公开(公告)号：US20100267275A1

公开(公告)日：2010-10-21

申请号：US12830192

申请日：2010-07-02

Applicant: Chung-Ta Chin ,  Yuan-Te Chang ,  Ching-Chung Chen ,  Ren-Shiang Tsai ,  Chia Ching Lin

Inventor： Chung-Ta Chin ,  Yuan-Te Chang ,  Ching-Chung Chen ,  Ren-Shiang Tsai ,  Chia Ching Lin

IPC: H01R3/00

CPC classification number: H01R13/641 ,  H01R13/6658

Abstract: A detecting device is used to detect the connection of an electronic device. The detecting device includes a circuit board and a connector module. The circuit board includes a power terminal and a signal processing unit. The connector module includes a body and a detecting member. The body has a connecting port and a connecting sidewall. The detecting member is disposed on the connecting sidewall and electrically connected to the power terminal and the signal processing unit, and it has a potential. When a plug of the electronic device is connected to the connecting port, the plug contacts the detecting member to change the potential. The change of the potential is detected by the signal processing unit such that the connection between the electronic device and the connector module is confirmed.

Abstract translation: 检测装置用于检测电子设备的连接。 检测装置包括电路板和连接器模块。 电路板包括电源端子和信号处理单元。 连接器模块包括主体和检测构件。 主体具有连接端口和连接侧壁。 检测部件设置在连接侧壁上，与电源端子和信号处理部电连接，具有电位。 当电子设备的插头连接到连接端口时，插头接触检测构件以改变电位。 由信号处理单元检测电位的变化，使得确认电子设备与连接器模块之间的连接。

公开(公告)号：US20100148958A1

公开(公告)日：2010-06-17

申请号：US12335004

申请日：2008-12-15

Applicant: Ching-Chung CHEN

Inventor： Ching-Chung CHEN

IPC: G08B21/00

CPC classification number: G08B21/24 ,  G04F1/005

Abstract: An expiration warning device installed on a refrigerator includes a processor unit, a power source unit electrically connected to the processor unit, an operating unit electrically connected to the processor unit for setting a countdown of number of days, at least one display unit electrically connected to the processor unit for displaying the countdown of number of days, at least one switch unit electrically connected to processor unit for controlling the power source unit and the display unit, and at least one warning unit electrically connected to the processor unit and corresponding to the display unit for alerting the countdown of number of days. The processor unit, power source unit, operating unit, display unit, switch unit and warning unit are coupled to a casing and installed on the refrigerator for setting a countdown of expiration of related foods to remind users about the expiration in advance.

Abstract translation: 安装在冰箱上的过期警告装置包括处理器单元，电连接到处理器单元的电源单元，电连接到处理器单元的操作单元，用于设置天数的倒数，至少一个显示单元电连接到 用于显示天数倒计时的处理器单元，电连接到用于控制电源单元和显示单元的处理器单元的至少一个开关单元，以及电连接到处理器单元并对应于显示器的至少一个警告单元 提醒天数倒数的单位。 处理器单元，电源单元，操作单元，显示单元，开关单元和警告单元耦合到壳体并安装在冰箱上，用于设置相关食物的过期倒计时，以提前提醒用户有关到期。

公开(公告)号：US20100061045A1

公开(公告)日：2010-03-11

申请号：US12540158

申请日：2009-08-12

Applicant: Ching Chung Chen

Inventor： Ching Chung Chen

IPC: H05K7/00 ,  E05C3/04

CPC classification number: G06F1/1656 ,  F16B5/0664 ,  G06F1/1613 ,  G06F1/1616 ,  Y10T292/1089

Abstract: The invention discloses an electronic device and an engaging structure thereof. The electronic device comprises a first casing and a second casing. The first casing comprises a plate portion and a plurality of hooks. Each hook is located on the plate portion. The second casing comprises a first side portion, a second side portion, an engaging portion, a first rib and a second rib. The engaging portion is between the first and the second side portions and comprises a plurality of recesses. Each recess is engaged with one of the hooks and has a front edge. A gap is between one end of the hook and the front edge of the recess. The first and second ribs are respectively located on the first and the second side portions. The plate portion is disposed on the first and second ribs. The hook can be detached from the recess by the gap.

