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    METHOD FOR FORMING NANOMETER SCALE DOT-SHAPED MATERIALS
    11.
    发明申请
    METHOD FOR FORMING NANOMETER SCALE DOT-SHAPED MATERIALS 有权
    形成纳米尺度形状材料的方法

    公开(公告)号：US20100270516A1

    公开(公告)日：2010-10-28

    申请号：US12563419

    申请日：2009-09-21

    Applicant: Chun-An LU ,  Hong-Ching LIN ,  Kuo-Chan CHIOU ,  Szu-Po HUANG

    Inventor： Chun-An LU ,  Hong-Ching LIN ,  Kuo-Chan CHIOU ,  Szu-Po HUANG

    IPC: H01B1/12

    CPC classification number: B22F9/30 ,  B22F1/025 ,  B22F2998/00 ,  C01G1/02 ,  C01P2002/72 ,  C01P2006/40 ,  C09D11/52 ,  B22F2301/10 ,  B22F2301/052 ,  B22F2301/15 ,  B22F2301/25 ,  B22F2301/205 ,  B22F2301/30 ,  B22F2301/35

    Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.

    Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。

    ENCAPSULATION COMPOSITION FOR PRESSURE SIGNAL TRANSMISSION AND SENSOR
    13.
    发明申请
    ENCAPSULATION COMPOSITION FOR PRESSURE SIGNAL TRANSMISSION AND SENSOR 审中-公开
    用于压力信号传输和传感器的封装组件

    公开(公告)号：US20090235754A1

    公开(公告)日：2009-09-24

    申请号：US12477336

    申请日：2009-06-03

    Applicant: Feng-Po Tseng ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Syh-Yuh Cheng ,  Chih-Wei Hsu

    Inventor： Feng-Po Tseng ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Syh-Yuh Cheng ,  Chih-Wei Hsu

    IPC: G01L9/00 ,  C08L63/00

    CPC classification number: C08G59/3227 ,  C08G59/245 ,  C08L33/00 ,  C08L63/00 ,  G01L19/147 ,  H01L23/293 ,  H01L2924/0002 ,  C08L2666/04 ,  H01L2924/00

    Abstract: An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.

    Abstract translation: 提供一种用于压力信号传输的包封组合物，其包括柔性和低模量环氧树脂作为与具有作为填料的压力信号传输性能的塑料球组合的物质。 因此，通过利用柔性环氧树脂在压力下容易变形的性质来传递压力信号。 并且通过塑料球之间的接触增强了信号传输的效果。 封装组合物用于传输压力信号的传感器中。 封装组合物是疏水性的，因此可以防止传感器的电子设备防止水分或水分延长其使用寿命。 与使用液体传输压力信号的传统传感器相比，采用固体封装组合的传感器具有生产加工容易等优点。

    Composition of thermal interface material
    14.
    发明申请
    Composition of thermal interface material 审中-公开
    热界面材料的组成

    公开(公告)号：US20070142540A1

    公开(公告)日：2007-06-21

    申请号：US11430700

    申请日：2006-05-08

    Applicant: Kuo-Chan Chiou ,  Lu-Shih Liao ,  Tzong-Ming Lee

    Inventor： Kuo-Chan Chiou ,  Lu-Shih Liao ,  Tzong-Ming Lee

    IPC: C08K3/04

    CPC classification number: C08K7/06 ,  H01L23/42

    Abstract: A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7˜10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength.

    Abstract translation: 提供了热界面材料的组合物。 解决了常规热界面材料中低热导率和高热阻的缺点。 通过使用具有高导热性的碳纤维，热界面材料的导热率可以比传统的热界面材料高约7〜10倍。 碳纤维的添加量小于金属或陶瓷粉末的添加量。 从而改善了分散过程。 此外，热界面材料的相变温度在约40〜65℃。器件表面上的孔，间隙和凹痕在器件的正常工作温度下被填充，以降低整个器件的热阻并增加 界面粘合强度。

    Conductive pastes
    16.
    发明授权
    Conductive pastes 有权
    导电膏

    公开(公告)号：US08784697B2

    公开(公告)日：2014-07-22

    申请号：US13560273

    申请日：2012-07-27

    Applicant: Kuo-Chan Chiou ,  Jun-Rong Chen ,  Hsin-Mei Chen

    Inventor： Kuo-Chan Chiou ,  Jun-Rong Chen ,  Hsin-Mei Chen

    IPC: H01B1/20 ,  C09D5/24

    CPC classification number: H01B1/22

    Abstract: A conductive paste is provided. The conductive paste includes a conductive powder and a resin composition. The resin composition includes a polyester acrylate oligomer, a hydroxyalkyl acrylate (HAA) and a polyvinylpyrrolidone (PVP) derivative. The conductive powder and the resin composition have a weight ratio of 40-85:15-60. The polyester acrylate oligomer, the hydroxyalkyl acrylate (HAA) and the polyvinylpyrrolidone (PVP) derivative have a weight ratio of 15-70:10-60:3-40.

