公开(公告)号：US20200211863A1

公开(公告)日：2020-07-02

申请号：US16813364

申请日：2020-03-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Xu LU ,  Tang-Yuan CHEN ,  Jin-Yuan LAI ,  Tse-Chuan CHOU ,  Meng-Kai SHIH ,  Shin-Luh TARNG

IPC: H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L23/13

Abstract: The present disclosure relates to a semiconductor device package including a substrate, a semiconductor device and an underfill. The substrate has a first surface and a second surface angled with respect to the first surface. The semiconductor device is mounted on the first surface of the substrate and has a first surface facing the first surface of the substrate and a second surface angled with respect to the first surface of the substrate. The underfill is disposed between the first surface of the semiconductor device and the first surface of the substrate. The second surface of the substrate is located in the substrate and external to a vertical projection of the semiconductor device on the first surface of the substrate. A distance between the second surface of the substrate and an extension of the second surface of the semiconductor device on the first surface of the substrate is less than or equal to twice a distance between the first surface of the semiconductor device and the first surface of the substrate. The second surface of the substrate extends along at least three sides of the semiconductor device.

公开(公告)号：US20200098605A1

公开(公告)日：2020-03-26

申请号：US16138938

申请日：2018-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun Hung TSAI ,  Hsuan Yu CHEN ,  Ian HU ,  Meng-Kai SHIH ,  Shin-Luh TARNG

IPC: H01L21/67 ,  G01N21/95 ,  G01N21/956 ,  G01B11/25 ,  G06T7/00

Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.

公开(公告)号：US20130122216A1

公开(公告)日：2013-05-16

申请号：US13734621

申请日：2013-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shin-Luh TARNG ,  Teck-Chong LEE

IPC: H05K3/00

CPC classification number: H05K3/0094 ,  B32B3/08 ,  B32B3/266 ,  B32B3/30 ,  B32B5/02 ,  B32B5/22 ,  B32B5/26 ,  B32B17/04 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/281 ,  B32B27/38 ,  B32B2255/00 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2307/718 ,  B32B2457/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/426 ,  H05K2201/0195 ,  H05K2201/029 ,  Y10T428/269

Abstract: A method of manufacturing an embedded-trace substrate is provided. First, a core plate is provided. Next, a through hole and a plurality of trenches are formed on the core plate, wherein the through hole passes through the core plate, and the trenches are formed on the upper and the lower surfaces of the core plate. Then, the core plate is subjected to one-plating step for electroplating a conductive material in the through hole and the trenches at the same time. Afterwards, the excess conductive material is removed.

Abstract translation: 提供一种制造嵌入式迹线衬底的方法。 首先，提供芯板。 接下来，在芯板上形成通孔和多个沟槽，其中通孔穿过芯板，并且沟槽形成在芯板的上表面和下表面上。 然后，对芯板进行一次镀步骤，同时对通孔和沟槽中的导电材料进行电镀。 之后，除去过量的导电材料。