公开(公告)号：US09227955B2

公开(公告)日：2016-01-05

申请号：US14235439

申请日：2012-07-27

Applicant: Ji Han Kim ,  Je Hak Kim ,  Joon Kwang Lee ,  Hahn-Sun Jung ,  Nam Seok Han ,  Yong Park ,  Seung-Hoon Kang ,  Hee Jin Jeong ,  Kyung-Tae Lee ,  Hye Eun Choi ,  Yong Ha Chi ,  Joo Han Lee ,  Soo Heui Paik

Inventor： Ji Han Kim ,  Je Hak Kim ,  Joon Kwang Lee ,  Hahn-Sun Jung ,  Nam Seok Han ,  Yong Park ,  Seung-Hoon Kang ,  Hee Jin Jeong ,  Kyung-Tae Lee ,  Hye Eun Choi ,  Yong Ha Chi ,  Joo Han Lee ,  Soo Heui Paik

IPC: C07D213/02 ,  C07D401/12 ,  C07D401/14 ,  C07D213/82 ,  C07D495/04 ,  C07D413/14 ,  C07D417/14

CPC classification number: C07D401/14 ,  C07D213/82 ,  C07D401/12 ,  C07D413/14 ,  C07D417/14 ,  C07D495/04

Abstract: Disclosed are an anti-angiogenic compound, represented by Chemical Formula I, or a pharmaceutically acceptable salt thereof, a preparation method thereof, and a pharmaceutically acceptable composition including the same. Because the compound of Chemical Formula I potently suppresses the angiogenesis, the compound of Chemical Formula I is applicable to the prevention and treatment of diseases caused by aberrant activity of vascular endothelial growth factor, and available as an anti-angiogenic agent.

Abstract translation: 公开了由化学式I表示的抗血管生成化合物或其药学上可接受的盐，其制备方法和包含其的药学上可接受的组合物。 由于化学式I的化合物有效地抑制了血管生成，所以化学式I的化合物可用于预防和治疗由血管内皮生长因子的异常活性引起的疾病，并可用作抗血管生成剂。

公开(公告)号：US08587946B2

公开(公告)日：2013-11-19

申请号：US12987552

申请日：2011-01-10

Applicant: Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

Inventor： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/1431

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract translation: 一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。 根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且 实现半导体模块插座装置的无噪声和无振动。

公开(公告)号：US20110170264A1

公开(公告)日：2011-07-14

申请号：US12987552

申请日：2011-01-10

Applicant: Joo-han Lee ,  Jung-hoon Kim ,  Seong-chan Han

Inventor： Joo-han Lee ,  Jung-hoon Kim ,  Seong-chan Han

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/1431

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract translation: 一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。 根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且 实现半导体模块插座装置的无噪声和无振动。

公开(公告)号：US20100015362A1

公开(公告)日：2010-01-21

申请号：US12505560

申请日：2009-07-20

Applicant: Joo-Han LEE ,  Dong-Chun LEE ,  Yong-Hyun KIM ,  Seong-Chan Han

Inventor： Joo-Han LEE ,  Dong-Chun LEE ,  Yong-Hyun KIM ,  Seong-Chan Han

IPC: B05D1/18

CPC classification number: H05K3/244 ,  C23C18/1673 ,  C23C18/32 ,  C23C18/42 ,  H05K2203/072 ,  H05K2203/104

Abstract: An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.

Abstract translation: 无电镀装置包括含有金属盐水溶液的电镀液和用于产生磁场的磁场发生器。 将待镀物体浸入溶液中。 由磁场发生器产生的磁场增加金属离子被吸引到物体表面的水平。 因此，可以以快速的速度形成质量好的电镀层。

公开(公告)号：US09313891B2

公开(公告)日：2016-04-12

申请号：US13759504

申请日：2013-02-05

Applicant: Jin-San Jung ,  Joo-Han Lee ,  Hyun-Seok Choi

Inventor： Jin-San Jung ,  Joo-Han Lee ,  Hyun-Seok Choi

IPC: H05K1/14 ,  H05K3/02 ,  H05K3/22 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/141 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/02 ,  H05K3/22 ,  H05K2201/09154 ,  H05K2201/09172 ,  H05K2201/10159 ,  H05K2203/0228 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB includes a body portion including a first surface and a second surface and a metal interconnection layer formed on at least one of the first and second surfaces. The metal interconnecting layer includes tabs formed along a first edge of the body portion. An insertion force alleviation portion in which at least a portion of the body portion is removed is formed in the first edge to reduce the insertion force required to seat the PCB within the slot.

Abstract translation: 印刷电路板（PCB）通过减少PCB插入插槽中时的插入力，防止PCB和插针的插针损坏。 PCB包括主体部分，其包括形成在第一表面和第二表面中的至少一个上的第一表面和第二表面以及金属互连层。 金属互连层包括沿主体部分的第一边缘形成的突出部。 在第一边缘中形成其中去除主体部分的至少一部分的插入力减轻部分，以减小将PCB安置在槽内所需的插入力。

公开(公告)号：US20150140900A1

公开(公告)日：2015-05-21

申请号：US14405116

申请日：2012-06-07

Applicant: Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

Inventor： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

IPC: B24B49/18 ,  B24B53/017 ,  B24B37/005

CPC classification number: B24B49/186 ,  B24B37/005 ,  B24B49/18 ,  B24B53/017

Abstract: Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

Abstract translation: 提供了一种化学机械抛光（CMP）装置，其包括摆动单元，该摆动单元以预定间隔安装在其上放置待调理的CMP垫的压板上，安装在摆动单元的上端的连接器 在摆动单元的垂直方向上的端部，并且围绕摆放单元围绕CMP垫旋转，可旋转地安装在连接器的另一端上的旋转器，耦合到旋转体并在旋转时调节CMP垫的CMP垫调节器，以及 安装在连接器上并检测振动以测量CMP垫调节器的振动加速度的振动计，从而基于振动加速度和CMP垫调节器的安装或使用状态来预测CMP垫的磨损率。

