公开(公告)号：US20090111672A1

公开(公告)日：2009-04-30

申请号：US12255766

申请日：2008-10-22

申请人： Hideki Takahashi ,  Masaya Kaji ,  Yumiko Inomata ,  Ayumi Ikegaya ,  Takumasa Isobe

发明人： Hideki Takahashi ,  Masaya Kaji ,  Yumiko Inomata ,  Ayumi Ikegaya ,  Takumasa Isobe

IPC分类号： B31B49/00

CPC分类号： H04N1/4446 ,  H04N1/00602 ,  H04N1/00639 ,  H04N1/4453

摘要： A fold processing device includes a setter that sets an area desired to be visible or an area desired to be hidden from outside in a state in which a paper sheet has been folded, a determining unit that determines folding conditions on the basis of a result of setting by the setter, and an executer that executes folding in accordance with the folding conditions determined by the determining unit.

摘要翻译： 折叠处理装置包括：设置器，其在期望可见的区域或在折叠纸张的状态下期望隐藏的区域;确定单元，其基于结果，确定折叠条件 由设定器设置，以及根据由确定单元确定的折叠条件执行折叠的执行器。

公开(公告)号：US07725729B2

公开(公告)日：2010-05-25

申请号：US11041374

申请日：2005-01-25

申请人： Masaya Kaji ,  Naoharu Kido

发明人： Masaya Kaji ,  Naoharu Kido

IPC分类号： G06F21/00

CPC分类号： H04N1/00 ,  H04N1/00925 ,  H04N1/0097 ,  H04N2201/0094

摘要： The present invention provides an electronic device for performing a typical processing by storing a predetermined operating procedure and reproducing the stored operating procedure that controls suspending storing information related to an authentication, which includes a control unit, when an operation requiring a predetermined authentication is performed at the time when the predetermined operating procedure is stored.

摘要翻译： 本发明提供了一种电子设备，用于通过存储预定的操作过程来执行典型的处理，并且当需要预定认证的操作执行时，再现存储的操作过程，该操作过程控制与包括控制单元在内的认证相关的暂停存储信息 存储预定操作程序的时间。

公开(公告)号：US09111911B2

公开(公告)日：2015-08-18

申请号：US13434742

申请日：2012-03-29

申请人： Yoshikazu Niimi ,  Masatsugu Takarabe ,  Masaya Kaji ,  Takanori Kawashima

发明人： Yoshikazu Niimi ,  Masatsugu Takarabe ,  Masaya Kaji ,  Takanori Kawashima

IPC分类号： F28F7/00 ,  F28D15/00 ,  H01L23/473 ,  H05K7/20 ,  F28D21/00

CPC分类号： H01L23/473 ,  F28D2021/0029 ,  H01L2924/0002 ,  H05K7/20254 ,  H01L2924/00

摘要： A heat sink includes a flow path through which a cooling medium that cools a heat-producing body flows, the flow path having two flow path wall surfaces that face each other; and a plurality of columnar fins provided on one of the flow path wall surfaces, which is positioned at a side where the heat-producing body is provided, the plurality of columnar fins including a long columnar fin and a short columnar fin, and the other of the flow path wall surfaces having a recess in which a distal end portion of the long columnar fin is inserted.

摘要翻译： 散热器包括冷却发热体的冷却介质流过的流路，流路具有彼此相对的两个流路壁面; 以及多个柱状翅片，其设置在所述流路壁面的位于所述发热体的一侧的所述一个流路壁面上，所述多个柱状翅片包括长柱状翅片和短柱状翅片，另一个 的流路壁面具有插入长柱状翅片的前端部的凹部。

公开(公告)号：US20140197525A1

公开(公告)日：2014-07-17

申请号：US14117165

申请日：2011-05-16

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/33 ,  H01L24/45 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。

公开(公告)号：US09331001B2

公开(公告)日：2016-05-03

申请号：US13819209

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/40 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H01L23/495 ,  H01L25/07 ,  H01L23/00

CPC分类号： H01L23/40 ,  G01N29/07 ,  G01N2291/044 ,  G01N2291/2697 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49548 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

