Inspection Apparatus, Inspection Method And Manufacturing Method
    12.
    发明申请
    Inspection Apparatus, Inspection Method And Manufacturing Method 有权
    检验仪器,检验方法及制造方法

    公开(公告)号:US20160061750A1

    公开(公告)日:2016-03-03

    申请号:US14838268

    申请日:2015-08-27

    Abstract: Metrology targets are formed on a substrate (W) by a lithographic process. A target (T) comprising one or more grating structures is illuminated with spatially coherent radiation under different conditions. Radiation (650) diffracted by from said target area interferes with reference radiation (652) interferes with to form an interference pattern at an image detector (623). One or more images of said interference pattern are captured. From the captured image(s) and from knowledge of the reference radiation a complex field of the collected scattered radiation at the detector. A synthetic radiometric image (814) of radiation diffracted by each grating is calculated from the complex field. From the synthetic radiometric images (814, 814′) of opposite portions of a diffractions spectrum of the grating, a measure of asymmetry in the grating is obtained. Using suitable targets, overlay and other performance parameters of the lithographic process can be calculated from the measured asymmetry.

    Abstract translation: 通过光刻工艺在基板(W)上形成计量目标。 包括一个或多个光栅结构的靶(T)在不同条件下被空间相干辐射照射。 从参考辐射(652)干涉的所述目标区域衍射的辐射(650)干扰以在图像检测器(623)处形成干涉图案。 捕获所述干涉图案的一个或多个图像。 从捕获的图像和参考辐射的知识中,在检测器处收集的散射辐射的复杂场。 从复场计算由每个光栅衍射的辐射的合成辐射图像(814)。 从光栅的衍射光谱的相对部分的合成辐射图像(814,814')获得光栅中的不对称度。 使用合适的目标,可以从测量的不对称性计算光刻过程的覆盖层和其他性能参数。

    Metrology Sensor, Lithographic Apparatus and Method for Manufacturing Devices

    公开(公告)号:US20200103772A1

    公开(公告)日:2020-04-02

    申请号:US16611500

    申请日:2018-03-06

    Abstract: Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarization state and an optical collection system configured to collect scattered radiation, following scattering of the illumination radiation by the metrology mark. The metrology mark comprises a main structure and changes, relative to the first polarization state, at least one of a polarization state of a first portion of the scattered radiation predominately resultant from scattering by the main structure and a polarization state of a second portion of radiation predominately resultant from scattering by one or more features other than the main structure, such that the polarization state of the first portion of the scattered radiation is different to the polarization state of the second portion of the scattered radiation. The metrology sensor apparatus further comprises an optical filtering system which filters out the second portion of the scattered radiation based on its polarization state.

    POSITION SENSOR, LITHOGRAPHIC APPARATUS AND METHOD FOR MANUFACTURING DEVICES

    公开(公告)号:US20190212658A1

    公开(公告)日:2019-07-11

    申请号:US16325471

    申请日:2017-06-30

    Abstract: An alignment sensor for a lithographic apparatus has an optical system configured to deliver, collect and process radiation selectively in a first waveband (e.g. 500-900 nm) and/or in a second waveband (e.g. 1500-2500 nm). The radiation of the first and second wavebands share a common optical path in at least some portion of the optical system, while the radiation of the first waveband is processed by a first processing sub-system and the radiation of the second waveband is processed by a second processing sub-system. The processing subsystems in one example include self-referencing interferometers. The radiation of the second waveband allows marks to be measured through an opaque layer. Optical coatings and other components of each processing sub-system can be tailored to the respective waveband, without completely duplicating the optical system.

    Metrology in Lithographic Processes
    17.
    发明申请

    公开(公告)号:US20190079413A1

    公开(公告)日:2019-03-14

    申请号:US16106322

    申请日:2018-08-21

    Abstract: An apparatus and method for estimating a parameter of a lithographic process and an apparatus and method for determining a relationship between a measure of quality of an estimate of a parameter of a lithographic process are provided. In the apparatus for estimating the parameter a processor is configured to determine a quality of the estimate of the parameter relating to the tested substrate based on a measure of feature asymmetry in the at least first features of the tested substrate and further based on a relationship determined for a plurality of corresponding at least first features of at least one further substrate representative of the tested substrate, the relationship being between a measure of quality of an estimate of the parameter relating to the at least one further substrate and a measure of feature asymmetry in the corresponding first features.

Patent Agency Ranking