公开(公告)号：US20100134128A1

公开(公告)日：2010-06-03

申请号：US12327576

申请日：2008-12-03

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R1/06 ,  B05D5/12

CPC classification number: G01R31/2889

Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

Abstract translation: 第一装置和第二装置可以包括至少一个对准特征和至少一个对应的约束。 对准特征和约束可以被配置为当对准特征被插入到约束中时，使第一设备和第二设备对齐。 对准特征和约束可以被进一步配置成由于第一装置和第二装置之间的相对热膨胀或收缩而引导第一装置和第二装置之间的相对运动。 定向相对运动可以使第一装置和第二装置保持在预定的温度范围内。

公开(公告)号：US07658831B2

公开(公告)日：2010-02-09

申请号：US11306291

申请日：2005-12-21

Applicant: Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

Inventor： Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

IPC: C25D5/02

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。

公开(公告)号：US07592821B2

公开(公告)日：2009-09-22

申请号：US11877466

申请日：2007-10-23

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：US20090158586A1

公开(公告)日：2009-06-25

申请号：US12343260

申请日：2008-12-23

Applicant: Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: G01R3/00

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：US20080157791A1

公开(公告)日：2008-07-03

申请号：US11860406

申请日：2007-09-24

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R1/067

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

公开(公告)号：US20080157790A1

公开(公告)日：2008-07-03

申请号：US11617929

申请日：2006-12-29

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R1/067 ,  H01L21/67 ,  G01R31/02

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

公开(公告)号：US20080036480A1

公开(公告)日：2008-02-14

申请号：US11464593

申请日：2006-08-15

Applicant: Eric D. Hobbs ,  Christopher D. McCoy ,  James M. Porter ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Christopher D. McCoy ,  James M. Porter ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R31/31905

Abstract: A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

Abstract translation: 探针卡组件可以包括支撑结构，多个探针可以直接或间接附接到支撑结构。 可以将探针设置成接触要测试的电子设备。 探针卡组件还可以包括致动器，其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。 探针卡组件还可以包括多个可锁定的柔顺结构。 当解锁时，可锁定的柔性结构可以允许支撑结构相对于参考结构移动。 然而，当锁定时，柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

公开(公告)号：US20070290705A1

公开(公告)日：2007-12-20

申请号：US11455110

申请日：2006-06-16

Applicant: Benjamin N. Eldridge ,  Roy J. Henson ,  Eric D. Hobbs ,  Peter B. Mathews ,  Makarand S. Shinde

Inventor： Benjamin N. Eldridge ,  Roy J. Henson ,  Eric D. Hobbs ,  Peter B. Mathews ,  Makarand S. Shinde

IPC: G01R31/26

CPC classification number: G01R1/07342

Abstract: A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.

Abstract translation: 用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终 阵列配置。 具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地配合在测试环境的空间极限内。

公开(公告)号：US20110050265A1

公开(公告)日：2011-03-03

申请号：US12547454

申请日：2009-08-25

Applicant: ERIC D. HOBBS ,  GAETAN L. MATHIEU ,  FRANK M. ZALAR

Inventor： ERIC D. HOBBS ,  GAETAN L. MATHIEU ,  FRANK M. ZALAR

IPC: G01R1/06 ,  G01R31/00

CPC classification number: G01R1/06761 ,  G01R31/2863

Abstract: Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

Abstract translation: 本发明的实施例可以涉及用于其中的探针卡组件，多层支撑衬底以及设计用于探针卡组件的多层支撑衬底的方法。 在一些实施例中，探针卡组件可以包括被设计成基本匹配参考材料在所需温度范围内的热膨胀的多层支撑衬底; 以及耦合到多层支撑衬底的探针衬底。 在一些实施例中，参考材料可以是硅。

公开(公告)号：US20100134129A1

公开(公告)日：2010-06-03

申请号：US12327643

申请日：2008-12-03

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/26 ,  G01R1/067 ,  G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.