公开(公告)号：US20140197525A1

公开(公告)日：2014-07-17

申请号：US14117165

申请日：2011-05-16

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/33 ,  H01L24/45 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。

公开(公告)号：US09331001B2

公开(公告)日：2016-05-03

申请号：US13819209

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/40 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H01L23/495 ,  H01L25/07 ,  H01L23/00

CPC分类号： H01L23/40 ,  G01N29/07 ,  G01N2291/044 ,  G01N2291/2697 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49548 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

摘要翻译： 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。

公开(公告)号：US20130154081A1

公开(公告)日：2013-06-20

申请号：US13819221

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/29099 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

摘要翻译： 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。

公开(公告)号：US08878347B2

公开(公告)日：2014-11-04

申请号：US14117165

申请日：2011-05-16

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/33 ,  H01L24/45 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。

公开(公告)号：US08810026B2

公开(公告)日：2014-08-19

申请号：US13819221

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/29099 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

摘要翻译： 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。

公开(公告)号：US20130154084A1

公开(公告)日：2013-06-20

申请号：US13819209

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/40

CPC分类号： H01L23/40 ,  G01N29/07 ,  G01N2291/044 ,  G01N2291/2697 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49548 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

摘要翻译： 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。

公开(公告)号：US09059145B2

公开(公告)日：2015-06-16

申请号：US13590707

申请日：2012-08-21

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H05K7/20 ,  H01L23/433 ,  H01L23/051 ,  H01L25/07 ,  H01L23/473 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/051 ,  H01L23/3107 ,  H01L25/071 ,  H01L2224/33 ,  H01L2924/0002 ,  H01L2924/181 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.

摘要翻译： 公开了一种功率模块，其包括半导体元件，第一冷却构件和被配置为将半导体元件夹在其间的第二冷却构件，构造成将半导体元件支撑在第一冷却构件和第二冷却构件之间的框架构件和模制树脂 设置在第一冷却构件和第二冷却构件之间，其中框架构件包括调节构件，其调节第一冷却构件和第二冷却构件之间的距离。

公开(公告)号：US20140193131A1

公开(公告)日：2014-07-10

申请号：US14235880

申请日：2012-07-27

申请人： Yoshikazu Suzuki

发明人： Yoshikazu Suzuki

IPC分类号： H04N5/765 ,  H04N5/04

CPC分类号： H04N5/765 ,  G11B20/10009 ,  G11B20/10222 ,  H04N5/04 ,  H04N5/76 ,  H04N21/4307 ,  H04N21/4325 ,  H04N21/43632

摘要： [Problem] In a system for transmitting content data from a content reproducing apparatus to a content output apparatus, no complicated signal processing is required, setting change operations can be simplified, and the degradation of sound quality and the degradation of picture quality of video data are prevented. [Solution] There are included: a content reproducing apparatus that receives an operation clock signal from a content output apparatus via an operation clock transmission cable, operates on the basis of the operation clock signal, and transmits content data, which has been reproduced by a reproducing unit, to the content output apparatus via a multimedia transmission cable; and the content output apparatus that generates, on the basis of an output apparatus operation clock signal, the operation clock signal to be transmitted to the content reproducing apparatus, transmits the operation clock signal to the content reproducing apparatus reproducing apparatus via the operation clock transmission cable, receives the content data from the content reproducing apparatus via the multimedia transmission cable, and performs a signal processing of the received content data for output to an external apparatus.

摘要翻译： 在从内容再现装置向内容输出装置发送内容数据的系统中，不需要复杂的信号处理，能够简化设定变更动作，声音质量下降，视频数据的图像质量下降 被阻止 [解决方案]包括：经由操作时钟传输电缆从内容输出装置接收操作时钟信号的内容再现装置，基于操作时钟信号进行操作，并发送已被 再现单元经由多媒体传输电缆连接到内容输出设备; 以及内容输出装置，其基于输出装置操作时钟信号生成要发送到内容再现装置的操作时钟信号，经由操作时钟传输电缆将操作时钟信号发送到内容再现装置再现装置 经由多媒体传输电缆从内容再现装置接收内容数据，并且对接收的内容数据执行信号处理以输出到外部设备。

