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    STACKED-LAYERS FORMING DEVICE
    11.
    发明申请
    STACKED-LAYERS FORMING DEVICE 有权
    堆叠成型装置

    公开(公告)号：US20110109016A1

    公开(公告)日：2011-05-12

    申请号：US12988723

    申请日：2009-04-20

    Applicant: Isao Fuwa ,  Norio Yoshida ,  Yoshikazu Higashi ,  Satoshi Abe ,  Masataka Takenami

    Inventor： Isao Fuwa ,  Norio Yoshida ,  Yoshikazu Higashi ,  Satoshi Abe ,  Masataka Takenami

    IPC: B29C67/00

    CPC classification number: B22F3/1055 ,  B22F3/004 ,  B22F2003/1056 ,  B22F2003/1059 ,  B22F2999/00 ,  B23P15/00 ,  B29C64/153 ,  B33Y30/00 ,  Y02P10/295 ,  B65G33/00

    Abstract: There is provided a stacked-layers forming device including a powder layer-forming part for forming a powder layer, an optical device for forming a solidified layer by irradiating a predetermined portion of the powder layer with a light beam and a powder replenishing means for supplying the powder material to above a base on which the powder layer and the solidified layer are stacked or onto an upper surface of a base frame which surrounds the base. The powder replenishing means includes an approximately cylindrical member in which the powder material is charged and a screw member which is installed within the approximately cylindrical member wherein a rotation of the screw member conveys the powder material in the approximately cylindrical member. The stacked-layers forming device of the present invention enables it to not only curb its height since the powder material can be conveyed in a screw manner, but also achieve an improved cycle of the material since the powder material can be conveyed in one direction.

    Abstract translation: 提供了一种层叠形成装置，其包括用于形成粉末层的粉末层形成部分，通过用光束照射粉末层的预定部分来形成固化层的光学装置和用于供应粉末的粉末补给装置 将粉末材料层叠在其上层叠有粉末层和固化层的基材的上方或位于围绕基材的基部框架的上表面上。 粉末补充装置包括大致圆柱形的构件，粉末材料被装入其中，螺钉构件安装在大致圆筒形构件内，其中螺杆构件的旋转将粉末材料输送到大致圆筒形构件中。 本发明的叠层形成装置不仅可以抑制粉末材料以螺旋方式输送的高度，而且可以实现材料的循环改善，因为粉末材料可以沿一个方向输送。

    Apparatus for producing a laminated object
    12.
    发明申请
    Apparatus for producing a laminated object 有权
    用于制造层叠物的装置

    公开(公告)号：US20100031882A1

    公开(公告)日：2010-02-11

    申请号：US12461176

    申请日：2009-08-04

    Applicant: Satoshi Abe ,  Yoshikazu Higashi ,  Isao Fuwa ,  Masataka Takenami ,  Norio Yoshida

    Inventor： Satoshi Abe ,  Yoshikazu Higashi ,  Isao Fuwa ,  Masataka Takenami ,  Norio Yoshida

    IPC: B05C9/12 ,  B05C19/00

    CPC classification number: B22F3/1055 ,  B05C5/02 ,  B05C9/14 ,  B05C11/028 ,  B05C19/04 ,  B22F2003/1056 ,  B22F2999/00 ,  B29C64/153 ,  B29C64/329 ,  B33Y30/00 ,  Y02P10/295 ,  B22F3/003

    Abstract: An apparatus for producing a laminated object, includes a powder layer forming unit for forming a powder layer of a powdery material, a material supply unit for feeding the powdery material to the powder layer forming unit; and a solidified layer forming unit for forming a solidified layer by irradiating a light beam on a specified portion of the powder layer and sintering or melting the specified portion of the powder layer. The apparatus is configured to produce an integrally laminated three-dimensional object by repeating formation of the powder layer and formation of the solidified layer. The material supply unit includes a cartridge unit charged with the powdery material, the cartridge unit being configured to allow the powdery material to drop downwards.

