公开(公告)号：US3932585A

公开(公告)日：1976-01-13

申请号：US394680

申请日：1973-09-06

申请人： Sanseki Moriguchi ,  Hiroshi Abe ,  Kiyoshi Saito ,  Makoto Miyazawa

发明人： Sanseki Moriguchi ,  Hiroshi Abe ,  Kiyoshi Saito ,  Makoto Miyazawa

IPC分类号： A44B19/40 ,  B01D53/56 ,  B01D53/77 ,  B01J27/00 ,  C01C3/00

CPC分类号： A44B19/403 ,  B01D53/56

摘要： A method of removing a nitrogen oxide from an exhaust containing the same which comprises preparing an absorbent solution by adding divalent copper ions alone or a mixture of the divalent copper ions and divalent manganese ions to an acid aqueous solution containing sulfites or acid sulfites of ammonium, alkaline metals, or alkaline earth metals or a mixture of two or more of these compounds; and introducing the plant exhaust into the absorbent solution to carry out reaction between the sulfite radical of the absorbent solution and the nitrogen oxides contained in the exhaust to reduce the nitrogen oxides to nitrogen gas.

摘要翻译： 从含有该氧化物的废气中除去氮氧化物的方法包括通过将二价铜离子单独加入或二价铜离子和二价锰离子的混合物制备成含有亚硫酸盐或酸式亚硫酸铵的酸性水溶液来制备吸收剂溶液， 碱金属或碱土金属或两种或多种这些化合物的混合物; 并将工厂废气引入吸收剂溶液中以进行吸收剂溶液的亚硫酸根与废气中所含的氮氧化物之间的反应，将氮氧化物还原为氮气。

公开(公告)号：US07998794B2

公开(公告)日：2011-08-16

申请号：US12539939

申请日：2009-08-12

申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

IPC分类号： H01L21/00

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

公开(公告)号：US07038146B2

公开(公告)日：2006-05-02

申请号：US10488947

申请日：2003-07-23

申请人： Kiyoshi Saito ,  Shusaku Kawasaki ,  Shigehiro Yoshiuchi ,  Tsuyoshi Tanaka

发明人： Kiyoshi Saito ,  Shusaku Kawasaki ,  Shigehiro Yoshiuchi ,  Tsuyoshi Tanaka

IPC分类号： B60R21/16 ,  G01G21/00

CPC分类号： G01G19/4142 ,  B60N2/002 ,  B60R21/01516 ,  F16B5/025 ,  Y10S177/09

摘要： According to a fixing device of the present invention, a screw penetrates through a first fixing hole of a first fixing section and a second fixing hole of a second fixing section to be coupled with a weight measuring machine, and is tightened with a nut, so that the first fixing section is fixed to the second fixing section. In addition, at least one clearance of the first fixing hole and the second fixing hole is configured to be bigger than an assembly tolerance of the two fixing holes. Using this structure, the fixing device, which can accommodate constructive variations of the fixing section of the weight measuring machine and maintain excellent detecting accuracy, and a weight measuring apparatus using the same, can be provided.

摘要翻译： 根据本发明的固定装置，螺钉穿过第一固定部分的第一固定孔和第二固定部分的第二固定孔以与重量测量机联接，并用螺母拧紧，因此 第一固定部固定到第二固定部。 此外，第一固定孔和第二固定孔的至少一个间隙被构造成大于两个固定孔的组装公差。 使用这种结构，可以提供能够适应重量测量机的固定部分的结构性变化并保持优异的检测精度的定影装置和使用其的重量测量装置。

公开(公告)号：US20050205196A1

公开(公告)日：2005-09-22

申请号：US10945921

申请日：2004-09-22

申请人： Ayumi Nozaki ,  Kiyoshi Saito ,  Akira Yamada ,  Shu Yamashita

发明人： Ayumi Nozaki ,  Kiyoshi Saito ,  Akira Yamada ,  Shu Yamashita

IPC分类号： C03B29/00 ,  C04B35/622 ,  H01L21/48 ,  H01L23/15 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L21/486 ,  H01L21/4857 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09909

摘要： A predetermined pattern of thick film, made of a material sintering-resistant at 1000° C. or lower, is screen printed on both surfaces of a green sheet to form constraint layers. The constraint layer has non-print regions in areas where via contacts are to be formed, where the constraint layer is removed in circles having a diameter of about 250 μm. Subsequently, via holes are formed in the green sheet and the contact holes are filled with a conductor paste by screen printing to form via contacts. Then a stack of such green sheets is pressed and integrated with a hydrostatic press device to obtain a green body. Next the green body is fired at lower temperature to obtain a low-temperature co-firable ceramic multilayer substrate.

摘要翻译： 在1000℃或更低温度下耐烧结材料制成的厚膜的预定图案丝网印刷在生片的两个表面上以形成约束层。 约束层在要形成通孔接触的区域中具有非印刷区域，其中限制层以具有约250μm的直径的圆去除。 随后，在生片中形成通孔，并通过丝网印刷填充导体膏以形成接触孔。 然后将一堆这样的生片按压并与静液压装置一体化以获得生坯。 接下来，将生坯在较低温度下焙烧以获得低温可共混陶瓷多层基材。

公开(公告)号：US5741887A

公开(公告)日：1998-04-21

申请号：US700592

申请日：1996-08-14

申请人： Ken-ichi Morita ,  Shigeru Otsuka ,  Kiyoshi Saito

发明人： Ken-ichi Morita ,  Shigeru Otsuka ,  Kiyoshi Saito

IPC分类号： C01B13/02 ,  C01B15/022 ,  C08G73/00 ,  C08G73/02

CPC分类号： C08G73/0266 ,  C01B13/0222 ,  C01B15/022

摘要： Agents containing polyaniline of one or more specified kinds shown by Formulas (1)-(4) given below can generate active oxygen efficiently and economically when contacted with a liquid having oxygen dissolved therein: ##STR1## where A is a negative ion, n is an integer between 2 and 5000, x and y are numbers such that x+y=1 and 0.ltoreq.y.ltoreq.0.5.