公开(公告)号：US20130344779A1

公开(公告)日：2013-12-26

申请号：US14003493

申请日：2012-03-07

Applicant: Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jong Jae Lee

Inventor： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jong Jae Lee

IPC: B24B53/017 ,  B24D18/00

CPC classification number: B24B53/017 ,  B24D18/00

Abstract: The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a soft pad, and a method of manufacturing the same, wherein the conditioner can be used under CMP conditions using a slurry having a small amount of polishing particles, and/or a porous pad having comparatively low hardness and very high porosity.

Abstract translation: 本发明涉及一种用于化学机械平面化（CMP）焊盘的调节器，其用于作为半导体元件制造工艺的一部分的CMP工艺中，更具体地，涉及一种用于软焊盘的调节器，以及一种方法 的制造方法，其中可以使用具有少量抛光颗粒的浆料在CMP条件下使用调理剂，和/或具有相对低的硬度和非常高的孔隙率的多孔垫。

公开(公告)号：US20100015898A1

公开(公告)日：2010-01-21

申请号：US12565682

申请日：2009-09-23

Applicant: Jung Soo An ,  Joo Han Lee ,  Kyoung Kuk Kwack

Inventor： Jung Soo An ,  Joo Han Lee ,  Kyoung Kuk Kwack

IPC: B24B53/02

CPC classification number: B24B53/017 ,  B24B53/12

Abstract: The present invention provides a conditioner for CMP pad required for global planarization of wafer to achieve high integration of a semiconductor element. The conditioner for CMP pad includes a metal substrate having abrasive particles fixed thereto, a plurality of abrasive particles fixed to the metal substrate, and a layer of metal binder fixing the abrasive particles to the metal substrate. The abrasive particles include at least one pattern. The pattern includes at least one row of abrasive particles and the abrasive particles include bigger abrasive particles and smaller abrasive particles. In addition, a diameter difference between smaller and bigger abrasive particles is 10 to 40%. The present invention ensures uniform dressing of conditioner, superior dressing efficiency and superior performance reproducibility.

Abstract translation: 本发明提供了一种用于对晶片进行全局平坦化所需的CMP焊盘的调节器，以实现半导体元件的高集成度。 用于CMP垫的调节剂包括固定有磨料颗粒的金属基底，固定到金属基底上的多个磨料颗粒和将磨料颗粒固定到金属基底上的金属粘合剂层。 研磨颗粒包括至少一种图案。 该图案包括至少一排研磨颗粒，并且磨料颗粒包括较大的磨料颗粒和较小的磨料颗粒。 此外，较小和较大磨料颗粒之间的直径差为10至40％。 本发明保证了调理剂的均匀整理，优良的切割效率和优异的再现性。

公开(公告)号：US10478941B2

公开(公告)日：2019-11-19

申请号：US13081981

申请日：2011-04-07

Applicant: So Young Yoon ,  Joo Han Lee ,  Jong Jae Lee

Inventor： So Young Yoon ,  Joo Han Lee ,  Jong Jae Lee

IPC: B24B53/12 ,  B24D18/00 ,  B24D3/00 ,  B24B53/017

Abstract: This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.

公开(公告)号：US20140256711A1

公开(公告)日：2014-09-11

申请号：US14235439

申请日：2012-07-27

Applicant: Ji Han Kim ,  Je Hak Kim ,  Joon Kwang Lee ,  Hahn-Sun Jung ,  Nam Seok Han ,  Yong Park ,  Seung-Hoon Kang ,  Hee Jin Jeong ,  Kyung-Tae Lee ,  Hye Eun Choi ,  Yong Ha Chi ,  Joo Han Lee ,  Soo Heui Paik

Inventor： Ji Han Kim ,  Je Hak Kim ,  Joon Kwang Lee ,  Hahn-Sun Jung ,  Nam Seok Han ,  Yong Park ,  Seung-Hoon Kang ,  Hee Jin Jeong ,  Kyung-Tae Lee ,  Hye Eun Choi ,  Yong Ha Chi ,  Joo Han Lee ,  Soo Heui Paik

IPC: C07D401/12 ,  C07D401/14 ,  C07D417/14 ,  C07D495/04 ,  C07D413/14

CPC classification number: C07D401/14 ,  C07D213/82 ,  C07D401/12 ,  C07D413/14 ,  C07D417/14 ,  C07D495/04

Abstract: Disclosed are an anti-angiogenic compound, represented by Chemical Formula I, or a pharmaceutically acceptable salt thereof, a preparation method thereof, and a pharmaceutically acceptable composition including the same. Because the compound of Chemical Formula I potently suppresses the angiogenesis, the compound of Chemical Formula I is applicable to the prevention and treatment of diseases caused by aberrant activity of vascular endothelial growth factor, and available as an anti-angiogenic agent.

Abstract translation: 公开了由化学式I表示的抗血管生成化合物或其药学上可接受的盐，其制备方法和包含其的药学上可接受的组合物。 由于化学式I的化合物有效地抑制了血管生成，所以化学式I的化合物可用于预防和治疗由血管内皮生长因子的异常活性引起的疾病，并可用作抗血管生成剂。