    Abstract translation: 一种叠层体的制造装置，具有形成粉末状粉末层的粉末层形成单元，将粉末状材料供给到粉末层形成单元的材料供给单元， 以及固化层形成单元，用于通过在粉末层的特定部分上照射光束并烧结或熔化粉末层的特定部分来形成固化层。 该装置被配置为通过重复形成粉末层和形成固化层来制造整体层叠的三维物体。 材料供应单元包括充满粉末材料的盒单元，盒单元构造成允许粉状材料向下落。

    SEMICONDUCTOR DEVICE
    13.
    发明申请
    SEMICONDUCTOR DEVICE 失效
    半导体器件

    公开(公告)号：US20090045521A1

    公开(公告)日：2009-02-19

    申请号：US12188881

    申请日：2008-08-08

    Applicant: Satoshi ABE

    Inventor： Satoshi ABE

    IPC: H01L23/48

    CPC classification number: H01L23/5226 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor device includes: an interlayer insulation film; a lower interconnection layer; an upper interconnection layer; and a via hole extending through the interlayer insulation film to establish electric connection between the lower and upper interconnections; wherein a plurality of interconnection lines is provided in the lower interconnection layer, and a contact region is formed for contact with the via hole by partially joining at least two interconnection lines, and a void exists in a first region of the interlayer insulation film located between adjacent interconnection lines, and no void exists in a second region of the interlayer insulation film located between a contacting portion of the via hole in the contact region and an interconnection line adjacent to the contact region, whereby reliably preventing any contact between a via hole and a void formed in an interlayer insulation film even when the via hole is greatly displaced.

    Abstract translation: 半导体器件包括：层间绝缘膜; 下互连层; 上互连层; 以及延伸穿过层间绝缘膜的通孔，以在下互连和上互连之间建立电连接; 其中在所述下互连层中设置多个互连线，并且通过部分地接合至少两个互连线而形成与所述通孔相接触的接触区域，并且位于所述层间绝缘膜的位于 相邻的互连线，并且位于接触区域中的通孔的接触部分和与接触区域相邻的互连线之间的层间绝缘膜的第二区域中不存在空隙，从而可靠地防止通孔和 即使当通孔大大移位时也形成在层间绝缘膜中的空隙。

    Photo-Shaping Method, Photo-Shaping System, And Photo-Shaping Program
    14.
    发明申请
    Photo-Shaping Method, Photo-Shaping System, And Photo-Shaping Program 有权
    照相成型方法，照片整形系统和照片整形程序

    公开(公告)号：US20080286139A1

    公开(公告)日：2008-11-20

    申请号：US11577933

    申请日：2005-10-21

    Applicant: Satoshi Abe ,  Hirokazu Shinkai

    Inventor： Satoshi Abe ,  Hirokazu Shinkai

    IPC: B22F3/10

    CPC classification number: B22F3/1055 ,  B22F2003/1057 ,  B22F2999/00 ,  B29C64/153 ,  B29C2037/903 ,  G05B2219/49018 ,  Y02P10/295 ,  B22F2203/01

    Abstract: In photo-shaping a target object executed by a photo-shaping machine (10) along with a computing device (1), a first path (P1) is generated as a light beam irradiation path on the basis of contour data of each section sliced at a specified pitch of three-dimensional CAD model data of the target object desired to be formed, and the first parameter data. A second path (P2) is generated as a removal processing path on the basis of the three-dimensional CAD model data, the second parameter data, and removing timing data showing a timing of executing the removal process. Driving programs (P3) are generated for executing the photo-shaping process including the light beam irradiation and the removal process, on the basis of the first path data, second path data and removing timing data, thereby performing the photo-shaping and removal process according to the driving programs.

