摘要:
A stabilizing system for a plasma process is provided. The system has a high frequency power source, a plasma chamber, a control circuit for outputting a control signal, first switch element and an impedance matching network. The first switch element has a first, a second and a first switch control terminals, wherein the first and the first switch control terminals are coupled to the control circuit to determines whether the first and the second terminals element are connected or not according to the control signal. The impedance matching network has a first terminal coupled to the plasma chamber, a second terminal coupled to the high frequency power source and a matching control terminal coupled to the second terminal of the first switch element. In this way, whether an impedance matching auto-tune operation for the high frequency power is performed or not is determined based on the control signal.
摘要:
An apparatus (3) for removing developing solution from a substrate (30) includes a working table (36) for placing the substrate, a supporting frame (33) positioned on the working table, a gas dispensing nozzle (31) mounted on the supporting frame, and a water dispensing nozzle (32) mounted on the supporting frame. The apparatus can remove the residual developing solution from the substrate and needs not to lift the substrate. The substrate is safely processed and the working time is improved.
摘要:
A coating apparatus (20) for forming a photoresist film on a substrate (21) includes a flat table (30), a nozzle unit (40), and a particle cleaning unit (50). The flat table is used for supporting the substrate. The nozzle unit is used for dispensing photoresist material on a top surface of the substrate. The particle cleaning unit is used for removing particles from the top surface before the photoresist material is coated thereon. The coating apparatus can timely clean the substrate before coating. The coating performance is improved, and the nozzle unit is protected from being scratched or damaged.
摘要:
A membrane probe card is provided. The membrane probe card includes a pressure mechanism having an upper-housing and a support block. The support block has a spring system for providing a distance of travel to the support block. A printed circuit board is coupled to the pressure mechanism for providing electrical connection to a test apparatus. A membrane assembly is coupled to the pads on a wafer for providing electric connection to the printed circuit board. The membrane assembly is a replaceable and modularized component for application to integrated circuits with various layouts and dimensions.
摘要:
This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
摘要:
An interactive game system has a main apparatus and a wireless controller. The main apparatus has three ultrasonic receiving modules. The wireless controller has an ultrasonic sending module. The three ultrasonic receiving modules receive ultrasonic signals sent by the ultrasonic sending module, and the main apparatus calculates the position of the wireless controller. When the wireless controller is moved, the main apparatus obtains a plurality of coordinate values indicating the motion track of the wireless controller. In this case, an electronic device shows the movement of the wireless controller on a display device by monitoring the coordinate values.
摘要:
An improved electrical hydraulic jack of the type having of a jack body with a lift structure and a manually adjustable crown rod telescopically disposed therein, a base plate integrally formed to the jack body, a motor assembly matched with a housing body fixed on the base plate in upright position, wherein the improvement comprises a transmission device installed in the upper portion of the housing body in connection with the motor assembly, and a driving device mechanically coupled between the transmission device and the jack body, thereby, the high revolution of the motor assembly will be reduced, and the revolving motion will be converted into straight line movement for effecting hydraulic lift operation therewith.
摘要:
This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead. In another arrangement, the anodic and cathodic leads are bent by about 90 degree so that they point to the two sides of the packaging. External terminals are placed on the two sides of the packaging on the surfaces of the insulating material. In still another arrangement, the packaging structure uses only one protective substrate.
摘要:
This invention provides an RFID real-time information system accommodated to a semiconductor supply chain for exchanging real-time information. The RFID real-time information system is characterized by comprising an RFID middleware module for generating a stock and logistic information corresponding to a plurality of carriers and wafers from a tag information; a manufacturing information module for storing an object information corresponding to the plurality of wafers; a real-time information module for integrating the RFID middleware module with the manufacturing information module to generate real-time information corresponding to the plurality of wafers and carriers; and a business-to-business (B2B) e-commerce module comprising a plurality of B2B servers respectively disposed in vendors in the semiconductor supply chain for connecting and exchanging the real-time information through a standard protocol of e-commerce.
摘要:
This invention provides a wafer testing system and testing method thereof. The wafer testing system comprises a wafer storage section, a prober, a tester, an RFID middleware unit, an EDA system and an MES system. The wafer storage section stores a multiplicity of carriers, each of which is provided with at least a RFID tag. The prober comprises a RFID reader to read a tag information. The tester sends a test signal to the prober for implementing the wafer test so as to generate a test result and calls an interface program to convert the test result into a file conformed with a specific data format. The RFID middleware unit receives the tag information and calls related applications to process the tag information so as to generate a wafer information. The EDA system receives the file of the specific data format converted from the interface program and calculates thereof to generate a wafer yield information after wafer test. The MES system integrates the wafer information from the RFID middleware unit with the yield information from the EDA system so as to allow monitoring the wafer manufacturing process and testing yield rate in a real-time manner.