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公开(公告)号：US11300887B2
公开(公告)日：2022-04-12
申请号：US16463057
申请日：2017-11-06
Applicant: ASML NETHERLANDS B.V.
Inventor： Richard Johannes Franciscus Van Haren , Victor Emanuel Calado , Leon Paul Van Dijk , Roy Werkman , Everhardus Cornelis Mos , Jochem Sebastiaan Wildenberg , Marinus Jochemsen , Bijoy Rajasekharan , Erik Jensen , Adam Jan Urbanczyk
IPC: G03F7/20
Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.
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公开(公告)号：US11106141B2
公开(公告)日：2021-08-31
申请号：US16495119
申请日：2018-03-28
Applicant: ASML NETHERLANDS B.V.
Inventor： Jochem Sebastiaan Wildenberg , Marinus Jochemsen , Erik Jensen , Erik Johannes Maria Wallerbos , Cornelis Johannes Rijnierse , Bijoy Rajasekharan , Roy Werkman , Jurgen Johannes Henderikus Maria Schoonus
IPC: G03F7/20
Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.
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13.发明申请公开(公告)号：US20180253015A1
公开(公告)日：2018-09-06
申请号：US15915674
申请日：2018-03-08
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
CPC classification number: G03F7/70616 , G03F7/70508 , G03F7/70525 , G03F7/70625 , G03F7/70633 , G03F7/70641 , G03F9/7092 , G06F17/30572
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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14.发明授权公开(公告)号：US11940740B2
公开(公告)日：2024-03-26
申请号：US17836099
申请日：2022-06-09
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
CPC classification number: G03F7/706837 , G03F7/70525 , G03F7/70616 , G03F9/7092 , G06F16/26
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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公开(公告)号：US11681231B2
公开(公告)日：2023-06-20
申请号：US17686586
申请日：2022-03-04
Applicant: ASML NETHERLANDS B.V.
CPC classification number: G03F7/705 , G03F7/70616 , G03F7/70641 , G03F9/7026 , G03F9/7046 , G03F9/7076 , G03F9/7084
Abstract: A method for selecting an optimal set of locations for a measurement or feature on a substrate, the method includes: defining a first candidate solution of locations, defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution, and selecting the first and/or second candidate solution as the optimal solution according to a constraint associated with the substrate.
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Patent Agency Ranking
16.发明授权公开(公告)号：US11435673B2
公开(公告)日：2022-09-06
申请号：US17440251
申请日：2020-03-19
Applicant: ASML NETHERLANDS B.V.
Inventor： Kevin Van De Ruit , Roy Werkman , Jochem Sebastiaan Wildenberg
Abstract: A method of determining a set of metrology point locations, the set including a subset of potential metrology point locations on a substrate, the method including: determining a relation between noise distributions associated with a plurality of the potential metrology point locations using existing knowledge; and using the determined relation and a model associated with the substrate to determine the set.
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公开(公告)号：US11294289B2
公开(公告)日：2022-04-05
申请号：US16339884
申请日：2017-09-21
Applicant: ASML NETHERLANDS B.V.
Abstract: A method for selecting an optimal set of locations for a measurement or feature on a substrate, the method includes: defining a first candidate solution of locations, defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution, and selecting the first and/or second candidate solution as the optimal solution according to a constraint associated with the substrate.
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公开(公告)号：US11170072B2
公开(公告)日：2021-11-09
申请号：US15558186
申请日：2016-03-25
Applicant: ASML Netherlands B.V.
Inventor： Everhardus Cornelis Mos , Velislava Ignatova , Erik Jensen , Michael Kubis , Hubertus Johannes Gertrudus Simons , Peter Ten Berge , Erik Johannes Maria Wallerbos , Jochem Sebastiaan Wildenberg
Abstract: A method including evaluating, with respect to a parameter representing remaining uncertainty of a mathematical model fitting measured data, one or more mathematical models for fitting measured data and one or more measurement sampling schemes for measuring data, against measurement data across a substrate, and identifying one or more mathematical models and/or one or more measurement sampling schemes, for which the parameter crosses a threshold.
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公开(公告)号：US10928737B2
公开(公告)日：2021-02-23
申请号：US16079404
申请日：2017-02-22
Applicant: ASML NETHERLANDS B.V.
Inventor： Everhardus Cornelis Mos , Jochem Sebastiaan Wildenberg , Roy Werkman , Erik Johannes Maria Wallerbos
IPC: G03F7/20
Abstract: A method of characterizing distortions in a lithographic process, and associated apparatuses. The method includes obtaining measurement data corresponding to a plurality of measurement locations on a substrate, the measurement data comprising measurements performed on a plurality of substrates, and comprising one or more measurements performed on one or more of the substrates for each of the measurement locations. For each of the measurement locations, a first quality value representing a quality metric and a noise value representing a noise metric is determined from the measurements performed at that measurement location. A plurality of distortion parameters is determined, each distortion parameter configured to characterize a systematic distortion in the quality metric and a statistical significance of the distortion parameters from the first quality value and from the noise value is determined. Systematic distortion is parameterized from the distortion parameters determined to be statistically significant.
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公开(公告)号：US20210003927A1
公开(公告)日：2021-01-07
申请号：US17023474
申请日：2020-09-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Davit Harutyunyan , Fei Jia , Frank Staals , Fuming Wang , Hugo Thomas Looijestijn , Cornelis Johannes Rijnierse , Maxim Pisarenco , Roy Werkman , Thomas Theeuwes , Tom Van Hemert , Vahid Bastani , Jochem Sebastiaan Wildenberg , Everhardus Cornelis Mos , Erik Johannes Maria Wallerbos
Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
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