公开(公告)号：US09743522B2

公开(公告)日：2017-08-22

申请号：US13627989

申请日：2012-09-26

Applicant: Apple Inc.

Inventor： Xingqun Li ,  Carlos Ribas ,  Dennis R. Pyper ,  James H. Foster ,  Joseph R. Fisher, Jr. ,  Scott P. Mullins ,  Sean A. Mayo ,  Wyeman Chen

IPC: H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/181 ,  H01L2224/16235 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4614 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  Y10T29/49146

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

公开(公告)号：US20170208690A1

公开(公告)日：2017-07-20

申请号：US15275369

申请日：2016-09-24

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Curtis C. Mead ,  Scott D. Morrison ,  Giancarlo F. De La Cruz ,  Lin Chen ,  Albert Wang ,  Brad W. Simeral ,  Vu Vo ,  Wyeman Chen

IPC: H05K1/18 ,  H05K1/11 ,  H01G4/30 ,  H01G4/228 ,  H01G4/38 ,  H01G4/005 ,  H01G2/06 ,  H05K3/30 ,  H01G4/40

Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.