公开(公告)号：US08878347B2

公开(公告)日：2014-11-04

申请号：US14117165

申请日：2011-05-16

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/33 ,  H01L24/45 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。

公开(公告)号：US08810026B2

公开(公告)日：2014-08-19

申请号：US13819221

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/29099 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

摘要翻译： 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。

公开(公告)号：US20130154084A1

公开(公告)日：2013-06-20

申请号：US13819209

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/40

CPC分类号： H01L23/40 ,  G01N29/07 ,  G01N2291/044 ,  G01N2291/2697 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49548 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

摘要翻译： 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。

公开(公告)号：US20090111672A1

公开(公告)日：2009-04-30

申请号：US12255766

申请日：2008-10-22

申请人： Hideki Takahashi ,  Masaya Kaji ,  Yumiko Inomata ,  Ayumi Ikegaya ,  Takumasa Isobe

发明人： Hideki Takahashi ,  Masaya Kaji ,  Yumiko Inomata ,  Ayumi Ikegaya ,  Takumasa Isobe

IPC分类号： B31B49/00

CPC分类号： H04N1/4446 ,  H04N1/00602 ,  H04N1/00639 ,  H04N1/4453

摘要： A fold processing device includes a setter that sets an area desired to be visible or an area desired to be hidden from outside in a state in which a paper sheet has been folded, a determining unit that determines folding conditions on the basis of a result of setting by the setter, and an executer that executes folding in accordance with the folding conditions determined by the determining unit.

摘要翻译： 折叠处理装置包括：设置器，其在期望可见的区域或在折叠纸张的状态下期望隐藏的区域;确定单元，其基于结果，确定折叠条件 由设定器设置，以及根据由确定单元确定的折叠条件执行折叠的执行器。