Metrology Method and Apparatus, and Device Manufacturing Method
    12.
    发明申请
    Metrology Method and Apparatus, and Device Manufacturing Method 有权
    计量方法与装置及装置制造方法

    公开(公告)号:US20130100427A1

    公开(公告)日:2013-04-25

    申请号:US13628697

    申请日:2012-09-27

    Abstract: An approach is used to estimate and correct the overlay variation as function of offset for each measurement. A target formed on a substrate includes periodic gratings. The substrate is illuminated with a circular spot on the substrate with a size larger than each grating. Radiation scattered by each grating is detected in a dark-field scatterometer to obtain measurement signals. The measurement signals are used to calculate overlay. The dependence (slope) of the overlay as a function of position in the illumination spot is determined. An estimated value of the overlay at a nominal position such as the illumination spot's center can be calculated, correcting for variation in the overlay as a function of the target's position in the illumination spot. This compensates for the effect of the position error in the wafer stage movement, and the resulting non-centered position of the target in the illumination spot.

    Abstract translation: 一种方法用于估计和校正覆盖变化作为每个测量的偏移函数。 形成在衬底上的靶包括周期性光栅。 在衬底上用圆形点照射衬底,其尺寸大于每个光栅。 在暗场散射仪中检测由每个光栅散射的辐射,以获得测量信号。 测量信号用于计算叠加。 确定覆盖层与照明点中位置的函数关系(斜率)。 可以计算在诸如照明点中心的标称位置处的覆盖物的估计值,以根据目标在照明点中的位置的函数来校正覆盖物的变化。 这补偿了晶片台移动中的位置误差的影响,以及目标在照明点中产生的非居中位置。

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