    Abstract translation: 在计算装置（1）中，由光成形机（10）执行的目标对象的光成形中，基于各部分的轮廓数据，产生第一路径（P 1）作为光束照射路径 以希望形成的目标对象的三维CAD模型数据的指定间距切片，以及第一参数数据。 基于三维CAD模型数据，第二参数数据和表示执行去除处理的定时的移除定时数据，生成第二路径（P 2）作为去除处理路径。 基于第一路径数据，第二路径数据和去除定时数据，产生用于执行包括光束照射和去除处理的光成形处理的驱动程序（P 3），由此执行光成形和去除 根据驾驶程序进行处理。

    High-macropore hydroprocessing catalyst and its use
    15.
    发明授权
    High-macropore hydroprocessing catalyst and its use 有权
    高大孔加氢处理催化剂及其用途

    公开(公告)号：US07186329B2

    公开(公告)日：2007-03-06

    申请号：US10480066

    申请日：2002-06-10

    Applicant: Satoshi Abe ,  Akira Hino ,  Masafumi Shimowake ,  Katsuhisa Fujita

    Inventor： Satoshi Abe ,  Akira Hino ,  Masafumi Shimowake ,  Katsuhisa Fujita

    IPC: B01J23/00 ,  C01G45/04 ,  C01G47/00

    CPC classification number: B01J35/10 ,  B01J21/04 ,  B01J23/85 ,  B01J23/883 ,  B01J35/1019 ,  B01J35/1042 ,  B01J35/108 ,  B01J37/0009 ,  B01J37/03 ,  C10G45/08 ,  C10G47/12 ,  C10G49/12

    Abstract: The present invention pertains to a catalyst comprising 7–20 wt. % of a Group VIB metal component, calculated as trioxide on the weight of the catalyst, and 0.5 to 6 wt. % of a Group VIII metal component, calculated as oxide on the weight of the catalyst, on a porous inorganic carrier. The catalyst has a specific surface area of 100–180 m2/g, a total pore volume of at least 0.55 ml/g, at least 50% of the total pore volume in pores with a diameter of at least 20 nm (200 Å), 10–30% of the total pore volume in pores with a diameter of at least 200 nm (2000 Å), and 0–1% of the total pore volume in pores with a diameter above 1000 nm (10000 Å). The catalyst is particularly suitable for the hydroprocessing of heavy hydrocarbon feeds of which at least 50 wt. % boils above 538° C. (1000° F.). It is especially advantageous for the hydroprocessing of feedstocks of which at least 80 wt. % boils above 538° C. (1000° F.).

    Abstract translation: 本发明涉及包含7-20wt。 基于催化剂重量计算的三氧化铀VIB金属组分的％和0.5-6重量％ ％的第VIII族金属组分（以氧化物计，以催化剂的重量计）在多孔无机载体上。 催化剂的比表面积为100-180平方米/克，总孔体积至少为0.55毫升/克，孔中总孔体积的至少50％直径为 直径至少为200nm（2000）的孔中的至少20nm（200），总孔体积的10-30％，以及直径大于1000的孔中的总孔体积的0-1％ nm（10000）。 催化剂特别适用于重烃进料的加氢处理，其中至少50wt。 ％沸点高于538°C（1000°F）。 特别有利的是其原料的加氢处理至少80wt。 ％沸点高于538°C（1000°F）。

    Electronic equipment and input control method
    16.
    发明申请
    Electronic equipment and input control method 审中-公开
    电子设备及输入控制方式

    公开(公告)号：US20060152485A1

    公开(公告)日：2006-07-13

    申请号：US11119781

    申请日：2005-05-03

    Applicant: Nobuyuki Kobayashi ,  Satoshi Abe ,  Katsunori Masamune

    Inventor： Nobuyuki Kobayashi ,  Satoshi Abe ,  Katsunori Masamune

    IPC: G09G5/08

    CPC classification number: G06F3/03547 ,  G06F3/0338 ,  G06F3/038

    Abstract: In electronic equipment comprising input devices of a stick-like pointing device and a pad-like pointing device, and a controller that controls a manipulation performed on the pad-like pointing device as a manipulation performed on a button during a predetermined time after the stick-like pointing device is completed. Owing to this feature, electronic equipment offering excellent maneuverability can be provided without an increase in the number of operation buttons.

    Abstract translation: 在包括棒状指示装置和垫状指示装置的输入装置的电子设备中，以及控制器，其在所述棒状指示装置之后的预定时间期间控制对所述垫状指示装置执行的操作作为在按钮上执行的操作 类似的定点设备完成。 由于该特征，可以提供提供良好机动性的电子设备，而不增加操作按钮的数量。

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