摘要翻译： 含有以下给出的式（1） - （4）所示的一种或多种特定种类的聚苯胺的试剂可以在与溶解有氧气的液体接触时有效且经济地产生活性氧：图像（1） 公式（3）式（4）其中A为负离子，n为2至5000之间的整数，x和y为x + y = 1的数字 和0

公开(公告)号：US5260542A

公开(公告)日：1993-11-09

申请号：US800262

申请日：1991-11-29

申请人： Kouji Ishiguro ,  Minoru Fujimoto ,  Kiyoshi Okumura ,  Kiyoshi Saito ,  Kouji Kuwabara ,  Makoto Yano ,  Hiroo Ohkawa

发明人： Kouji Ishiguro ,  Minoru Fujimoto ,  Kiyoshi Okumura ,  Kiyoshi Saito ,  Kouji Kuwabara ,  Makoto Yano ,  Hiroo Ohkawa

IPC分类号： B23K26/06 ,  B23K26/00

CPC分类号： B23K26/066

摘要： A laser marking apparatus comprises a pulse laser oscillator which emits a linearly polarized laser beam; a transmission type liquid crystal mask which displays a pattern to be marked on an article in one of a positive pattern display mode and a negative pattern display mode by dots arranged in a matrix form and which allows to pass the emitted laser beam but differentiates the polarization plane of the laser beam which has passed through masked portions from that through unmasked portions; a polarized beam splitter disposed downstream the transmission type liquid crystal mask for selectivity passing the laser beam to be irradiated on the article to be marked from the transmission type liquid crystal mask; a TV camera for detecting a discriminator indicating the thermal conductivity of the article to be marked; a recognition unit which determines the thermal conductivity of the article to be marked based upon the detected discriminator; and a control unit which controls the transmission type liquid crystal mask to operate in one of the positive pattern display mode and the negative pattern display mode based upon the determined thermal conductivity of the article to be marked in such a manner that when the determined thermal conductivity of the article to be marked is low, the positive pattern display mode is selected and when the determined thermal conductivity of the article to be marked is high, the negative pattern display mode is selected.

摘要翻译： 一种激光打标装置，包括：发射线偏振激光束的脉冲激光振荡器; 透射型液晶掩模，以正方形显示模式和负型图形显示模式中的一种以矩阵形式显示以商品形式标记的图案，并且允许通过发射的激光束，但是使偏振 通过未屏蔽部分穿过掩模部分的激光束的平面; 偏振光束分离器，其设置在透射型液晶掩模的下游，用于选择性地将待照射的激光束从透射型液晶掩模上传送到要标记的物品上; 用于检测指示要标记的物品的热导率的鉴别器的电视摄像机; 识别单元，其基于检测到的鉴别器确定待标记物品的导热性; 以及控制单元，其基于所确定的要标记的制品的热导率，控制透射型液晶掩模以正图案显示模式和负图案显示模式之一进行操作，使得当确定的热导率 要标记的物品低，选择正型显示模式，并且当待标记的物品的确定的热导率高时，选择负图案显示模式。

公开(公告)号：USD326236S

公开(公告)日：1992-05-19

申请号：US29466

申请日：1987-03-23

申请人： Kiyoshi Saito

设计人： Kiyoshi Saito

公开(公告)号：USD308489S

公开(公告)日：1990-06-12

申请号：US348652

申请日：1989-05-08

申请人： Kiyoshi Saito

设计人： Kiyoshi Saito

公开(公告)号：US4639476A

公开(公告)日：1987-01-27

申请号：US749251

申请日：1985-06-27

申请人： Kazuhiro Tajiri ,  Michio Kohmoto ,  Kiyoshi Saito ,  Hitoshi Takahira

发明人： Kazuhiro Tajiri ,  Michio Kohmoto ,  Kiyoshi Saito ,  Hitoshi Takahira

IPC分类号： C08K3/40 ,  C09D5/46 ,  C09D163/00

CPC分类号： C08K3/40 ,  C09D163/00 ,  C08K2201/016

摘要： An epoxy resin powder coating composition is described, comprising an epoxy resin and at least a hardener and a filler compounded thereto, wherein the filler is a mixture of from 30 to 180 parts by weight of a needle-like glass powder having an average length of at least 40 .mu.m and an aspect ratio of at least 4:1 and at least 30 parts by weight of a granular inorganic filler having an average particle diameter of 1.0 .mu.m or less, both being based on 100 parts by weight of the epoxy resin. This powder coating composition can provide a coating exhibiting excellent impact resistance not only at room temperature but also at lower temperatures, and further having good flexibility. A steel member with the coating of the present powder coating composition has a high practical value.

摘要翻译： 描述环氧树脂粉末涂料组合物，其包含环氧树脂和至少一种固化剂和与其混合的填料，其中填料为30至180重量份的平均长度为 至少40μm，纵横比至少为4:1，和至少30重量份平均粒径为1.0μm或更小的颗粒状无机填料，均基于100重量份的环氧树脂 树脂。 这种粉末涂料组合物可以提供不仅在室温下而且在较低温度下表现出优异的耐冲击性，并且还具有良好的柔韧性的涂层。 具有本发明粉末涂料组合物涂层的钢构件具有很高的实用价值。

公开(公告)号：US08648452B2

公开(公告)日：2014-02-11

申请号：US13176118

申请日：2011-07-05

申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。