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公开(公告)号:US10537963B2
公开(公告)日:2020-01-21
申请号:US14575754
申请日:2014-12-18
Applicant: APPLE INC.
Inventor: Michael M. Li , Anthony J. Richter , Yulei Sun , Raul A. Molina
IPC: B23K26/00
Abstract: A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.
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公开(公告)号:US09600694B1
公开(公告)日:2017-03-21
申请号:US14705955
申请日:2015-05-06
Applicant: Apple Inc.
Inventor: Dale N. Memering , Michael M. Li
CPC classification number: G06K1/12 , B28D5/00 , G06K19/06046
Abstract: A manufacturing method for sapphire crystal material is disclosed, including a laser-etched bar code formed into the interior of the sapphire crystal material. The laser-etched bar code may be associated with one or more manufacturing parameters or other manufacturing data. The sapphire crystal may be used to create a cover sheet for use with a display screen of a portable electronic device.
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公开(公告)号:US20170079153A1
公开(公告)日:2017-03-16
申请号:US14850535
申请日:2015-09-10
Applicant: Apple Inc.
Inventor: Michael M. Li , Christopher R. Fagan , Anubhav Prasad
CPC classification number: C03C23/0025 , B01J19/121 , B01J2219/0879 , B01J2219/12 , B23K26/50 , B23K2103/54 , C01F7/021
Abstract: A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.
Abstract translation: 公开了一种彩色蓝宝石材料和使用激光着色蓝宝石材料的方法。 用于着色蓝宝石材料的方法可以包括将蓝宝石材料定位在不透明的衬底材料上,将不透明衬底材料暴露于穿过蓝宝石材料的激光束以冲击衬底材料,并且在蓝宝石的一部分中引起化学变化 暴露于激光束的材料。 该方法还可以包括由于化学变化而在蓝宝石材料的该部分中产生可见的颜色。 彩色蓝宝石材料可以包括第一透明部分和基本上被第一部分包围的第二着色部分。 第二着色部分可以具有不同于第一部分的化学成分。
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14.
公开(公告)号:US20170001266A1
公开(公告)日:2017-01-05
申请号:US14788897
申请日:2015-07-01
Applicant: Apple Inc.
Inventor: Michael M. Li , Palaniappan Chinnakaruppan , Yulei Sun , Phillip W. Hum , Marwan Rammah
IPC: B23K26/402 , B23K26/38
CPC classification number: B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/361 , B23K26/402 , B23K2103/52
Abstract: A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material.
Abstract translation: 使用基于激光的工艺来照射诸如蓝宝石的陶瓷材料以形成切割。 在一些实施方式中,可以加热与切割件相邻的陶瓷材料的区域。 可以移除该区域以形成边缘特征。 在各种实施方案中,与切割件相邻的陶瓷材料的区域可以使用诸如聚乙烯薄膜的屏蔽件与基于激光的工艺中使用的激光束的外部部分屏蔽。 这种去除和/或屏蔽操作可以提高陶瓷材料的机械强度。
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公开(公告)号:US11325860B2
公开(公告)日:2022-05-10
申请号:US16583204
申请日:2019-09-25
Applicant: Apple Inc.
Inventor: Michael M. Li , Christopher R. Fagan , Anubhav Prasad
Abstract: A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.
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公开(公告)号:US11192823B2
公开(公告)日:2021-12-07
申请号:US16564568
申请日:2019-09-09
Applicant: Apple Inc.
Inventor: Michael M. Li , Jairam Manjunathaiah , Palaniappan Chinnakaruppan
IPC: G06F1/16 , H05K5/00 , H05K5/03 , H04B1/03 , H04B1/08 , G02B1/11 , G02B5/02 , H04M1/02 , C03C23/00 , G02B1/12 , C03C21/00 , C03C15/00
Abstract: A laser-textured glass cover member suitable for use in an electronic device is disclosed. The laser-textured surface of the glass cover member may provide a smooth feel to an external surface of the electronic device without introducing a perceptible visual texture. Methods for making the laser-textured glass cover members are also disclosed.
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公开(公告)号:US10787753B2
公开(公告)日:2020-09-29
申请号:US15379316
申请日:2016-12-14
Applicant: Apple Inc.
