Abstract:
Apparatus and a method for performing high resolution optical imaging in the near infrared of internal features of semiconductor wafers uses an optical device made from a material having a high index of refraction and held in very close proximity to the wafer. The optical device may either be a prism or a plano-convex lens. The plano-convex lens may be held in contact with the wafer or separated from the wafer via an air bearing or an optical coupling fluid to allow the sample to be navigated beneath the lens. The lens may be used in a number of optical instruments such as a bright field microscope, a Schlieren microscope, a dark field microscope, a Linnik interferometer, a Raman spectroscope and an absorption spectroscope.
Abstract:
An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided.
Abstract:
An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane A method of alignment is also provided.
Abstract:
An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided.
Abstract:
An optoelectronic device includes a substrate having a surface, a metallic coupling structure deposited on the surface of the substrate, the metallic coupling structure having a port and a waveguide interface portion with at least two waveguide interface portion sides, and a dielectric waveguide, the dielectric waveguide having a coupling interface portion deposited adjacent the at least two waveguide interface portion sides of the waveguide interface portion of the metallic coupling structure. It is possible to form high speed, CMOS-process-compatible, low power optical-electrical and electrical-optical conversion devices (i.e. optical detectors, modulators, and frequency mixer's) on the top of the semiconductor chip, after the rest of the wiling has been laid down.
Abstract:
The present invention is in the field of sensor fusion, and discloses in one embodiment a method for extracting the trajectories of moving objects from an assembly of low-resolution sensors, whose spatial relationships are initially unknown, except that their fields of view are known to overlap so as to form a continuous coverage region, which may be much larger than the field of view of any individual sensor. Segments of object trajectories may be extracted from the data of each sensor, and then stitched together to reconstruct the trajectories of the objects. The stitching process also allows determination of the spatial relationships between the sensors, so that from initially knowing little or nothing about the sensor arrangement or the paths of the objects, both may be reconstructed unambiguously.
Abstract:
An assembly comprising a 3-D scanner and suitable for capturing at least one of objects, or textures, or documents. The assembly preferably can be developed as a pocket page scanner having dimensions approximately the size of a chalkboard eraser. The assembly preferably utilizes an alignment-insensitive diode laser interferometer. In operation, the assembly enables a user to scan any page-sized area in e.g., a half of second, store a hundred or so of them, then play them back into a PC infrared port for OCR, printing, archival storage, or further processing.
Abstract:
Ionization of air without the use of corona discharge tips, thereby to avoid the generation of particulates from corrosion of the corona tips, is accomplished by use of a laser beam focussed to a small focal volume of intense electric field adjacent a semiconductor chip. The electric field is sufficiently intense to ionize air. In the manufacture of a semiconductor circuit chip, during those steps which are conducted in an air environment, opportunity exists to remove from a surface of a chip, or wafer, charge acquired during the manufacturing process. The ionized air is passed along the chip surface. Ions in the air discharge local regions of the chip surface which have become charged by steps of a manufacturing process. By way of further embodiment of the invention, the ionization may be produced by injection of molecules of water into the air, which molecules are subsequently ionized by a laser beam and directed toward the chip via a light shield with the aid of a magnetic field.
Abstract:
A particle detector that determines the presence of particles in an enclosed volume includes a laser that directs a coherent optical beam to a beam splitter that produces first and second divergent beams. An optical system images the point of origin of the two divergent beams within the beam splitter into the enclosed volume, whereby the first and second beams are caused to intersect and interfere at an inspection region within the volume. A detector is positioned adjacent the volume and is responsive to light scattered from one of the beams, as a result of a particle passing through the inspection region, to produce an electrical signal indicative of the intensity of the scattered light. A signal processor analyzes the electrical signals and to determine the presence of the particle. An embodiment of the invention includes an acousto-optic modulator to enable one of the beams to be frequency shifted from the other beam so as to enable the presence of a carrier signal on which a particle's Doppler frequency is modulated. Another embodiment relies upon the Doppler modulation of a reflected optical beam to create an interference pattern at a detector.
Abstract:
A clean non-hydrogen-containing dry gas flows through the corona points of a clean room corona air ionizer in order to suppress the generation of particles.