公开(公告)号：US11996357B2

公开(公告)日：2024-05-28

申请号：US17446186

申请日：2021-08-27

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Daisuke Minoura

IPC分类号： H01L23/498 ,  H01L21/48

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/49838

摘要： A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer such that the insulating layer is formed between the first and second layers, the connection conductors penetrating through the insulating layer and connecting the first and second layers, and a coating film formed at least partially on surface of the first layer such that the film improves adhesion between the first layer and insulating layer. The first layer includes pads and wiring patterns such that the pads are in contact with the connection conductors and that the patterns have surfaces facing the insulating layer and covered by the film, and the pads have roughened surfaces facing the insulating layer and having first surface roughness that is higher than second surface roughness of the surfaces of the patterns.

公开(公告)号：US20240145821A1

公开(公告)日：2024-05-02

申请号：US18272758

申请日：2022-01-14

申请人： Ibiden Co., Ltd.

发明人： Hisashi ANDO ,  Naoki TAKAHASHI

IPC分类号： H01M10/658 ,  F16L59/02

CPC分类号： H01M10/658 ,  F16L59/026

摘要： A heat transfer suppression sheet for a battery pack, the heat transfer suppression sheet being used in a battery pack in which battery cells are connected in series or in parallel and being interposed between the battery cells, the heat transfer suppression sheet containing: a heat-insulating material containing at least one of inorganic particles or inorganic fibers; and a covering material covering at least a part of the heat-insulating material, in which a gap is formed between the heat-insulating material and the covering material, and the gap communicates with the outside of the heat-insulating material and the covering material.

公开(公告)号：US20240138071A1

公开(公告)日：2024-04-25

申请号：US18489921

申请日：2023-10-18

申请人： IBIDEN CO., LTD.

发明人： Shogo FUKUI ,  Ryo ANDO ,  Keisuke SHIMIZU

IPC分类号： H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H05K3/00

CPC分类号： H05K1/186 ,  H01L21/4857 ,  H01L21/4864 ,  H01L21/56 ,  H01L23/49822 ,  H01L24/19 ,  H01L24/20 ,  H05K3/0035 ,  H05K3/0055 ,  H01L25/0652

摘要： A method for manufacturing a wiring substrate includes forming conductor pads on a surface of an insulating layer, positioning, on or in the insulating layer, an electronic component having electrode pads, forming a second insulating layer covering the surface of the insulating layer, conductor pads and electronic component, forming first via holes exposing the conductor pads, applying a first desmear treatment to the second insulating layer such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the electrode pads of the electronic component positioned on or in the insulating layer, applying a second desmear treatment to the second insulating layer such that residues are removed from the second via holes, forming first via conductors in the first via holes, and forming second via conductors in the second via holes.

公开(公告)号：US11963492B2

公开(公告)日：2024-04-23

申请号：US17706886

申请日：2022-03-29

申请人： IBIDEN CO., LTD.

发明人： Katsuya Ohno ,  Tomohiro Nohara

IPC分类号： A01G7/06 ,  C05F11/08 ,  C12P1/04

CPC分类号： A01G7/06 ,  C05F11/08 ,  C12P1/04

摘要： The objective of the invention is to provide an agent for increasing a plant functional component content, which is capable of increasing a content of the plant functional component by being adequately sprayed to the plant or injected into the soil without using stress cultivation conditions or plants with high content of functional component, and a method for manufacturing the same. An agent for increasing a plant functional component content comprising a fatty acid metabolite obtainable by a metabolism of a fatty acid with 4-30 carbon atoms by proteobacteria under a dissolved oxygen concentration of 0.1-8 mg/L, and a method for manufacturing an agent for increasing a plant functional component content comprising a fatty acid metabolite, comprising a step for a fatty acid metabolism wherein a fatty acid with 4-30 carbon atoms is subjected to a proteobacterial metabolization under a dissolved oxygen concentration of 0.1-8 mg/L.

公开(公告)号：US11963298B2

公开(公告)日：2024-04-16

申请号：US17702310

申请日：2022-03-23

申请人： IBIDEN CO., LTD.

发明人： Yoshiki Matsui ,  Atsushi Deguchi

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H05K1/18

CPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/4007 ,  H05K1/18 ,  H05K2201/2081

摘要： A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

公开(公告)号：US20240091866A1

公开(公告)日：2024-03-21

申请号：US18470570

申请日：2023-09-20

申请人： IBIDEN CO., LTD.