Inventor: Michael M. Li , Henry B. Wettersten , Brian M. Gable , Dakota A. Bass
IPC: B23K26/00 , B23K26/361 , B23K26/70 , C25D11/02 , H05K5/02 , H05K5/04 , C25D11/16 , B23K26/362 , B23K26/352 , C25D11/24 , C25D11/04 , B23K103/10
Abstract: Anodized substrates having laser markings and methods for forming the same are described. According to some embodiments, the methods involve forming a feature on a substrate using a laser prior to anodizing. The laser energy and pulse width can be chosen so as to provide a particular topology to a surface of the substrate that, after anodizing, absorbs incoming light and imparts a dark appearance to the feature. In some cases, the methods involve forming a coarse oxide layer, which is removed prior to anodizing. Since the laser marking is performed prior to anodizing, the anodized substrates are free from laser-induced cracks, thereby making the anodized substrates more corrosion resistant than conventional laser-marked anodized substrates. The techniques are well suited for forming features on consumer products that may be exposed to water or other corrosion-inducing agents.
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公开(公告)号:US20200017408A1
公开(公告)日:2020-01-16
申请号:US16583204
申请日:2019-09-25
Applicant: Apple Inc.
Inventor: Michael M. Li , Christopher R. Fagan , Anubhav Prasad
Abstract: A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.
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公开(公告)号:US09844833B2
公开(公告)日:2017-12-19
申请号:US14168285
申请日:2014-01-30
Applicant: Apple Inc.
Inventor: Michael M. Li , Anthony J. Richter , Dale N. Memering
IPC: B23K26/00 , B23K26/12 , B23K26/38 , B23K26/142 , B23K26/402 , B23K103/16 , B23K103/00
CPC classification number: B23K26/125 , B23K26/142 , B23K26/38 , B23K26/402 , B23K2103/172 , B23K2103/50
Abstract: A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.
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公开(公告)号:US09787345B2
公开(公告)日:2017-10-10
申请号:US14230324
申请日:2014-03-31
Applicant: Apple Inc.
Inventor: Logan M. Ames , Michael M. Li
IPC: B23K26/21 , B23K26/24 , B23K26/32 , B23K103/18 , B32B3/24 , B32B7/02 , B32B7/04 , B32B3/02 , B32B37/06 , B32B38/00 , H04B1/3888 , H04M1/725 , H05K5/00 , B23K26/00 , B32B37/14 , B32B37/18 , B32B37/12 , B23K26/57 , B23K26/10 , B23K26/26 , B23K26/40 , H05K5/03 , B29C65/16 , B29C65/00 , B32B3/26 , B23K26/60 , B23K103/00 , B23K103/08 , B23K26/324 , B23K101/36 , B32B7/00 , H04M1/02 , G06F1/16 , B29L31/34 , H05K5/06 , H05K5/04
CPC classification number: H04B1/3888 , B23K26/10 , B23K26/26 , B23K26/32 , B23K26/324 , B23K26/40 , B23K26/57 , B23K26/60 , B23K2101/36 , B23K2103/08 , B23K2103/18 , B23K2103/42 , B23K2103/50 , B23K2103/52 , B23K2103/54 , B29C65/16 , B29C65/1629 , B29C65/1638 , B29C65/1654 , B29C66/02 , B29C66/114 , B29C66/1142 , B29C66/1162 , B29C66/242 , B29C66/24221 , B29C66/303 , B29C66/30325 , B29C66/70 , B29C66/72 , B29C66/73116 , B29C66/73361 , B29C66/73365 , B29L2031/3481 , B32B3/02 , B32B3/266 , B32B7/005 , B32B7/02 , B32B7/04 , B32B7/045 , B32B37/06 , B32B37/12 , B32B37/142 , B32B37/18 , B32B38/0008 , B32B2307/412 , B32B2310/0843 , B32B2457/00 , B32B2457/20 , C04B2237/76 , C04B2237/78 , G06F1/1626 , G06F1/1637 , H04M1/0249 , H04M1/026 , H04M1/0264 , H04M1/0266 , H04M1/72519 , H05K5/0004 , H05K5/03 , H05K5/04 , H05K5/066 , Y10T428/13 , Y10T428/24322 , Y10T428/24331 , Y10T428/24339 , Y10T428/24488 , Y10T428/24521 , Y10T428/24777
Abstract: Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.
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