公开(公告)号：US07361385B2

公开(公告)日：2008-04-22

申请号：US10289793

申请日：2002-11-07

申请人： Kazuhisa Kabeya ,  Kyohei Ishida ,  Munehiro Ishioka ,  Hideyuki Takahashi ,  Toshio Ishii ,  Yoichi Miyakawa ,  Akira Gamou ,  Yoshikazu Suzuki

发明人： Kazuhisa Kabeya ,  Kyohei Ishida ,  Munehiro Ishioka ,  Hideyuki Takahashi ,  Toshio Ishii ,  Yoichi Miyakawa ,  Akira Gamou ,  Yoshikazu Suzuki

IPC分类号： B05D1/18

CPC分类号： C23C2/24 ,  C23C2/003 ,  C23C2/40

摘要： The invention relates to a method for manufacturing a hot-dip plated metal strip comprising the steps of: introducing a metal strip into a molten metal bath of plating metal to adhere the molten metal onto the surface of the metal strip; taking out the metal strip, after turning the running direction of the metal strip, from the molten metal bath without applying external force from outside the surface of the metal strip; adjusting the plating weight of the molten metal adhered onto the metal strip; and controlling the shape of the metal strip using magnetic force in non-contact state directly before or after the step of adjusting the coating weight. The invention prevents adhesion of dross to the metal strip without degrading the productivity, and thus manufactures a high quality hot-dip plated metal strip.

摘要翻译： 本发明涉及一种用于制造热浸镀金属带的方法，包括以下步骤：将金属带引入电镀金属的熔融金属浴中以将熔融金属粘附到金属带的表面上; 在从金属条的表面外侧施加外力的情况下，从金属熔池中取出金属带，使金属条的行进方向转动; 调整附着在金属条上的熔融金属的电镀重量; 并且在调整涂层重量的步骤之前或之后直接在非接触状态下使用磁力控制金属带的形状。 本发明防止了浮渣对金属带的附着，而不降低生产率，因此制造了高品质的热镀金属条。

公开(公告)号：US07347699B2

公开(公告)日：2008-03-25

申请号：US11448781

申请日：2006-06-08

申请人： Kensaku Sato ,  Akira Shirai ,  Yoshikazu Suzuki ,  Hironao Hayashi ,  Akira Ishimaru ,  Tomokiyo Suzuki ,  Osamu Kuriyagawa ,  Iori Kobayashi ,  Kensuke Nakanishi

发明人： Kensaku Sato ,  Akira Shirai ,  Yoshikazu Suzuki ,  Hironao Hayashi ,  Akira Ishimaru ,  Tomokiyo Suzuki ,  Osamu Kuriyagawa ,  Iori Kobayashi ,  Kensuke Nakanishi

IPC分类号： H01R12/00

CPC分类号： H01R13/2428 ,  H01R12/52 ,  H01R13/432 ,  Y10S439/908

摘要： A contactor (20) has a joint portion (27) which is jointed to each contactor pad (32) of one wiring board (30) by using a solder at one end portion thereof and a connecting portion (24) which is dip-soldered in each through hole (35) of the other wiring board (33) at the other end portion thereof. A housing (1) is constituted by integrally molding a housing main body (1F) having a U-like shape as seen from a plane and a reinforcing bar portion (2) which connects intermediate portions of opposed parts (1A) and (1B) of the housing main body (1F) with each other. Cavities (3) are substantially linearly formed in the housing main body (1F) at predetermined intervals. The contactors (20) are inserted into cavities (3), and the contactors (20) are movably held in the housing (1) with a holding member.

摘要翻译： 接触器（20）具有接合部（27），该接合部通过在其一个端部使用焊料和连接部（24）而被接合到一个接线板（30）的一个接线板（32） 在另一个端部的另一个配线板（33）的每个通孔（35）中。 壳体（1）通过一体地模制从平面观察到具有U形形状的壳体主体（1F）和连接相对部分（1A）的中间部分（1A）和（ 1F）彼此连接。 腔室（3）以预定的间隔基本线性地形成在壳体主体（1F）中。 接触器（20）插入到空腔（3）中，并且接触器（20）用保持构件可移动地保持在壳体（1）中。