Abstract:
A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.
Abstract:
A thick film resistor composition, comprising a silicide powder composed of a molybdenum disilicide, a tantalum disilicide and a magnesium silicide, and an alkaline earth borosilicate glass powder dispersed in a vehicle containing a heat-depolymerizing organic polymer. The thick film resistor composition, employing this heat-depolymerizing organic polymer, can be fired in a nonoxidizing atmosphere and coexist with base metal materials such as copper electrodes. Owing to the Nb.sub.2 O.sub.5 and Ta.sub.2 O.sub.5 contained in the alkaline earth borosilicate glass powder, the thick film resistor composition is free from sheet resistivity fluctuation, according to resistor length, which would result from diffusion of the electrode material into the resistor.
Abstract translation:一种厚膜电阻组合物,包括由二硅化钼,二硅化硅和硅化镁组成的硅化物粉末和分散在含有热解聚有机聚合物的载体中的碱土金属硼硅玻璃粉末。 使用该热解聚有机聚合物的厚膜电阻组合物可以在非氧化气氛中烧制,并与诸如铜电极的贱金属材料共存。 由于碱土金属硼硅酸盐玻璃粉末中含有的Nb 2 O 5和Ta 2 O 5,根据由电极材料扩散到电阻器中的电阻器长度,厚膜电阻组合物没有电阻率波动。
Abstract:
A three-dimensional virtual space simulator comprises a section for determining the action of an avatar according to the input by the user and generating action instruction data representing the content of the action, a section for determining the action of an agent autonomously and generating action instruction data representing the content of the action, and a process control section for displaying each character in a virtual space according to the action instruction data received from the sections wherein the process control section and a graphic process section share an interface for receiving the action instruction data from the avatar action instruction section, and an interface for receiving the action instruction data from the agent action instruction section. Consequently, a flexible participation mode of the user and high reliability are realized.
Abstract:
It is to provide a production process by which gelation can be prevented, in a case where a solvent is removed from a curable fluororesin to obtain a chief material resin, and then coating additives such as a curing agent are mixed to produce a powder coating composition, or in a case where a curable fluororesin, a curing agent and various additives are dissolved or dispersed in a solvent to prepare a raw material solution, and the solvent is removed from the raw material solution to directly produce a powder coating material.To a solution or dispersion of a curable fluorinated copolymer (A), a gelation inhibitor (B) is added, followed by mixing, or a gelation inhibitor (B), a curing agent (C) and as the case requires, various additives (D) are added, followed by mixing, and the solution or dispersion is supplied to a thin-film vacuum evaporator to remove the solvent.
Abstract:
A substantially solvent-free and stable crystal of the compound of the formula: ##STR1## wherein the ring A may optionally be substituted, R.sup.1 represents hydrogen or an N-protecting group, each of R.sup.2, R.sup.3 and R.sup.4 (1) a hydrogen atom, (2) an alkyl group which may optionally be substituted with halogen atom(s) or (3) an alkoxy group which may optionally be substituted with halogen atom(s) or alkoxy; or its salt, is produced by subjecting a solvate of the compound (I) or its salt to de-solvent treatment, in an industrially advantageous method.
Abstract:
A strip line-type high-frequency element constituted by a laminate including a first ground conductor electrode substrate 2; a substrate 3 having a first strip line electrode 3a of less than one turn having a through-hole round electrode 3e; a substrate 4 having a second strip line electrode 4a of one or more turns having a through-hole electrode 4f; a substrate 5 having a third strip line electrode 5a of one or more turns having a through-hole round electrode 5e; a substrate 6 having a fourth strip line electrode 6a of less than one turn having a through-hole electrode 6f; a second ground conductor electrode substrate 7; and a protective substrate 8, wherein the through-hole round electrode 3e of the first strip line electrode 3a is connected to the through-hole electrode 4f of the second strip line 4a to form a first line, and the through-hole round electrode 5e of the third strip line electrode 5a is connected to the through-hole electrode 6f of the fourth strip line 6a to form a second line, one of the first and second lines being a main line while the other being a sub-line, whereby the strip line-type high-frequency element functions as a directional coupler.
Abstract:
A diphenylmethane compound (III) can be produced in a good yield by allowing a phenol compound (I) to react with a stilbene compound (II) in the presence of methanesulfonic acid ##STR1##
Abstract:
A resistor composition containing no boride powder is obtained by mechanical grinding of at least one of silicon, silicon monoxide and higher oxidation state precursor of silicon monoxide; and a borosilicate glass containing at least one of zirconium oxide, vanadium pentoxide, chromium oxide, tungsten trioxide, molybdenum trioxide, manganese oxide, titanium oxide, niobium pentoxide and tantalum pentoxide, which are capable of being reduced with silicon, silicon monoxide or higher oxidation state precursor of silicon monoxide. In a sintering step in a non-oxidizing atmosphere, boron oxide and at least one another oxide contained in the borosilicate glass are reduced by silicon, silicon monoxide, higher oxidation state precursor of silicon monoxide or silicide, and metal elements of the oxides contained in the glass combine with each other, so that fine particles of boride are precipitated around glass particles to form a graze resistor.
Abstract:
A machine translation device includes: an accepting portion that accepts a first-language document; storage portion in which are stored one or more pieces of multilingual parallel translation information that are each a set of synonymous words in the first language through the Nth language (N is 3 or more integer); a selecting portion that selects the multilingual parallel translation information including a word included in an ith-language document (i is an integer of 1 to N-1) from the one or more pieces of multilingual parallel translation information; a machine translation portion that repeats processing of machine translating the ith-language document into an (i+1)th language document until machine translation into the Nth language has been performed, so as to use parallel-translation relation between two languages included in the selected multilingual parallel translation information; and an output portion that outputs the Nth-language document.
Abstract:
A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.