Abstract translation: 本发明公开了一种电子设备及其接合结构。 电子设备包括第一壳体和第二壳体。 第一壳体包括板部分和多个钩。 每个钩位于板部分上。 第二壳体包括第一侧部，第二侧部，接合部，第一肋和第二肋。 接合部分在第一和第二侧部之间并且包括多个凹部。 每个凹槽与其中一个钩接合并且具有前边缘。 在钩的一端和凹部的前边缘之间存在间隙。 第一和第二肋分别位于第一和第二侧部上。 板部分设置在第一和第二肋上。 钩可以通过间隙与凹槽分离。

公开(公告)号：US20090186519A1

公开(公告)日：2009-07-23

申请号：US12349450

申请日：2009-01-06

Applicant: Chung-Ta Chin ,  Yuan-Te Chang ,  Ching-Chung Chen ,  Ren-Shiang Tsai ,  Chia Ching Lin

Inventor： Chung-Ta Chin ,  Yuan-Te Chang ,  Ching-Chung Chen ,  Ren-Shiang Tsai ,  Chia Ching Lin

IPC: H01R3/00

CPC classification number: H01R13/641 ,  H01R13/6658

Abstract: A detecting device is used to detect the connection of an electronic device. The detecting device includes a circuit board and a connector module. The circuit board includes a power terminal and a signal processing unit. The connector module includes a body and a detecting member. The body has a connecting port and a connecting sidewall. The detecting member is disposed on the connecting sidewall and electrically connected to the power terminal and the signal processing unit, and it has a potential. When a plug of the electronic device is connected to the connecting port, the plug contacts the detecting member to change the potential. The change of the potential is detected by the signal processing unit such that the connection between the electronic device and the connector module is confirmed.

Abstract translation: 检测装置用于检测电子设备的连接。 检测装置包括电路板和连接器模块。 电路板包括电源端子和信号处理单元。 连接器模块包括主体和检测构件。 主体具有连接端口和连接侧壁。 检测部件设置在连接侧壁上，与电源端子和信号处理部电连接，具有电位。 当电子设备的插头连接到连接端口时，插头接触检测构件以改变电位。 由信号处理单元检测电位的变化，使得确认电子设备与连接器模块之间的连接。

公开(公告)号：US20080165541A1

公开(公告)日：2008-07-10

申请号：US11971092

申请日：2008-01-08

Applicant: Yen-Chun Chou ,  Ching-Chung Chen

Inventor： Yen-Chun Chou ,  Ching-Chung Chen

IPC: F21V13/02 ,  G02B3/00 ,  G02B3/08

CPC classification number: F21V29/677 ,  F21V5/04 ,  F21V5/045 ,  F21Y2115/10

Abstract: An illumination apparatus includes a lampshade, a light source module and a condensing plate. The light source module is disposed in the lampshade, and has a light-emitting diode (LED) device and a circuit board. The LED device is disposed on the circuit board. The condensing plate is disposed in the lampshade and disposed over the LED device. The condensing plate has a condensing element disposed corresponding to the LED device.

Abstract translation: 照明装置包括灯罩，光源模块和冷凝板。 光源模块设置在灯罩中，并且具有发光二极管（LED）装置和电路板。 LED装置设置在电路板上。 冷凝板设置在灯罩中，并设置在LED装置上。 冷凝板具有对应于LED装置设置的聚光元件。

公开(公告)号：US20070287223A1

公开(公告)日：2007-12-13

申请号：US11842179

申请日：2007-08-21

Applicant: Ching-Chung Chen

Inventor： Ching-Chung Chen

IPC: H01L33/00

CPC classification number: H01L33/44 ,  H01L33/641 ,  H01L2933/0091

Abstract: A light emitting diode comprising a semiconductor layer, a first electrode, a second electrode and a diamond-like carbon layer is provided. The semiconductor layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. Wherein, the light emitting layer locates between the first type doped semiconductor layer and the second type doped semiconductor layer. The first electrode is electrically connected to the first type doped semiconductor layer. The second electrode is electrically connected to the second type doped semiconductor layer. The diamond-like carbon layer covers on the semiconductor layer and exposes at least a portion of the first electrode. Moreover, the exposed outer surface of the diamond-like carbon layer is a rough surface. Alternatively, other passivation layer with rough surface can be substituted for the diamond-like carbon layer.