摘要翻译： 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。

公开(公告)号：US08762677B2

公开(公告)日：2014-06-24

申请号：US13236774

申请日：2011-09-20

申请人： Masaya Kaji ,  Akihito Toyoda ,  Takashi Aoki

发明人： Masaya Kaji ,  Akihito Toyoda ,  Takashi Aoki

IPC分类号： G06F12/00

CPC分类号： G06F3/1285 ,  G06F3/1203 ,  G06F3/1231 ,  G06F3/1291

摘要： An information processing system includes: a storage device storing information including settings information configured to an information processing apparatus, attribute management information indicating whether each settings information item is limited information with an update limit to the settings information or non-limited information without an update limit to the settings information, and apparatus specification information for specifying the information processing apparatus; and an information processing apparatus including an input unit reading information from the storage device when the storage device is connected, a determining unit comparing the apparatus specification information read by the input unit with the apparatus specification information for specifying the information processing apparatus stored in a storage unit and determines whether the apparatus settings information read by the input unit is identical to the apparatus settings information of the information processing apparatus, and an update unit updating the settings information.

摘要翻译： 一种信息处理系统，包括：存储装置，存储包括被配置为信息处理装置的设置信息的信息，指示每个设置信息项是否是具有对设置信息的更新限制的限制信息的属性管理信息或没有更新限制的非限制信息 设定信息以及用于指定信息处理装置的装置指定信息; 以及信息处理设备，包括当连接存储设备时从存储设备读取信息的输入单元，将由输入单元读取的设备指定信息与用于指定存储在存储器中的信息处理设备的设备指定信息进行比较的确定单元 并且确定由输入单元读取的设备设置信息是否与信息处理设备的设备设置信息相同，更新单元更新设置信息。

公开(公告)号：US08745757B2

公开(公告)日：2014-06-03

申请号：US12622041

申请日：2009-11-19

申请人： Masaya Kaji ,  Naoharu Kido

发明人： Masaya Kaji ,  Naoharu Kido

IPC分类号： G06F21/00

CPC分类号： H04N1/00 ,  H04N1/00925 ,  H04N1/0097 ,  H04N2201/0094

摘要： The present invention provides an electronic device for performing a typical processing by storing a predetermined operating procedure and reproducing the stored operating procedure that controls suspending storing information related to an authentication, which includes a control unit, when an operation requiring a predetermined authentication is performed at the time when the predetermined operating procedure is stored.

摘要翻译： 本发明提供了一种电子设备，用于通过存储预定的操作过程来执行典型的处理，并且当需要预定认证的操作执行时，再现存储的操作过程，该操作过程控制与包括控制单元在内的认证相关的暂停存储信息 存储预定操作程序的时间。

公开(公告)号：US20130154081A1

公开(公告)日：2013-06-20

申请号：US13819221

申请日：2010-09-02

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/29099 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

摘要翻译： 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。

公开(公告)号：US20050190657A1

公开(公告)日：2005-09-01

申请号：US11041374

申请日：2005-01-25

申请人： Masaya Kaji ,  Naoharu Kido

发明人： Masaya Kaji ,  Naoharu Kido

IPC分类号： B41J3/44 ,  B41J29/38 ,  G06F3/12 ,  G11B11/00 ,  H04N1/00

CPC分类号： H04N1/00 ,  H04N1/00925 ,  H04N1/0097 ,  H04N2201/0094

摘要： The present invention provides an electronic device for performing a typical processing by storing a predetermined operating procedure and reproducing the stored operating procedure that controls suspending storing information related to an authentication, which includes a control unit, when an operation requiring a predetermined authentication is performed at the time when the predetermined operating procedure is stored.

摘要翻译： 本发明提供了一种电子设备，用于通过存储预定的操作过程来执行典型的处理，并且当需要预定认证的操作执行时，再现存储的操作过程，该操作过程控制与包括控制单元在内的认证相关的暂停存储信息 存储预定操作程序的时间。

公开(公告)号：US08878347B2

公开(公告)日：2014-11-04

申请号：US14117165

申请日：2011-05-16

申请人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

发明人： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Takanori Kawashima

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/33 ,  H01L24/45 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。