公开(公告)号：US20170085123A1

公开(公告)日：2017-03-23

申请号：US15229122

申请日：2016-08-05

申请人： Dexin Liang

发明人： Dexin Liang

IPC分类号： H02J9/06

CPC分类号： H02J9/061 ,  H02J1/108

摘要： The present invention provides a switch power circuit with a backup battery for power supply, comprising an input rectifier module, an PWM switch control module, a transformer module, an output rectifier diode, a negative feedback module, a backup battery, an isolation diode unit and a zener diode; the anode of the output rectifier diode is connected with the positive output end of the transformer unit, the cathode of the output rectifier diode is connected with the cathode of the isolation diode unit, the anode of the isolation diode unit is connected with the anode of the backup battery, the cathode of the backup battery is connected with the negative output end of the transformer module; the cathode of the zener diode is connected between the cathode of the isolation diode unit and the cathode of the output rectifier diode; one end of the negative feedback module is connected with the anode of the zener diode, and the other end of the negative feedback module is connected with the control port of the PWM switch control module. The present invention has beneficial effects of reducing output consumption of switch power supply and increasing conversion efficiency of switch power supply.

公开(公告)号：US06630737B2

公开(公告)日：2003-10-07

申请号：US09405375

申请日：1999-09-24

申请人： Lily Zhao ,  Dexin Liang

发明人： Lily Zhao ,  Dexin Liang

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0219 ,  H05K3/3436 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention includes an integrated circuit package, a ball-grid array integrated circuit package, a method of packaging an integrated circuit, and a method of forming an integrated circuit package. According to one aspect, the present invention provides an integrated circuit package including a substrate including a first surface, a second surface and a plurality of conductors, the first surface includes a plurality of conductive pads adapted to couple with a plurality of corresponding bond pads of a semiconductor die, and the conductors being configured to couple the conductive pads with the second surface; and a plurality of conductive bumps coupled with the second surface of the substrate and electrically coupled with respective conductors, the conductive bumps being formed in an array including a plurality of power bumps and signal bumps, and the signal bumps being individually positioned immediately adjacent at least one power bump. One method of packaging an integrated circuit includes providing a semiconductor die including a plurality of bond pads; providing a package substrate including a plurality of conductive bumps including plural power bumps and plural signal bumps; arranging individual signal bumps to be immediately adjacent at least one power bump; and electrically coupling the bond pads of the semiconductor die with respective conductive bumps.

摘要翻译： 本发明包括集成电路封装，球栅阵列集成电路封装，封装集成电路的方法以及形成集成电路封装的方法。 根据一个方面，本发明提供了一种集成电路封装，其包括包括第一表面，第二表面和多个导体的基板，所述第一表面包括多个导电焊盘，其适于与多个对应的焊盘焊接 半导体管芯，并且所述导体被配置为将所述导电焊盘与所述第二表面耦接; 以及与所述基板的所述第二表面耦合并与相应导体电耦合的多个导电凸块，所述导电凸块形成为包括多个功率凸起和信号凸起的阵列，并且所述信号凸块分别紧邻至少 一个电源碰撞。 封装集成电路的一种方法包括提供包括多个接合焊盘的半导体管芯; 提供包括多个导电凸块的封装基板，所述导电凸块包括多个电源凸块和多个信号凸块; 布置各个信号凸块以紧邻至少一个电源凸块; 并将半导体管芯的接合焊盘与相应的导电凸块电耦合。

公开(公告)号：US5972734A

公开(公告)日：1999-10-26

申请号：US932711

申请日：1997-09-17

申请人： Karla Y. Carichner ,  Dexin Liang

发明人： Karla Y. Carichner ,  Dexin Liang

IPC分类号： H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K2201/049 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K3/4038 ,  Y02P70/613

摘要： A ball grid array package (BGA) according to the present invention has an interposer between a bond pad on the lower surface of the substrate and the solder ball. The interposer has a conductive portion in contact with the bond pad surrounded by a nonconductive or insulating portion. The conductive portion in contact with the bond pad is sufficiently constrained from widening during a subsequent reflow process by the presence of the nonconductive or insulating portion. The contact with the bond pad is sufficiently small to allow traces to pass near the bond pad substantially directly en route to another bond pad. The nonconductive portion also prevents subsequently-applied encapsulant from coming in contact with and contaminating the bond pad. The elevated surface of the interposer, i.e. the surface of the interposer furthest from the bond pad, supports the solder ball, and is sufficiently wide to support the solder ball without allowing the solder ball to come in contact with the traces. The solder ball and the trace routing on the lower surface of the substrate is in different planes, thereby allowing a simplified trace routing, but retaining and even increasing rigidity of the structure and coplanarity of the solder balls.

摘要翻译： 根据本发明的球栅阵列封装（BGA）在衬底的下表面上的接合焊盘和焊球之间具有插入件。 插入器具有与由非导电或绝缘部分包围的接合焊盘接触的导电部分。 与接合焊盘接触的导电部分通过存在非导电或绝缘部分在随后的回流工艺期间被充分地限制于加宽。 与接合焊盘的接触足够小，以允许迹线基本上直接通过接合焊盘附近通过另一接合焊盘。 不导电部分还防止随后施加的密封剂与接合焊盘接触并污染接合焊盘。 插入器的升高的表面，即距离接合焊盘最远的插入件的表面支撑焊球，并且足够宽以支撑焊球，而不允许焊球与迹线接触。 焊锡球和基板下表面上的走线路由处于不同的平面，从而允许简化的迹线路由，但是保持并均匀地提高了结构的刚度和焊球的共面性。

公开(公告)号：US5360942A

公开(公告)日：1994-11-01

申请号：US153240

申请日：1993-11-16

申请人： Paul R. Hoffman ,  Dexin Liang

发明人： Paul R. Hoffman ,  Dexin Liang

IPC分类号： H01L25/18 ,  H01L21/58 ,  H01L23/057 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L25/04 ,  H01L23/02

CPC分类号： H01L24/83 ,  H01L23/057 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49531 ,  H01L24/31 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181

摘要： There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a polymer adhesive. A plurality of semiconductor devices are disposed within apertures formed in the apertured substrate and bonded to the support substrate by that same polymer adhesive.

摘要翻译： 提供了一种用于在电子封装内支撑多个半导体器件的模块。 模块具有支撑衬底和与聚合物粘合剂层压在一起的多孔基底。 多个半导体器件设置在形成于多孔基片中的孔内，并通过相同的聚合物粘合剂结合到支撑基底上。