将发光二极管（LED）芯片连接到所述激光切割间隙上或与所述激光切割间隙相邻的所述电路板，所述接合包括在不使用插入的基座的情况下将所述LED芯片的电极可操作地电连接到所述子迹线之一。 半导体封装包括结合到电路板的导电迹线的子迹线的LED芯片倒装芯片，子迹线通过小于或约100微米的窄间隙彼此电隔离。

    Phosphor down converting element for an LED package and fabrication method
    17.
    发明授权
    Phosphor down converting element for an LED package and fabrication method 有权
    一种LED封装的荧光降低转换元件及其制造方法

    公开(公告)号：US07737457B2

    公开(公告)日：2010-06-15

    申请号：US11862534

    申请日：2007-09-27

    Applicant: Boris Kolodin ,  Emil Vergilov Radkov

    Inventor： Boris Kolodin ,  Emil Vergilov Radkov

    IPC: H01L33/00

    CPC classification number: H01L33/501

    Abstract: There is provided a phosphor down converting element based on fluoropolymer resin and a method for fabricating the same. There is further provided a method for using said phosphor down converting element to generate white light from a radiation source. The method for fabricating phosphor down converting element includes preparing an appropriate phosphor powder mixture that is capable of absorbing a first band of wavelengths and emitting a second band of wavelengths being greater in length than the first bands, incorporating the phosphor powder mixture into or on a phosphor carrier element comprising a fluoropolymer material, and molding the phosphor down converting elements into useful shapes. Fluoropolymers are the most chemically inert of all plastics, can withstand both extremely high and low temperatures, and show a resistance to weavering and UV degradation, making fluoropolymers optimal for use as a phosphor carrier.

    Abstract translation: 提供了一种基于氟聚合物树脂的磷光体下变换元件及其制造方法。 还提供了一种使用所述磷光体下变换元件从辐射源产生白光的方法。 制造磷光体下变换元件的方法包括制备适当的荧光体粉末混合物，其能够吸收波长的第一波长并且发射长度大于第一波段的波长的第二波长，将荧光体粉末混合物掺入到 荧光体载体元件包括含氟聚合物材料，并将磷光体成型为有用的形状。 含氟聚合物是所有塑料中最具化学惰性的，可以承受极高和低温，并且显示出对织造和UV降解的抗性，使得氟聚合物最适合用作荧光体载体。

    CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT
    18.
    发明申请
    CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT 失效
    电路板直接连接芯片连接

    公开(公告)号：US20090212317A1

    公开(公告)日：2009-08-27

    申请号：US12038200

    申请日：2008-02-27

    Applicant: Boris Kolodin ,  James Reginelli

    Inventor： Boris Kolodin ,  James Reginelli

    IPC: H01L33/00 ,  H01L21/60

    CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/027 ,  H05K3/064 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

    Abstract translation: 封装方法包括：通过在绝缘板上形成基本上连续的导电层形成电路板，并移除所述连续导电层的选定部分以限定导电迹线; 激光切割导电迹线以通过激光切割形成的激光切割间隙来彼此电隔离的子迹线; 以及将发光二极管（LED）芯片连接到所述激光切割间隙上或与所述激光切割间隙相邻的所述电路板，所述接合包括在不使用插入的基座的情况下将所述LED芯片的电极可操作地电连接到所述子迹线之一。 半导体封装包括结合到电路板的导电迹线的子迹线的LED芯片倒装芯片，子迹线通过小于或约100微米的窄间隙彼此电隔离。

    Phosphor down converting element for an LED package and fabrication method
    19.
    发明申请
    Phosphor down converting element for an LED package and fabrication method 有权
    一种LED封装的荧光降低转换元件及其制造方法

    公开(公告)号：US20090085049A1

    公开(公告)日：2009-04-02

    申请号：US11862534

    申请日：2007-09-27

    Applicant: Boris Kolodin ,  Emil Vergilov Radkov

    Inventor： Boris Kolodin ,  Emil Vergilov Radkov

    IPC: H01L33/00 ,  B28B1/00

    CPC classification number: H01L33/501

    Abstract: There is provided a phosphor down converting element based on fluoropolymer resin and a method for fabricating the same. There is further provided a method for using said phosphor down converting element to generate white light from a radiation source. The method for fabricating phosphor down converting element includes preparing an appropriate phosphor powder mixture that is capable of absorbing a first band of wavelengths and emitting a second band of wavelengths being greater in length than the first bands, incorporating the phosphor powder mixture into or on a phosphor carrier element comprising a fluoropolymer material, and molding the phosphor down converting elements into useful shapes. Fluoropolymers are the most chemically inert of all plastics, can withstand both extremely high and low temperatures, and show a resistance to weavering and UV degradation, making fluoropolymers optimal for use as a phosphor carrier.

    Abstract translation: 提供了一种基于氟聚合物树脂的磷光体下变换元件及其制造方法。 还提供了一种使用所述磷光体下变换元件从辐射源产生白光的方法。 制造磷光体下变换元件的方法包括制备适当的荧光体粉末混合物，其能够吸收波长的第一波长并且发射长度大于第一波段的波长的第二波长，将荧光体粉末混合物掺入到 荧光体载体元件包括含氟聚合物材料，并将磷光体成型为有用的形状。 含氟聚合物是所有塑料中最具化学惰性的，可以承受极高和低温，并且显示出对织造和UV降解的抵抗力，使氟聚合物最适合用作荧光体载体。

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