Abstract translation: 提供了包括半导体层，第一电极，第二电极和类金刚石碳层的发光二极管。 半导体层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 其中，发光层位于第一掺杂半导体层和第二掺杂半导体层之间。 第一电极电连接到第一类型的掺杂半导体层。 第二电极电连接到第二类型掺杂半导体层。 类金刚石碳层覆盖在半导体层上并暴露第一电极的至少一部分。 此外，金刚石状碳层的露出的外表面是粗糙的表面。 或者，具有粗糙表面的其它钝化层可以代替类金刚石碳层。

公开(公告)号：US06566151B2

公开(公告)日：2003-05-20

申请号：US09885047

申请日：2001-06-21

Applicant: Cheng-Pang Yeh ,  Ching-Chung Chen

Inventor： Cheng-Pang Yeh ,  Ching-Chung Chen

IPC: H01L2100

CPC classification number: H01L27/14632 ,  H01L27/14621 ,  H01L27/14627

Abstract: The present invention provides a method for increasing the adhesion of a color filter on a semiconductor wafer. The semiconductor wafer comprises a substrate, a plurality of MOS transistor sensors positioned on the substrate, and a plurality of insulators formed between two MOS transistor sensors on the substrate. The present invention first involves forming a dielectric layer on the semiconductor wafer, which covers each MOS transistor sensor and each insulator. Thereafter, a passivation layer is formed on the dielectric layer, and a plurality of recesses is formed in the passivation layer corresponding to a MOS transistor sensor. Finally, a color filter is formed in each recess. The recess is used to increase the contact areas between the color filter and the passivation layer so as to prevent stripping of the color filter.

公开(公告)号：US20130157066A1

公开(公告)日：2013-06-20

申请号：US13325318

申请日：2011-12-14

Applicant: Liao-Ping CHENG ,  Ching-Chung Chen ,  Feng-Hsi Huang ,  Hsu-Hsien Chang

Inventor： Liao-Ping CHENG ,  Ching-Chung Chen ,  Feng-Hsi Huang ,  Hsu-Hsien Chang

IPC: B32B9/04 ,  B05D3/06 ,  B32B9/00 ,  B05D5/06

CPC classification number: G02B1/14 ,  C08J7/045 ,  G02B1/105 ,  G02B1/18 ,  G02B27/0006

Abstract: The present invention relates to a method for manufacturing a hard, water-resistant anti-fog coating, and particularly relates to a method for manufacturing a hard, water-resistant anti-fog coating on plastic material. In this method, an organic-inorganic hard adhesion layer and a hydrophilic anti-fog coating film are prepared for manufacturing a hard, water-resistant anti-fog coating. Both of the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating have C=C double bonds. Therefore, the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating are adhered to each other tightly. It brings high hardness, high water resistance and good anti-fog effect.

Abstract translation: 本发明涉及一种制造硬质防水防雾涂料的方法，特别涉及一种在塑料材料上制造硬质防水防雾涂料的方法。 在该方法中，制备有机 - 无机硬粘合层和亲水性防雾涂膜，用于制造硬质防水防雾涂料。 有机 - 无机硬粘合层和亲水性防雾涂层都具有C = C双键。 因此，有机 - 无机硬粘合层和亲水性防雾涂层紧密地粘合。 它具有高硬度，高耐水性和良好的防雾效果。

公开(公告)号：US20120273809A1

公开(公告)日：2012-11-01

申请号：US13441933

申请日：2012-04-09

Applicant: MING-TA TSAI ,  CHING-CHUNG CHEN

Inventor： MING-TA TSAI ,  CHING-CHUNG CHEN

IPC: H01L33/08

CPC classification number: H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An LED package includes a substrate, a first LED module and a second LED module. The first LED module includes a plurality of first LEDs arranged at the substrate. The second LED module includes a plurality of second LEDs arranged at the substrate and surrounding the first LED module. A luminous intensity of the first LED module is less than a luminous intensity of the second LED module.

Abstract translation: LED封装包括基板，第一LED模块和第二LED模块。 第一LED模块包括布置在基板处的多个第一LED。 第二LED模块包括布置在基板处并围绕第一LED模块的多个第二LED。 第一LED模块的发光强度小于第二LED模块的发光强度。

公开(公告)号：US20120256219A1

公开(公告)日：2012-10-11

申请号：US13336010

申请日：2011-12-23

Applicant: MING-TA TSAI ,  CHING-CHUNG CHEN

Inventor： MING-TA TSAI ,  CHING-CHUNG CHEN

IPC: H01L33/60 ,  H01L33/52

CPC classification number: H01L33/385 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup.

Abstract translation: LED封装包括衬底，电极层，发光芯片，反射杯和封装。 基板包括第一表面，相对的第二表面和两个侧表面。 电极层由正电极和负电极构成，每个电极通过相应的侧表面从第一表面延伸到第二表面。 发光芯片位于基板的第一表面上并电连接到电极层。 反射杯包括在基板的侧表面上覆盖电极层的第一部分，在基板的第一表面上具有碗状形状的第二部分并且围绕发光芯片。 封装填充在反射杯的第二部分中。