    Abstract translation: 提供导电浆料。 导电浆料包括导电粉末和树脂组合物。 树脂组合物包括聚酯丙烯酸酯低聚物，丙烯酸羟烷基酯（HAA）和聚乙烯吡咯烷酮（PVP）衍生物。 导电粉末和树脂组合物的重量比为40-85:15-60。 聚酯丙烯酸酯低聚物，丙烯酸羟烷基酯（HAA）和聚乙烯吡咯烷酮（PVP）衍生物的重量比为15-70：10-60：3-40。

    HEAT SPREADING STRUCTURE
    17.
    发明申请
    HEAT SPREADING STRUCTURE 审中-公开
    散热结构

    公开(公告)号：US20110141698A1

    公开(公告)日：2011-06-16

    申请号：US12730082

    申请日：2010-03-23

    Applicant: Kuo-Chan Chiou ,  Ching-Ting Huang ,  Chen-Lung Lin

    Inventor： Kuo-Chan Chiou ,  Ching-Ting Huang ,  Chen-Lung Lin

    IPC: H05K7/20

    CPC classification number: H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure.

    Abstract translation: 所公开的是设置在发热装置和散热部件之间的热界面层。 热界面层由树脂基体和高导热性粉末的混合物组成，其中树脂基体通过环氧树脂，二异氰酸酯和氨基固化剂反应获得。 调整二异氰酸酯和环氧树脂的比例可以改变热界面材料的硬度和粘度。 经过长时间的高温反复测试后，所述的热界面层仍保持粘胶，柔软和耐热。 热界面材料在电子设备和水槽之间的空隙中的填充效果大大提高。 热塑性热界面材料可以填充电子设备表面上的空隙或空腔，从而提高整个结构的散热效率。

    Composition for thermal interface material
    18.
    发明授权
    Composition for thermal interface material 有权
    热界面材料的组成

    公开(公告)号：US07662307B2

    公开(公告)日：2010-02-16

    申请号：US11415610

    申请日：2006-05-01

    Applicant: Kuo-Chan Chiou ,  Tzong-Ming Lee

    Inventor： Kuo-Chan Chiou ,  Tzong-Ming Lee

    IPC: C08K5/07 ,  C08K3/04

    CPC classification number: C09K19/38 ,  B82Y30/00 ,  C08K3/04 ,  C08K2201/011 ,  C09K19/52

    Abstract: A composition for a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. The CNT-LC thermal composite structure is formed by using carbon nanotube with high thermal conductivity and liquid crystal polymer with the well-ordered structure. The thermal interface material thereby has a high thermal conductivity. The added amount of carbon nanotube is less than the added amount of metal or ceramic powders in the prior art for improving the dispersion process. The CNT-LC thermal composite structure and the phase change resin are compatible without phase separation. The thermal interface material has a phase change temperature about 45˜75° C. Any holes, gaps and dents on the surface of device are filled at the normal operating temperature of device to reduce the thermal resistance of the entire device.

    Abstract translation: 提供了用于热界面材料的组合物。 解决了常规热界面材料中低热导率和高热阻的缺点。 CNT-LC热复合结构通过使用具有高导热性的碳纳米管和具有良好结构的液晶聚合物形成。 因此，热界面材料具有高导热性。 碳纳米管的添加量小于现有技术中用于改善分散过程的金属或陶瓷粉末的添加量。 CNT-LC热复合结构和相变树脂在不相分离的情况下是相容的。 热界面材料的相变温度约为45〜75°C。器件表面的任何孔，间隙和凹痕都会在器件的正常工作温度下填充，以降低整个器件的热阻。

    Method for forming nanometer scale dot-shaped materials
    20.
    发明授权
    Method for forming nanometer scale dot-shaped materials 有权
    形成纳米级点状材料的方法

    公开(公告)号：US08911821B2

    公开(公告)日：2014-12-16

    申请号：US12563419

    申请日：2009-09-21

    Applicant: Chun-An Lu ,  Hong-Ching Lin ,  Kuo-Chan Chiou ,  Szu-Po Huang

    Inventor： Chun-An Lu ,  Hong-Ching Lin ,  Kuo-Chan Chiou ,  Szu-Po Huang

    IPC: B05D5/12 ,  B22F9/30 ,  B22F1/02 ,  C01G1/02 ,  C09D11/52

    CPC classification number: B22F9/30 ,  B22F1/025 ,  B22F2998/00 ,  C01G1/02 ,  C01P2002/72 ,  C01P2006/40 ,  C09D11/52 ,  B22F2301/10 ,  B22F2301/052 ,  B22F2301/15 ,  B22F2301/25 ,  B22F2301/205 ,  B22F2301/30 ,  B22F2301/35

    Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.

    Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。

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