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公开(公告)号:US20220225508A1
公开(公告)日:2022-07-14
申请号:US17146295
申请日:2021-01-11
Applicant: X-Celeprint Limited
Inventor: Ronald S. Cok
IPC: H05K1/18 , H01L25/065 , H05K1/02 , H05K1/11 , H05K1/16
Abstract: A stacked electronic component comprises a stack of three or more print layers. Each print layer has an area less than any print layers beneath the print layer in the stack. Each print layer comprises a dielectric layer and a functional layer disposed on the dielectric layer. The functional layer comprises an exposed conductive portion that is not covered with a dielectric layer of any of the print layers and each exposed conductive portion is nonoverlapping with any other exposed conductive portion. A patterned electrode layer is coated on at least a portion of the stack and defines one or more electrodes. Each electrode of the one or more electrodes in electrical contact with an exclusive subset of the exposed conductive portions. The functional layers can be passive conductors forming capacitors, resistors, inductors, or antennas, or active layers forming electronic circuits.
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公开(公告)号:US20220199606A1
公开(公告)日:2022-06-23
申请号:US17690952
申请日:2022-03-09
Inventor: John A. ROGERS , Ralph NUZZO , Matthew MEITL , Etienne MENARD , Alfred BACA , Michael MOTALA , Jong-Hyun AHN , Sang-Il PARK , Chang-Jae YU , Heung Cho KO , Mark STOYKOVICH , Jongseung YOON
IPC: H01L25/00 , H01L27/12 , H01L21/00 , H01L31/0725 , H01L31/18 , H01S5/42 , H01L25/075 , H01L31/054 , H01L33/58 , H01L33/00 , H01S5/02251 , H01L31/0525 , H01L25/16 , H01L33/54 , H01L33/56 , H01L25/04 , H01L31/043 , H01L31/0216 , H01L31/0232 , H01L31/0288 , H01L31/0693 , H01L31/167 , H01L33/06 , H01L33/30 , H01L33/48 , H01L33/62 , H01S5/02 , H01S5/343 , H01L27/146 , H01L31/02 , H01L31/0304 , H01L33/52 , H01S5/183 , H01S5/30
Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
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公开(公告)号:US20220149076A1
公开(公告)日:2022-05-12
申请号:US17478311
申请日:2021-09-17
Applicant: X-Celeprint Limited
Inventor: Joseph Carr , Ronald S. Cok
Abstract: A monolithic multi-FET transistor comprises an epitaxial layer disposed on a dielectric layer. The epitaxial layer comprises a crystalline semiconductor material and a multi-FET area. An isolation structure surrounds the multi-FET area and divides the multi-FET area into separate FET portions. A gate disposed on a gate dielectric extends over each FET portion. A source and a drain are each disposed on opposite sides of the gate on the epitaxial layer within each FET portion. Each gate, source, and drain comprise a separate electrical conductor and the gate, source, drain, and epitaxial layer within each FET portion form a field-effect transistor. Gate, source, and drain contacts electrically connect the gates, sources, and drains of the separate FET portions, respectively. At least the sources or drains of two neighboring FET portions are disposed in common over at least a portion of the isolation structure dividing the two neighboring FET portions.
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公开(公告)号:US20210339552A1
公开(公告)日:2021-11-04
申请号:US17067616
申请日:2020-10-09
Applicant: X-Celeprint Limited
Inventor: Ronald S. Cok , Robert R. Rotzoll
IPC: B42D25/305 , B42D25/29 , G06K19/07 , G06K19/077
Abstract: A hybrid document includes a flexible document having visible markings. One or more light-controlling elements and a controller are embedded in or on the flexible document. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. In some embodiments, the controller includes a memory and a value can be stored in the memory and displayed by the light-controlling element(s). In some embodiments, the value can be assigned or varied by a hybrid currency teller machine.
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公开(公告)号:US11139797B2
公开(公告)日:2021-10-05
申请号:US16226805
申请日:2018-12-20
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl , Ronald S. Cok
Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
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公开(公告)号:US11067643B2
公开(公告)日:2021-07-20
申请号:US15829223
申请日:2017-12-01
Applicant: MELEXIS TECHNOLOGIES NV , X-CELEPRINT LIMITED
Inventor: Christian Schott , Matthew Meitl , Christopher Bower
Abstract: A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit and comprises a fractured tether. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.
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公开(公告)号:US20210024349A1
公开(公告)日:2021-01-28
申请号:US17066421
申请日:2020-10-08
Applicant: X-Celeprint Limited
Inventor: Ronald S. Cok , Raja Fazan Gul , António José Marques Trindade
IPC: B81B7/00 , B81C1/00 , H01L41/053 , H01L41/23
Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
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公开(公告)号:US20200214141A1
公开(公告)日:2020-07-02
申请号:US16722935
申请日:2019-12-20
Applicant: X-Celeprint Limited
Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
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公开(公告)号:US10675905B2
公开(公告)日:2020-06-09
申请号:US16181294
申请日:2018-11-05
Applicant: X-Celeprint Limited
Inventor: Ronald S. Cok , Robert R. Rotzoll , Christopher Bower , Mark Willner
IPC: H01L33/00 , B42D25/305 , G07D11/16 , G07D11/24 , G07D11/30 , B42D25/30 , B42D25/485 , G07D7/12 , G07D7/01 , B42D25/29
Abstract: A hybrid currency banknote includes a banknote having visible markings. One or more light-controlling elements and a controller are embedded in or on the banknote. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. A value can be stored in a memory in the controller and displayed by the light-controlling elements. The value can be assigned or varied by a hybrid currency teller machine.
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公开(公告)号:US20200177149A1
公开(公告)日:2020-06-04
申请号:US16207774
申请日:2018-12-03
Applicant: X-Celeprint Limited
Inventor: António José Marques Trindade , Raja Fazan Gul , Robert R. Rotzoll , Alexandre Chikhaoui , David Gomez , Ronald S. Cok
Abstract: A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.
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