发明人： Soma OKUDA

IPC分类号： B23B51/02 ,  B23B41/00

CPC分类号： B23B51/02 ,  B23B41/00 ,  B23B2226/27 ,  B23B2251/40 ,  B23B2265/00

摘要： A drill for forming through holes in a glass fiber reinforced substrate includes a drill body having a cutting edge part on a front end side, and a neck part on a base end side. The cutting edge part has a larger diameter than the neck part. The drill body has a step formed between the cutting edge and neck parts and a single continuous chip evacuation groove having main and secondary grooves. The main groove has an L-shaped cross section and is extending from front end of the cutting edge part over the step to the neck part. The secondary groove has a U-shaped cross section and smaller groove width and depth than the main groove and is extending along the main groove from the front end of the cutting edge part over the step to the neck part and merging into the main groove at the neck part.

公开(公告)号：US11935822B2

公开(公告)日：2024-03-19

申请号：US17359887

申请日：2021-06-28

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L23/49838 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/10 ,  H01L24/12 ,  H01L24/13 ,  H01L24/14

摘要： A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.

公开(公告)号：US11930589B2

公开(公告)日：2024-03-12

申请号：US17467925

申请日：2021-09-07

申请人： IBIDEN CO., LTD.

发明人： Yoshihiko Hayashi

IPC分类号： H05K1/02 ,  G06K19/06 ,  H05K1/09 ,  H05K1/11 ,  H05K3/02

CPC分类号： H05K1/0266 ,  G06K19/06037 ,  H05K1/09 ,  H05K3/027 ,  H05K1/11 ,  H05K2203/107

摘要： A printed wiring board includes a lower layer including conductor layers and insulating layers, a conductor layer formed on the outermost insulating layer in the lower layer, and a solder resist layer formed on the conductor layer such that the solder resist layer is covering the conductor layer on the outermost insulating layer, and a two-dimensional code structure formed on the lower layer and including the conductor layer and a portion of the solder resist layer such that the portion of the solder resist layer has openings forming exposed portions of the conductor layer and that the openings of the solder resist layer and the exposed portions of the conductor layer form the two-dimensional code structure. The conductor layer includes a portion corresponding to the two-dimensional code structure such that the portion of the conductor layer has a residual copper rate that allows the two-dimensional code structure to be read.

公开(公告)号：US20240018889A1

公开(公告)日：2024-01-18

申请号：US18475207

申请日：2023-09-27

申请人： IBIDEN CO., LTD.

发明人： Toshiyuki MAEDA ,  Takayuki KAWABE

IPC分类号： F01N3/28 ,  B01D53/88

CPC分类号： F01N3/2835 ,  B01D53/88

摘要： A mat material having a sufficiently high initial compression surface pressure is provided. The mat material of the present disclosure includes inorganic fibers; and an inorganic binder and an organic binder attached to the inorganic fibers, wherein the mat material has an initial compression surface pressure of 900 kPa or more as measured when compressed to a bulk density of 0.50 g/cm3.

公开(公告)号：US11866378B2

公开(公告)日：2024-01-09

申请号：US16979172

申请日：2019-03-12

申请人： IBIDEN CO., LTD.

发明人： Sonosuke Ishiguro ,  Yoshihiro Koga

IPC分类号： C04B38/00 ,  C04B35/565 ,  C04B38/06 ,  C04B41/45 ,  C04B35/64 ,  C04B35/638 ,  C04B41/87 ,  C04B41/00 ,  C04B35/622 ,  C04B20/10 ,  B28B3/20 ,  C04B35/63

CPC分类号： C04B38/0006 ,  C04B35/565 ,  C04B38/0655 ,  C04B41/4523 ,  C04B41/87 ,  B28B2003/203 ,  C04B20/10 ,  C04B20/1014 ,  C04B35/622 ,  C04B35/63 ,  C04B35/638 ,  C04B35/64 ,  C04B41/0018 ,  C04B41/0072 ,  C04B2235/3826 ,  C04B2235/616

摘要： Disclosed is a method for manufacturing a honeycomb structure. The method includes molding a molded body from a mixture containing silicon carbide particles, an organic component, and a dispersion medium, removing the organic component included in the molded body to obtain a porous honeycomb body, and impregnating an inner portion of partition walls of the porous honeycomb body with metal silicon. In a state in which the porous honeycomb body is placed on a support inside a container containing solid metal silicon, the impregnating an inner portion of the partition walls is performed by heating the inside of the container to a temperature higher than or equal to a melting point of the metal silicon so that the porous honeycomb body is impregnated with molten metal silicon through the support that is porous.